© apple Components | January 08, 2013
Fast facts on major trends at CES 2013
A Consumer Electronics Association (CEA) representative at a press conference on Sunday said the technology industry has entered the "post-smartphone era" when communication functions such as calls and texting are no longer the main focus for smartphones.
The representative noted that smartphones now mainly are used for non-communication types of functions, adding that, “The smartphone has become the viewfinder of your digital life.” CEA said this trend reflects an overall shift in the technology market’s focus away from hardware and toward apps. IHS predicts global smartphone shipments will rise by 28 percent this year to 836 million units, up from 654 million in 2012, as presented in Figure 1. This represents a slowdown from 35 percent growth in 2012 and the 61 percent increase in 2011, according to the IHS iSuppli/Screen Digest Mobile & Wireless Communications Service at IHS. However, 2013 will mark the first year that smartphones will account for more than 50 percent of global cellphone shipments. The rising usage of smartphones for non-communication purposes is illustrated by the soaring worldwide demand for apps. Global smartphone application store revenue is set to more than double from 2012 to 2016. Revenue generated from the sales of smartphone apps is projected to rise to 10.8 billion euros in 2016, up from 4.1 billion euros in 2012, as presented in Figure 2. After more than doubling in 2011, worldwide revenue climb 48 percent in 2013 to reach 6.1 billion euros, according to the IHS Screen Digest Mobile Media Intelligence Service at IHS. CEA also said consumer electronics products are becoming “sensorized”—i.e., devices like smartphones are making increasing use of sensors that allow the digitization of everyday things. Specific types of applications mentioned included infrared, near-field communications and moisture sensors that tell users when their plants need to be watered. At the presentation, CEA specifically mentioned microelectromechanical systems (MEMS), which commonly serve as sensors in smartphone applications, including gyroscopes, accelerometers and pressure sensors. Global revenue for MEMS in consumer and mobile applications is anticipated to reach $3.2 billion in 2013, up 22 percent from $2.6 billion in 2012, as presented in Figure 3. Revenue will soar to $4.9 billion in 2016, according to the IHS iSuppli MEMS & Sensors Service at IHS. CEA said CES 2013 will see the introduction of an increasing number of Internet-connected devices that have built-in intelligence. Global shipments of Internet-connected products—a category that includes web-enabled mobile computers, mobile devices like smartphones and media tablets, as well as consumer electronics products like game consoles and smart TVs—are set to nearly double over the next few years. Shipments worldwide of such Internet-connected devices are expected to rise to 2.4 billion units in 2016, up from 1.2 billion in 2012, as presented in Figure 4. Shipments will expand 26 percent in 2013 to 1.5 billion units, according to the IHS iSuppli Home and Consumer Electronics Service.
Microsoft invests in AI Chip company Syntiant, a deep learning tech company providing AI voice and sensor solutions, has completed a USD 35 million Series C funding round.
Meyer Burger sells its microwave and plasma maker Muegge Meyer Burger Technology is selling its microwave and plasma technology company Muegge GmbH, to investment company HQ Equita.
ON Semi looking to sell Japanese facility ON Semiconductor is exploring a sale of its manufacturing facility in Niigata, Japan. The intended sale of the facility is part of the company’s plan to optimise its manufacturing footprint and sharpen its focus on highly differentiated power, analog and sensor products.
New VP of business development at Smith The distributor of electronic components and semiconductors has appointed Renato Souza to the position of Vice President of Business Development. Renato previously served as Vice President, Latin America of Smith since 2017.
Bosch launches 5G tests at Reutlingen wafer fab The German company believes 5G will be a key building block of digitalization and connectivity in manufacturing and logistics. And for that reason, Bosch is now starting compatibility tests and channel measurements for setting up a 5G network in its wafer fab in Reutlingen.
ACM Research receives orders from two new analog/power IC customers The supplier of wafer cleaning technologies for advanced semiconductor devices, has received purchase orders and final stage bidding activities for a total of USD 36 million from two new China-based customers that manufacture analog and power IC devices.
ClassOne's Solstice plating system selected for advanced MicroLEDs Semiconductor equipment manufacturer ClassOne Technology announces the sale of its Solstice GoldPro electroplating system to an unnamed developer of microLED technology for advanced applications.
Jenoptik: order intake down on prior year; order backlog slightly up From January through early March business performance was in line with expectations, but clear impacts of the corona pandemic and increasing uncertainty within the automotive industry became apparent from late March on.
Smiths Detection completes acquisition of PathSensors Smiths Detection has completed the acquisition of PathSensors, a bio-technology solutions and environmental-testing company, based in Baltimore, MD, USA.
Saab divests Dutch-based QPS Saab has divested the Dutch-based company QPS (Quality Positioning Services), a provider of hydrographic software solutions within the global maritime industry. The decision is in line with Saab’s strategy to optimise its product portfolio and increase focus on five core areas.
Eyeing SiC and GaN potential – GlobalWafers team up with NCTU Advancements in 5G and electric vehicle technologies are bringing the mounting demands of power semiconductor. GlobalWafers is teaming up with the National Chiao Tung University (NCTU) to develop the third generation semiconductor material.
Phison expands with new R&D centre Taiwanese NAND Flash controller IC and storage solutions provider, Phison Electronics, broke ground on a new R&D center and inventory management in Guangyuan Science Park in Zhunan township, back in late march.
Infineon swings to loss as the pandemic continues impact target markets “Infineon has so far coped well with the challenging situation caused by the coronavirus pandemic. As a company, we reacted quickly to the new situation and established a framework that has enabled us to stabilize our business,” says CEO Dr. Reinhard Ploss.
Murata completes new production building The Japanese manufacturer’s subsidiary, Izumo Murata Manufacturing, has completed the construction of a new production facility which started back in August 2019.
Analog Devices team up with Intel to address 5G network design challenges The companies are collaborating to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.
Goodix closes acquisition of Dream Chip Technologies Shenzhen Goodix Technology Co. Ltd., an integrated solution provider, has completed its acquisition of Dream Chip Technologies GmbH (DCT), a fabless German semiconductor technology company.
Rebound Electronics team up with IHS Markit The pace of change in the electronics industry continues unabated for all customer types – OEM, ODM and EMS. This is driven by all component manufacturer types – including semiconductor, passive, connector and electromechanical – dynamically changing pricing, lead time, life cycle management and more.
New management takes the reins at Würth Elektronik eiSos As of the 1st of May 2020, Dirk Knorr and Josef Wörner have been appointed as General Managers for the German business of the Würth Elektronik eiSos GmbH & Co. KG, having been a part of the management circle of the company for years.
Seasoned financial and semiconductor executive joins GlobalFoundries GlobalFoundries has appointed David Reeder as its new Chief Financial Officer (CFO).
Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024 The global semiconductor packaging materials market will track chip industry growth to expand from USD 17.6 billion in revenue logged in 2019 to USD 20.8 billion in 2024, a 3.4% Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast.Load more news