Ad
Ad
Ad
Ad
Ad
Ad
© Fairchild Semiconductor Components | January 08, 2013

MOSFETs with 4 times less junction-to-ambient thermal resistance

Designers of DC-DC conversion applications are challenged with improving power density while saving board space and reducing thermal resistance. Fairchild Semiconductor introduced a new mid-voltage PowerTrench MOSFETs with Dual Cool packaging technology tailored towards these design challenges.
Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP.

Devices included in the mid-voltage series include the 40V FDMS8320LDC, 60V FDMS86500DC, 80V FDMS86300DC and the 100V FDMS86101DC. These devices are synchronous rectifying MOSFETs that are suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications.

Packing and Pricing Information (in US 1,000 quantity pieces)

Samples available upon request - Delivery 8-12 weeks ARO

All devices in this product family are available in a PQFN 5x6 8L package.

Comments

Please note the following: Critical comments are allowed and even encouraged. Discussions are welcome. Verbal abuse, insults and racist / homophobic remarks are not. Such comments will be removed.
Further details can be found here.
Ad
Ad
Load more news
October 15 2018 11:56 pm V11.6.0-1