© dimitry romanchuck dreamstime.com Components | June 17, 2013
NXP tops ABI Research list
NXP, Inside Secure, and STMicroelectronics were judged to be the top rated vendors of NFC ICs in ABI Research’s Competitive Assessment.
Companies were scored for eight key criteria under the categories of Implementation and Innovation across both NFC modems/controllers and secure elements. NXP ranked in first position overall and topped the Implementation category. It was the most successful vendor in 2012 and scored multiple design wins with a broad cross-section of OEMs and product categories. NXP was also one of three equal scoring companies coming in joint second for Innovation because of its work highlighting new use cases for NFC across its broad portfolio. Inside Secure ranked second for Innovation and third for Implementation because it was the first vendor to announce a major OEM contract (with RIM using a SE from Infineon), its input into new standards, and its efforts to develop NFC in new device categories. It continues to develop new form-factors, features and is working with partners to better embed NFC technology into new devices. STMicroelectronics found some traction in the eSE space and was the leading SWP SIM card IC vendor. This combined with its growing success in new device wins contributed to it achieving the second highest Implementation score. Other notable findings include:
- Broadcom topped the Innovation category with its strong feature set, market positioning, breadth of applications, and targeted and innovative approach, which has resulted in recent CLF design wins in smartphones and tablets.
- Sony’s knowledge of contactless with FeliCa has been one of the most active companies in showcasing NFC’s capabilities across a range of products and devices. As a direct result of this Sony has strong partner relationships and technical knowledge.
- Infineon achieved third position within the Implementation criteria. It does not offer a CLF but it has utilized its strengths in security to develop new standards and features to enable the NFC market take off.
Rebound Electronics expands in Asia The independent supplier of electronic components says it is investing to increase its market coverage in Asia with the opening of several new offices and setting up a customer service & telesales centre.
Samsung expands foundry capacity with new production line Samsung Electronics says that it plans to boost its foundry capacity at the company's new production line in Pyeongtaek, Korea, to meet growing global demand for extreme ultraviolet (EUV) solutions.
Super Dry Totech expands Long Term Storage Solutions offering The most recent development for Super Dry Totech, is the acquisition of a new building to expand on capacity & to minimise risk by assuring continuity should a disrupting incident occur in one of the facilities.
Ynvisible acquires electrochromic display company rdot Printed electronics specialist, Ynvisible Interactive, announces that it will acquire the printed electrochromic displays business of rdot AB of Gothenburg, Sweden.
Manz receives follow-up order for display production equipment Manz says it has received an order with a total volume in the low double-digit million euro range for display production equipment.
Aehr Receives initial order from new customer for FOX-NP solution Aehr Test Systems says it has received orders from a new customer and their subcontract manufacturing supplier for a FOX solution including a FOX-NP full wafer test system, an initial WaferPak Contactor, and a FOX WaferPak Aligner to perform production qualification of their silicon photonics devices.
AIM names new director of product management AIM Solder has appointed Timothy O’Neill to the position of Director of Product Management.
Seoul Semi files patent suit against automotive LED light distributor Seoul Semiconductor says it has filed a patent infringement lawsuit in the United States District Court for the District of New Jersey against Onyx Enterprise Int’l Corp., a distributor of automotive components.
X-FAB expands foundry offering for silicon-based microfluidics In order to address heightening demands, X-FAB Silicon Foundries SE, has taken steps to simplify the integration of microfluidic elements with CMOS and SOI dies.
Renesas withdraw from LD/PD business and close production Renesas has decided to withdraw from the laser diode (LD) and photo diode/detector (PD) businesses, and to close the production line at its Shiga Factory, which manufactures compound semiconductor products.
TSMC confirms its intention to build new US fab The Semiconductor giant has announced its intention to build and operate an advanced semiconductor fab in the United States with support from the US government and the state of Arizona.
Flisom to set up shop in Hungary The Swiss solar technology company chose Kecskemét, Hungary as the location for its plant of industrial capacity.
VRG Earns ISO 9001:2015 Certification VRG Components, an independent distributor of electronic components, have been awarded the ISO 9001:2015 certification.
Richardson RFPD ink distribution franchise deal with u-blox Richardson RFPD – an Arrow Electronics company – has entered into a global franchise distribution agreement with u-blox.
Imagination and BAIC Capital creates automotive joint venture Imagination Technologies and BAIC Group Industrial Investment (BAIC Capital), have signed a joint venture agreement to initiate the establishment of an automotive fabless semiconductor company.
Swissbit continues its growth trend with Ardian as a new partner Together with the management team, investment house, Ardian, is acquiring Swiss memory manufacturer Swissbit.Load more news