© lavitreiu dreamstime.com Business | June 10, 2016
Small 3D camera brings augmented reality to a smartphone
Lenovo will bring Tango technology to a consumer product. Google's technology that allows devices to understand spatial information is an exclusive feature in the PHAB2 Pro smartphone launched today.
Based on the Time-of-Flight principle, the REAL3 image sensor chip from Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) equips the smartphone with a 3-dimensional perception of the surroundings in real-time. Infineon provides the only image sensor chip worldwide meeting Google’s specifications. “Through the Tango-enabled PHAB2 Pro, we are opening a completely new era in mobile applications,” said Hua Zhang, Vice President, Lenovo Android/Chrome Computing Business Group. “The REAL3 image sensor chip from Infineon is a key component for Lenovo’s PHAB2 Pro.” Its users have instant access to Augmented Reality, benefiting from the phone’s motion tracking feature which responds to physical movements, depth perception that measures the distance between objects and area learning capability which enables the device to recall the data recorded from previously visited locations. Augmented Reality for everyone is no longer a dream “3D machine vision will drive multiple new applications both in the consumer and the automotive world,” said Jochen Hanebeck, President of the Automotive division at Infineon. “The depth perception and motion tracking today implemented in Tango devices can also be applied to driver monitoring or gesture detection inside the car.” The sensor chip was developed in Graz, Austria, a global Infineon competence center for advanced semiconductor solutions combining analog and digital signal processing with high data rates. It integrates the pixel array, the control circuitry, ADCs and the digital high-speed interface on a single chip. The development was made in co-operation with pmdtechnologies, a worldwide leading provider of the Time-of-Flight (ToF) technology. This measuring principle involves infrared light. For each of its pixels, the 3D image sensor chip measures the time the light takes to travel from the camera to the object and back again. Each pixel detects the brightness value of the objects. Compared to other technologies, the ToF technology from pmdtechnologies offers the best spatial resolution and highest robustness both mechanically and concerning background light. Yet, it has the lowest current consumption and size. Thus, the camera is currently the smallest 3D-camera worldwide. Followers of Google’s developer conference, Google I/O, just recently witnessed Infineon’s involvement in Project Soli: Google and Infineon collaborated on a sensor chip facilitating gesture recognition. The Project Soli works with 60 GHz radio microwaves, whereas Tango is based on sending and receiving infra-red light signals. Thus, it stands apart from common 3D imaging methods. These are either based on a stereo camera requiring a minimum distance for triangulation and higher computing efforts. Alternatively, 3D images could so far be created with structured light with a lower object resolution, involving a higher bill of materials.
ClassOne's Solstice plating system selected for advanced MicroLEDs Semiconductor equipment manufacturer ClassOne Technology announces the sale of its Solstice GoldPro electroplating system to an unnamed developer of microLED technology for advanced applications.
Jenoptik: order intake down on prior year; order backlog slightly up From January through early March business performance was in line with expectations, but clear impacts of the corona pandemic and increasing uncertainty within the automotive industry became apparent from late March on.
Smiths Detection completes acquisition of PathSensors Smiths Detection has completed the acquisition of PathSensors, a bio-technology solutions and environmental-testing company, based in Baltimore, MD, USA.
Saab divests Dutch-based QPS Saab has divested the Dutch-based company QPS (Quality Positioning Services), a provider of hydrographic software solutions within the global maritime industry. The decision is in line with Saab’s strategy to optimise its product portfolio and increase focus on five core areas.
Eyeing SiC and GaN potential – GlobalWafers team up with NCTU Advancements in 5G and electric vehicle technologies are bringing the mounting demands of power semiconductor. GlobalWafers is teaming up with the National Chiao Tung University (NCTU) to develop the third generation semiconductor material.
Phison expands with new R&D centre Taiwanese NAND Flash controller IC and storage solutions provider, Phison Electronics, broke ground on a new R&D center and inventory management in Guangyuan Science Park in Zhunan township, back in late march.
Infineon swings to loss as the pandemic continues impact target markets “Infineon has so far coped well with the challenging situation caused by the coronavirus pandemic. As a company, we reacted quickly to the new situation and established a framework that has enabled us to stabilize our business,” says CEO Dr. Reinhard Ploss.
Murata completes new production building The Japanese manufacturer’s subsidiary, Izumo Murata Manufacturing, has completed the construction of a new production facility which started back in August 2019.
Analog Devices team up with Intel to address 5G network design challenges The companies are collaborating to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.
Goodix closes acquisition of Dream Chip Technologies Shenzhen Goodix Technology Co. Ltd., an integrated solution provider, has completed its acquisition of Dream Chip Technologies GmbH (DCT), a fabless German semiconductor technology company.
Rebound Electronics team up with IHS Markit The pace of change in the electronics industry continues unabated for all customer types – OEM, ODM and EMS. This is driven by all component manufacturer types – including semiconductor, passive, connector and electromechanical – dynamically changing pricing, lead time, life cycle management and more.
New management takes the reins at Würth Elektronik eiSos As of the 1st of May 2020, Dirk Knorr and Josef Wörner have been appointed as General Managers for the German business of the Würth Elektronik eiSos GmbH & Co. KG, having been a part of the management circle of the company for years.
Seasoned financial and semiconductor executive joins GlobalFoundries GlobalFoundries has appointed David Reeder as its new Chief Financial Officer (CFO).
Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024 The global semiconductor packaging materials market will track chip industry growth to expand from USD 17.6 billion in revenue logged in 2019 to USD 20.8 billion in 2024, a 3.4% Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast.
Analog Devices acquires HDMI business from INVECAS Analog Devices, Inc. has acquired the High Definition Multimedia Interface (HDMI) business of Santa Clara based INVECAS.
Intel’s chief engineering officer to leave the company Changes to Intel’s technology organisation are coming. New leaders have been appointed and Murthy Renduchintala will leave the company.
Schleuniger Group acquires the business of US-based Cirris Systems Corp. Following many years of cooperation, the Schleuniger Group and Cirris Systems Corp. have signed an agreement for Schleuniger to acquire Cirris, based in Salt Lake City, Utah, on the basis of an asset deal.
Mu-Del Electronics acquires Luff Research Virginia-based Mu-Del Electronics LLC, an Ironwave Technologies Company and a manufacturer of high-performance RF and Microwave based systems, is acquiring Luff Research.
Sierra Wireless to divest automotive embedded module product line The company has announced a definitive agreement to divest its Shenzhen, China-based automotive embedded module product line for USD 165 million in cash.
The evolving GaN and SiC power semiconductor market landscape The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is rapidly evolving from a startup-dominated business to one led by large-established power semiconductor manufacturers.
AEM acquires DB Design to expands design & application engineering capabilities AEM Holdings Ltd has acquired 100% stake in California-based DB Design Group, Inc. with its key team of designers and machinists located in California serving the Silicon Valley customer base.Load more news
- Rebound Electronics team up with IHS Markit
- Seasoned financial and semiconductor executive joins GlobalFoundries
- Panasonic and China’s GS-Solar to end PV business partnership
- Summit Interconnect acquires Integrated Technology
- Manufacturer to pay back wages after firing workers who requested coronavirus sick leave