© Fairchild Semiconductor
Components |
MOSFETs with 4 times less junction-to-ambient thermal resistance
Designers of DC-DC conversion applications are challenged with improving power density while saving board space and reducing thermal resistance. Fairchild Semiconductor introduced a new mid-voltage PowerTrench MOSFETs with Dual Cool packaging technology tailored towards these design challenges.
Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP.
Devices included in the mid-voltage series include the 40V FDMS8320LDC, 60V FDMS86500DC, 80V FDMS86300DC and the 100V FDMS86101DC. These devices are synchronous rectifying MOSFETs that are suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications.
Packing and Pricing Information (in US 1,000 quantity pieces)
Samples available upon request - Delivery 8-12 weeks ARO
All devices in this product family are available in a PQFN 5x6 8L package.
