© ASM Products | November 01, 2017
Productronica 2017: ASM leads the way to the smart SMT factory
Under the motto "Check-In to the Smart Factory", technology leader ASM Assembly Systems will present innovative solutions for all areas of modern electronics production at the 2017 Productronica trade show.
This is a product release announcement by ASM Assemby Systems. The issuer is solely responsible for its content.
With the company’s "Quick Factory Check", visitors can compare the processes in their own plants with those in award-winning smart factories and identify the workflows that will have the greatest potential impact on costs, efficiency and quality. New products being rolled out include improved SIPLACE TX high-speed placement modules and SIPLACE placement heads, a new JEDEC tray feeder, and innovations like the ASM Production Planner, Offline Printer Programming, Onboard PCB Inspection, Touchless Placement, or SIPLACE Command Center. With the HERMES and ADAMOS initiatives, ASM also underscores its trailblazing role in open data integration and the Industrial Internet of Things (IIoT). ASM will also show for the first time a complete solution chain for advanced packaging that enables electronics manufacturers to enter an attractive growth market. As a supplement to its booth at the Munich Trade Fair Centre, ASM will show off additional process innovations in the SMT Center of Competence at its Munich headquarters. "Standalone solutions for machines and lines, setup preparation areas, warehousing and other central operations in electronics plant block the way to the smart SMT factory. That's why we decided to focus on eight core processes in electronics manufacturing at this year's Productronica: four line workflows – planning, virtual production, process optimization, and production – and four factory workflows – material management, preparation, factory monitoring, and factory integration," explains Gabriela Reckewerth, Senior Director Global Marketing. "Productronica visitors can run our "Quick Factory Check" to analyze the status of process integration in their own plants before taking guided tours and visiting expert stations to learn more about our broad spectrum of networked and integrated solutions that enable them to improve their processes and KPIs." More flexible SIPLACE TX and placement heads Even the smartest factory needs powerful equipment. That’s why the ASM booth will feature two SMT lines: one with SIPLACE TX placement modules for high-volume applications like mobile phones, computers or LEDs, and one with SIPLACE SX placement modules for high-mix applications with small lot sizes and frequent product changeovers. First-hand information: Customers demonstrate optimized core processes Smart, consistently optimized and heavily automated workflows provide the greatest efficiency benefits in modern electronics production. That’s why technology leader ASM provides visitors of its booth with a process-oriented look at its extensive portfolio of solutions and its many innovations. In eight core processes, ASM will demonstrate how the right combination of hardware of software can automate and improve processes. The focus will be on four line workflows (planning, virtual production, process optimization, and production run) and four factory workflows (material management, preparation, factory monitoring, and factory integration). As for another feature making it special, ASM's rolled out its "SMT Smart Network" last year, a global group of reference plants that work closely with ASM's experts to improve production processes and implement the smart SMT factory. Reference of these smart reference plants will be present at the ASM booth to convey first-hand information about their workflow solutions and their impact on their respective KPIs. Innovations for all processes For all eight workflows, ASM will present innovations that make users’ processes more effective and efficient. Two examples from workflow planning are the ASM Production Planner and Offline Printer Programming. With the ASM Production Planner, users can import jobs from their ERP and MES systems so that the setups can be scheduled and optimized across multiple lines with SiCluster MultiLine. With Offline Printer Programming, users can create printing programs offline and store them in a central database irrespective of specific lines and configurations. This reduces non-productive preparation time on the line as well as program selection errors. Before the programs are downloaded to the printer, the system checks automatically whether the printer's equipment and configuration are suitable for the respective job. Among other innovations being shown at the ASM booth are ASM Remote Smart Factory, a comprehensive and secure solution for remote support, Touchless Placement, a new process for placing highly sensitive components with a force of 0 N, and Onboard PCB Inspection, a feature that inspects PCBs for cleanliness and makes sure that solder pads were printed properly and previously placed components placed correctly before large components, BGAs and shields are placed. Open and ready for the future: Data integration with OIB, HERMES and ADAMOS With SIPLACE OIB as an open machine interface and HERMES as an open and modern data standard and SMEMA successor for non-proprietary communication between line components, ASM pursues a transparent data integration strategy on the shop floor. ASM will also provide information about its participation in the ADAMOS joint venture as well as its extensive activities in the IIoT (Industrial Internet of Things) field. ADAMOS AG was founded in cooperation with other major technology companies like DMG Mori, Software AG, Zeiss AG and Dürr AG to provide high-security cloud platforms and develop apps for industrial applications. The first results of these IIoT activities will be demonstrated at Productronica in the form of mobile apps for monitoring ASM machines. Advanced packaging: Complete solution chain for a new growth market At another station, ASM will provide information about advanced packaging, i.e. the assembly of chips into subsystems with combinations of bare dies, flip-chips and classic SMT components. ASM's experts expect many EMS companies to expand into this lucrative growth market over the coming months and years as it displaces the semiconductor industry’s classic wire-bonding in many areas. ASM will demonstrate solutions for the complete process chain at the Productronica, starting with extremely demanding printing and bumping processes with DEK printers and DEK E-Form stencils. At the heart of this process chain will be the extremely precise SIPLACE CA with its combined placement of bare dies and flip-chips directly from the wafer and SMT components from classic tapes. The placement process is followed by molding, singulation, testing and taping. With its ORCAS, Laser 1205 and SunBird machines, ASM Backend Solutions provides powerful and complementary equipment for these processes that has proven itself in many installations in the semiconductor industry. For more information about the Productronica program and the in-house events at ASM headquarters in Munich, visit us online at www.asm-smt.com/en/productronica2017.
Applied Materials and Besi to jointly develop chip integration technology Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Sourceability appoints new managing director for APAC Semiconductor veteran joins the management team of digital supply chain solutions provider.
POET and Sanan IC to form a joint venture company POET Technologies and Xiamen Sanan Integrated Circuit (Sanan IC), a wholly owned subsidiary of Sanan Optoelectronics, have signed a definitive joint venture contract.
From wafer sawing to the finished packaged component Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Sponsored content by JBCHigh Quality & efficient fume extraction is not only important to meet workplace regulations It's also important to ensure the safety and health of everyone. Soldering fumes and gases may be one of the main causes of potential health problems at any soldering workplace without a proper fume extraction. To protect all employees and their health, keep the following suggestions in mind!
Avnet Silica names Gilles Beltran as president Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
SkyWater is looking to lease a 200 mm fab in Florida Having just completed the expansion of its Minnesota facility, SkyWater does not seem to be done adding to its footprint. The company is looking to take over the Center for Neovation, a 200 mm semiconductor manufacturing facility.
Airbus Ventures invests in Singapore startup Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
SK hynix to acquire Intel NAND memory business The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
Sponsored content by NCAB Group BeneluxHow to design a high speed PCB! It wasn’t that long ago when the word “high speed” didn’t exist in the vocabulary of PCB designers. Thinking back for example at the 90’s and 00’s, the speeds they used were much slower. In 2005, 3 Gbps was considered the typical high speed data rate, but today engineers are dealing with 10 Gbps, or even 25 Gbps.
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
Wipro to acquire Eximius Design The information technology specialist says it has signed a definitive agreement to acquire Eximius Design, an engineering services company with strong expertise in semiconductor, software and systems design.
Cree to sell LED Business to SMART Global Holdings Cree says it has entered into a definitive agreement to sell its LED Products business unit (Cree LED) to SMART Global Holdings for up to USD 300 million.
Murata opens second factory in Wuxi Wuxi Murata Electronics Co., Ltd., a manufacturing subsidiary of Murata, has completed to construction of a new facility and officially opened the new plant on October 19.
Skeleton's next-gen high energy ultracapacitors to power Wrightbus’ hydrogen buses Skeleton Technologies is cooperating with Wrightbus, a bus OEM headquartered in Northern Ireland, in which the company will supply its next generation high energy ultracapacitor modules to power fuel cell buses in the UK.
Zytronic adds a third dimension to touch with its ZyBrid® hover technology Touch technology innovator Zytronic has released a contactless sensing option that can detect user interactions up to 30mm away from the surface of the glass.
Improved signal integrity on High Frequency and High Speed PCBs In PCB design guidelines chip makers recommend using VLP (very low profile) and HVLP (hyper very low profile) copper to mitigate insertion loss caused by the skin effect – But do you know what happens to the copper surface roughness during PCB fabrication?
TSMC's profit soars on the back of strong revenue growth The semiconductor foundry announces consolidated revenues of NTD 356.43 billion (EUR 10.57 billion) for its third quarter of 2020, a 21.6% increase from the same period last year.
COVID-19 is still impacting the business of RoodMicrotec The independent semiconductor supplier recorded a total income of EUR 3.0 million during the third quarter of 2020, a slight decrease from EUR 3.1 million during the same period last year.
Digi-Key and Netlist announce US marketplace distribution partnership Digi-Key Electronics has added Netlist, a builder of memory and storage solutions, to its Marketplace.
STMicro acquires French fabless semiconductor company The acquired fabless semiconductor company specialises in silicon-based power amplifiers and RF Front-End Module products for the cellular IoT and 5G markets.
Advantech expands with three new offices in North America The embedded production and solution provider has opened three new branch offices in Downers Grove, Illinois; Danvers, Massachusetts; and Toronto, Canada.
ASM's CFO, Peter van Bommel, to retire Chief Financial Officer, Peter van Bommel, has notified the Supervisory Board of ASM of his wish to retire from the company at the next Annual General Meeting to be held in May 2021.
Italian manufacturer acquires German producer of magnetic measurement solutions Lika Electronic, a developer and manufacturer of encoders and position measuring systems, announces the successful strategic acquisition of BOGEN Electronic GmbH.
ClassOne's Solstice S4 wet processing system chosen by TRUMPF Semiconductor equipment manufacturer ClassOne Technology has sold its Solstice S4 fully-automated wet-processing system to VCSEL laser manufacturer, TRUMPF Photonic Components.
Prodrive Technologies officially opens North American HQ The Dutch technology company has officially opened their North American headquarters in Massachusetts USA.Load more news