© franz pfluegl dreamstime.com Components | May 24, 2013
Freescale extends QorIQ Qonverge B4 family
Freescale Semiconductor has added advanced floating point technology to its QorIQ Qonverge B4 product family.
Freescale’s B4420 and B4860 system-on-chip (SoC) solutions, powered by SC3900 StarCore technology, are the first B4 family members to include floating point arithmetic. Freescale’s advanced floating point technology is engineered to exceed the stringent requirements of computation-intensive applications that require high-precision numerical accuracy, such as radar, medical and media imaging, MAC-scheduler processing in Cloud-RAN, video analytics, security, industrial automation, and test and measurement systems. To support these applications, Freescale added floating point arithmetic to the SC3900 processing unit, the industry’s highest performing fixed-point DSP core*. The floating point capabilities complement the broad array of advanced technologies already integrated into QorIQ Qonverge SoCs, including high-performance processing, security and network processing acceleration engines. “Freescale’s breakthrough QorIQ Qonverge portfolio has experienced strong market acceptance and broad adoption throughout the communications and networking equipment space,” said Tareq Bustami, vice president of product management for Freescale’s Digital Networking business. “By adding advanced floating point arithmetic to support compute-intensive tasks, we are enabling a broader customer base to spark innovation with products leveraging the power, performance and cost advantages of QorIQ Qonverge technology.” With advanced 28-nm process technology, the B4860 generates up to 14.4 GHz of total programmable processing performance and integrates four e6500 dual-threaded Power Architecture® processor cores resulting in 61,000 processor CoreMark. Six fixed- and floating-point SC3900FP DSP cores yield 230.4 GMACS of fixed-point performance and 115.2 GFLOPS of floating-point performance. Combined with the four AltiVec SIMD engines embedded in e6500 cores, a total of 172.8 GFLOPS of IEEE® 754 floating-point performance is attained. This combination of powerful programmable cores, together with built-in IP packet processing and security acceleration engines, delivers outstanding flexibility, exceptional processing performance and facilitates the development of a broad range of applications requiring massive processing performance for energy-efficient systems. Freescale added floating point support to the production version of the B4860 and B4420 SoCs while retaining binary code compatibility with the existing SC3900 core. This enables continuity for customers already developing software for these SoCs. Different from many other heterogeneous multicore architectures, the B4 family provides a full cache-coherent system keeping data consistency of the shared resource stored in local caches; not only between L1 and shared L2 caches within the core clusters but also between the different types of core clusters and external interfaces with no software intervention. This performance increase eases multicore programming and significantly speeds time to market. High-speed and low-latency industry-standard interfaces are included to support the powerful SoC computing resources. The B4860 SoC incorporates a suite of high-speed standard interfaces pertinent for a multi-purpose SoC, including two 10 Gbps XFI/XAUI Ethernet controllers, four 2.5 Gbps/1 Gbps SGMII Ethernet controllers, two Serial RapidIO v2.1 controllers supporting eight lanes at 5G, and a PCI Express Gen2 controller supporting four lanes at 5G. It also includes two DDR3/3L controllers, 64/72-bit with ECC at 1.867 GHz, NAND/NOR flash controller, I2C, SPI, SDHC, USB and UART interfaces. Availability The B4860 and B4420 SoCs, as well as evaluation boards supporting Freescale floating point technology are planned for the third quarter of 2013.
Farnell signs new distribution agreement with KOA Farnell says it has strengthen the depth and breadth of its passive component range with the addition of KOA Europe GmbH.
II-VI with domestic and foreign acquisitions Compound semiconductor specialist, II-VI Incorporated, has entered into a definitive agreement to acquire all outstanding shares in Swedish SiC epitaxial wafers specialist, Ascatron AB. At the same time, II-VI says it will acquire all the outstanding interests of the owners of the parent of INNOViON Corporation.
Microsoft invests in AI Chip company Syntiant, a deep learning tech company providing AI voice and sensor solutions, has completed a USD 35 million Series C funding round.
Meyer Burger sells its microwave and plasma maker Muegge Meyer Burger Technology is selling its microwave and plasma technology company Muegge GmbH, to investment company HQ Equita.
ON Semi looking to sell Japanese facility ON Semiconductor is exploring a sale of its manufacturing facility in Niigata, Japan. The intended sale of the facility is part of the company’s plan to optimise its manufacturing footprint and sharpen its focus on highly differentiated power, analog and sensor products.
New VP of business development at Smith The distributor of electronic components and semiconductors has appointed Renato Souza to the position of Vice President of Business Development. Renato previously served as Vice President, Latin America of Smith since 2017.
Bosch launches 5G tests at Reutlingen wafer fab The German company believes 5G will be a key building block of digitalization and connectivity in manufacturing and logistics. And for that reason, Bosch is now starting compatibility tests and channel measurements for setting up a 5G network in its wafer fab in Reutlingen.
ACM Research receives orders from two new analog/power IC customers The supplier of wafer cleaning technologies for advanced semiconductor devices, has received purchase orders and final stage bidding activities for a total of USD 36 million from two new China-based customers that manufacture analog and power IC devices.
ClassOne's Solstice plating system selected for advanced MicroLEDs Semiconductor equipment manufacturer ClassOne Technology announces the sale of its Solstice GoldPro electroplating system to an unnamed developer of microLED technology for advanced applications.
Jenoptik: order intake down on prior year; order backlog slightly up From January through early March business performance was in line with expectations, but clear impacts of the corona pandemic and increasing uncertainty within the automotive industry became apparent from late March on.
Smiths Detection completes acquisition of PathSensors Smiths Detection has completed the acquisition of PathSensors, a bio-technology solutions and environmental-testing company, based in Baltimore, MD, USA.
Saab divests Dutch-based QPS Saab has divested the Dutch-based company QPS (Quality Positioning Services), a provider of hydrographic software solutions within the global maritime industry. The decision is in line with Saab’s strategy to optimise its product portfolio and increase focus on five core areas.
Eyeing SiC and GaN potential – GlobalWafers team up with NCTU Advancements in 5G and electric vehicle technologies are bringing the mounting demands of power semiconductor. GlobalWafers is teaming up with the National Chiao Tung University (NCTU) to develop the third generation semiconductor material.
Phison expands with new R&D centre Taiwanese NAND Flash controller IC and storage solutions provider, Phison Electronics, broke ground on a new R&D center and inventory management in Guangyuan Science Park in Zhunan township, back in late march.
Infineon swings to loss as the pandemic continues impact target markets “Infineon has so far coped well with the challenging situation caused by the coronavirus pandemic. As a company, we reacted quickly to the new situation and established a framework that has enabled us to stabilize our business,” says CEO Dr. Reinhard Ploss.
Murata completes new production building The Japanese manufacturer’s subsidiary, Izumo Murata Manufacturing, has completed the construction of a new production facility which started back in August 2019.
Analog Devices team up with Intel to address 5G network design challenges The companies are collaborating to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.
Goodix closes acquisition of Dream Chip Technologies Shenzhen Goodix Technology Co. Ltd., an integrated solution provider, has completed its acquisition of Dream Chip Technologies GmbH (DCT), a fabless German semiconductor technology company.
Rebound Electronics team up with IHS Markit The pace of change in the electronics industry continues unabated for all customer types – OEM, ODM and EMS. This is driven by all component manufacturer types – including semiconductor, passive, connector and electromechanical – dynamically changing pricing, lead time, life cycle management and more.
New management takes the reins at Würth Elektronik eiSos As of the 1st of May 2020, Dirk Knorr and Josef Wörner have been appointed as General Managers for the German business of the Würth Elektronik eiSos GmbH & Co. KG, having been a part of the management circle of the company for years.Load more news