Components | September 19, 2012
European Research Project 'IMPROVE a success
The 35 European partners in the research project IMPROVE have succeeded in making the European semiconductor industry more competitive in the global arena.
In 2009, a group of European semiconductor companies joined together under the technical project management of Infineon Technologies AG. Their aim was to identify new methods to increase the efficiency of semiconductor manufacturing in Europe and, at the same time, reduce costs and processing times. Technology partners of the project funded by the German Ministry of Education and Research (BMBF) were software enterprises, semiconductor companies with production sites in Europe, research institutes and academia from Austria, France, Germany, Ireland, Italy and Portugal. IMPROVE stands for “Implementing Manufacturing science solutions to increase equipment productivity and fab performance”. IMPROVE research success: Better yield in shorter production time The IMPROVE project partners have managed to decrease the rejects in chip production by 12 percent with their research work. In addition, the IMPROVE project has also succeeded in reducing the production time for semiconductor products, which is currently about 12 to 16 weeks for a complex chip. Soon it might be possible to cut back the production time for semiconductor products by up to 3 percent. The IMPROVE partners have achieved this result by developing fundamentally new and intelligent methods of analysis and software tools and combining them with innovative data evaluation techniques. In order to obtain more control of process fluctuations, the research partners looked at the entire production line. One of the main challenges was to integrate the new methods and software components into the semiconductor manufacturers’ existing production information and control systems, in order to confirm the research results in productive pilot applications. Today, making a complex chip requires an average of 550 individual process steps. The typical production run is 50 to 100 wafers after which manufacturers have to reset production tools for the next of their many products and production processes. This makes precise monitoring of the production line and its conditions as well as predictive maintenance essential in order to stay competitive. IMPROVE has made an important contribution toward saving time here, too. “The IMPROVE research project was urgently necessary owing to growing chip functionality and the increasingly complex production methods with their additional process steps and longer production time,” said Dr. Cristina De Luca, IMPROVE project head at Infineon Technologies AG. “The joint research work of the semiconductor industry with academia, plant and process control and sensor and software development has helped semiconductor production to take a big step forward with the most modern techniques.” The IMPROVE research project The IMPROVE project had a total budget of approximately Euro 37.7 million, half of which was carried by the partners from industry and research. The other half is funded by the ENIAC Joint Undertaking of the European Union as part of their program “SP4 Nanoelectronics for Energy & Environment” as well as by national funding of the participating nations. The BMBF is supporting the project with Euro 3.3 million under the “Information and Communications Technology 2020” program. Infineon was in charge of the coordination of the German project partners until November 2011, after which the Fraunhofer Institute for Integrated Systems and Device Technology took over.
ON Semi looking to sell Japanese facility ON Semiconductor is exploring a sale of its manufacturing facility in Niigata, Japan. The intended sale of the facility is part of the company’s plan to optimise its manufacturing footprint and sharpen its focus on highly differentiated power, analog and sensor products.
New VP of business development at Smith The distributor of electronic components and semiconductors has appointed Renato Souza to the position of Vice President of Business Development. Renato previously served as Vice President, Latin America of Smith since 2017.
Bosch launches 5G tests at Reutlingen wafer fab The German company believes 5G will be a key building block of digitalization and connectivity in manufacturing and logistics. And for that reason, Bosch is now starting compatibility tests and channel measurements for setting up a 5G network in its wafer fab in Reutlingen.
ACM Research receives orders from two new analog/power IC customers The supplier of wafer cleaning technologies for advanced semiconductor devices, has received purchase orders and final stage bidding activities for a total of USD 36 million from two new China-based customers that manufacture analog and power IC devices.
ClassOne's Solstice plating system selected for advanced MicroLEDs Semiconductor equipment manufacturer ClassOne Technology announces the sale of its Solstice GoldPro electroplating system to an unnamed developer of microLED technology for advanced applications.
Jenoptik: order intake down on prior year; order backlog slightly up From January through early March business performance was in line with expectations, but clear impacts of the corona pandemic and increasing uncertainty within the automotive industry became apparent from late March on.
Smiths Detection completes acquisition of PathSensors Smiths Detection has completed the acquisition of PathSensors, a bio-technology solutions and environmental-testing company, based in Baltimore, MD, USA.
Saab divests Dutch-based QPS Saab has divested the Dutch-based company QPS (Quality Positioning Services), a provider of hydrographic software solutions within the global maritime industry. The decision is in line with Saab’s strategy to optimise its product portfolio and increase focus on five core areas.
Eyeing SiC and GaN potential – GlobalWafers team up with NCTU Advancements in 5G and electric vehicle technologies are bringing the mounting demands of power semiconductor. GlobalWafers is teaming up with the National Chiao Tung University (NCTU) to develop the third generation semiconductor material.
Phison expands with new R&D centre Taiwanese NAND Flash controller IC and storage solutions provider, Phison Electronics, broke ground on a new R&D center and inventory management in Guangyuan Science Park in Zhunan township, back in late march.
Infineon swings to loss as the pandemic continues impact target markets “Infineon has so far coped well with the challenging situation caused by the coronavirus pandemic. As a company, we reacted quickly to the new situation and established a framework that has enabled us to stabilize our business,” says CEO Dr. Reinhard Ploss.
Murata completes new production building The Japanese manufacturer’s subsidiary, Izumo Murata Manufacturing, has completed the construction of a new production facility which started back in August 2019.
Analog Devices team up with Intel to address 5G network design challenges The companies are collaborating to create a flexible radio platform that addresses 5G network design challenges and will enable customers to scale their 5G networks more quickly and economically.
Atlas Copco has acquired the technology and operating assets of iTrap The Swedish company has acquired a technology for process diagnostics and control in the semiconductor industry.
Goodix closes acquisition of Dream Chip Technologies Shenzhen Goodix Technology Co. Ltd., an integrated solution provider, has completed its acquisition of Dream Chip Technologies GmbH (DCT), a fabless German semiconductor technology company.
Rebound Electronics team up with IHS Markit The pace of change in the electronics industry continues unabated for all customer types – OEM, ODM and EMS. This is driven by all component manufacturer types – including semiconductor, passive, connector and electromechanical – dynamically changing pricing, lead time, life cycle management and more.
New management takes the reins at Würth Elektronik eiSos As of the 1st of May 2020, Dirk Knorr and Josef Wörner have been appointed as General Managers for the German business of the Würth Elektronik eiSos GmbH & Co. KG, having been a part of the management circle of the company for years.
Seasoned financial and semiconductor executive joins GlobalFoundries GlobalFoundries has appointed David Reeder as its new Chief Financial Officer (CFO).
Global Semiconductor Packaging Materials Market to Reach $20.8 Billion by 2024 The global semiconductor packaging materials market will track chip industry growth to expand from USD 17.6 billion in revenue logged in 2019 to USD 20.8 billion in 2024, a 3.4% Compound Annual Growth Rate (CAGR), SEMI and TechSearch International forecast.
Analog Devices acquires HDMI business from INVECAS Analog Devices, Inc. has acquired the High Definition Multimedia Interface (HDMI) business of Santa Clara based INVECAS.Load more news