Business | March 26, 2018
Broadcom's shareholders approve move to US
Broadcom's shareholders voted overwhelmingly to approve the company's redomiciliation to the United States, with over 99% of the votes cast by the shareholders voting in favour.
The company currently anticipates that the move will be completed on April 4, 2018 after close of trading, subject to prior approval by the High Court of the Republic of Singapore.
Murata develops and starts volume production of SAW duplexers and...
Passive component manufacturer Murata accelerates production to...
Avnet enhances its IoT strategy by acquiring Witekio
Avnet announces that it has signed an agreement to acquire Witekio (formerly known as...
STMicro to supply SiC power electronics to Renault-Nissan-Mitsubishi
Semiconductor giant, STMicroelectronics, has been chosen to supply high-efficiency...
APC Technology courted by takeover offer
Specialist Components along with APC Technology Group, announces that the companies...
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ams is confident of successful acquisition of Osram
ams says that it expects to hold an extraordinary general meeting (EGM) around the end...
Electrolab broadens footprint in Texas
Electrolab, Inc. has completed construction of additional operating and research facilities...
Electro Rent announces global CEO and President
Electro Rent, a test equipment services player, has announced the appointment of Jay...
Qualcomm acquires remaining interest in TDK joint venture
Qualcomm Incorporated says that the company has completed the acquisition of the...
Infineon and Synopsys collaborate on AI
In order to support AI-driven solutions with its future automotive microcontrollers...
HTC appoints Yves Maitre as CEO
Appointment of former Orange EVP said to continue drive for VIVE Reality as Cher Wang...
UltraSoC opens engineering center in Poland
UltraSoC announces that the company has officially open its new development center, and...
Foresight inks deal with Chinese infrared camera manufacturer
Foresight Autonomous Holdings, a supplier of automotive vision systems, has signed a strategic...
Tsinghua Unigroup’s DRAM fab will have some hurdles to overcome
Tsinghua Unigroup’s DRAM fab is scheduled for completion in 2021 but technology remains...
HEICO Corporation subsidiary acquires TTT-Cubed
HEICO Corporation's dB Control subsidiary has acquired 100% of the stock of TTT-Cubed, Inc...
RFMW names business development manager RF Power
RFMW announces that Philip Knights has joined their organization as Business...
PCB Piezotronics to move production from China to the US
North Carolina based designer and manufacturer of high-precision sensors, PCB...
HCL Technologies to acquire Sankalp Semiconductor
HCL Technologies Limited is acquiring Sankalp Semiconductor (Sankalp), a...
SG Wireless teams up with Arrow Electronics
Hong Kong-based full stack Internet of Things (IoT) solutions provider, SG Wireless, says it...
DuPont to sell its compound semiconductor solutions business
DuPont Electronics & Imaging (E&I) says it has signed an agreement to sell its Compound...
BluGlass signs global joint development agreement with Bridgelux
The agreement is to develop cascade LEDs using BluGlass’ remote plasma chemical vapour...
CMOS image sensors stay on stairway to record revenues
Economic slowdown and U.S.-China trade war will not stop CMOS image sensors from...
Delphi team up with Cree for automotive SiC devices
Delphi Technologies and Creehave entered into a partnership to utilise silicon...
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