Components | May 09, 2018
Kyocera enters into license agreement with Bosch
Kyocera Corporation has signed a license agreement with Robert Bosch Car Multimedia GmbH, a subsidiary of Robert Bosch GmbH, which provides Bosch with access to Kyocera’s haptic feedback technology for use in german company's automotive solutions.
Kyocera has been creating haptic technologies through its own research and development since 2008. Utilizing ergonomics and virtual reality technology that Kyocera has developed over the years as well as its proprietary haptic feedback technology, Kyocera’s HAPTIVITY technology contains a virtual reality innovation that enables real touch sensation on any human-machine interface.
Plessey invests in new equipment from Aixtron
Plessey has placed an order for its next reactor from AIXTRON SE. The AIX G5+ C metal...
UCT: Fire at Cinos plant in Korea
At approximately 1:30 pm September 19, 2018 local time, a fire occurred at a plant...
America II acquires Advanced MP Technology
America II – a portfolio company of Wynnchurch Capital – has acquired fellow distributor of electronic components, Advanced MP Technology, Inc.
Toshiba Memory and WDC opens new memory fab
Toshiba Memory Corporation and Western Digital have officially opened a new...
Osram’s gunning for the top spot of photonics
"Osram is very well positioned strategically and financially for the technologies and trends of the future. We are becoming the leading photonics champion," says Olaf Berlien, CEO of OSRAM Licht AG.
Tonbo Imaging to set up Lithuanian development centre
Tonbo Imaging, a developer of advanced imaging and sensor systems for defence, security...
Mouser and Marvell enter global distribution agreement
Mouser Electronics says that it has entered into a global distribution agreement with...
Adesto completes its acquisition of Echelon
Adesto Technologies, a provider of application-specific semiconductors and systems for...
Sponsored content by congatec AG
Credit card sized Computer-on-Modules, which form factor to choose?
With the availability of new low power x86 processors like the Intel® Atom® C3000 processors (code named Apollo Lake) and new small form factor Computer-on-Module specifications like SMARC 2.0 many engineers are...
paragon acquires 82 percent of SemVox
paragon is creating a new business division for digital assistance systems, the...
Nanoscribe opens subsidiary in Shanghai
With the opening of Nanoscribe China Co. Ltd., Nanoscribe strives to strengthen its sales...
Intel acquires NetSpeed Systems for chip design
Chip giant Intel is acquiring NetSpeed Systems, a San Jose, California-based provider of...
Fingerprint files lawsuit agains Chinese competitor
Fingerprints says that it has filed a complaint with the Beijing Intellectual Property Court...
It's official - Renesas to acquire IDT for $6.7 billion
The Japanese manufacturer is looking to grow with the acquisition of the analog...
Samsung chooses with IDT's wireless power solutions
Integrated Device Technology's wireless charging solutions have found its...
First commercial agreement for CSA - Catapult
The Compound Semiconductor Applications (CSA) Catapult has announced that it has secured...
Swissbit's kicks off the construction of its Berlin expansion
Construction has begun on Swissbit’s new R&D and manufacturing facility. All of the...
Mouser signs global distribution deal with Samtec
NPI Distributor, Mouser electronics, says it has entered into a global distribution...
Autotalks Launches the World's First Global V2X Solution
By adding C-V2X to its existing 2nd generation automotive qualified chipset, Autotalks is...
Renesas responds to acquisition rumors
Reports have been suggesting that Japanese semiconductor manufacturer Renesas is looking...
UMC and Avalanche partner for MRAM development
United Microelectronics Corporation, and Avalanche Technology, Inc., announces that they have entered a partnership for joint development and production of MRAM to replace embedded flash.
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