Components | September 06, 2012
Infineon heads business and research collaboration
Twenty four European partners have joined the “VeTeSS” project, headed by Infineon Technologies AG, to look at standardized, reliable and cost-effective development methods to help avoid errors in subcomponents leading to the malfunction of the entire safety system.
VeTeSS, stands for “Verification and Test Support for Safety Standards". There are a total of 24 European partners from the automotive industry and its connected areas working on the VeTeSS research project. Besides Infineon, its German partners include the Fraunhofer-Gesellschaft’s Institute for Integrated Circuits IIS, TWT GmbH Science & Innovation, ikv++ technologies AG and exida.com Excellence in Dependable Automation GmbH. The German Federal Ministry of Education and Research (BMBF) is supporting the research project with Euro 2.5 million and the European Union is contributing Euro 3.2 million. The objective of the VeTeSS project partners is to prepare new automated processes for safety system and subcomponent development in accordance with ISO 26262. With VeTeSS, procedures for the reliability and performance testing in the design phase of the safety system and subcomponents will be standardized for the first time. This will make it possible to correct errors at an earlier stage and further improve the quality and durability of the electrical and electronic safety systems in the vehicle. What is more, the risk of error will be reduced during the certification process that is typically required to prove the efficiency of the safety system. VeTeSS: New design methods to fulfill future safety standards for vehicles Introduced at the end of 2011, the ISO 26262 standard is intended to assure the functionality of the increasingly complex electrical and electronic systems responsible for safety-related functions in vehicles. The standard defines the requirements of the safety functions in the vehicle and includes guidelines for the development process. Modern semiconductor technologies improve system performance and the energy efficiency of electronic control units in vehicles. In addition, they facilitate the use of increasingly small transistors and thus more intelligent systems. However, growing complexity increases the risk of design errors during the development process. That is why it is necessary to test and verify the electronic systems and their subcomponents throughout this phase. Until now, each manufacturer developed its own individual in-house methods. The ISO standard 26262 however stipulates a standard and automated test method, which is now being developed by the VeTeSS partners. This will also make it possible for subcomponents to be certified individually or in connection with a specific overall system and then integrated into different systems, such as electrical power steering, electronic stability control or anti-lock braking systems. Tasks of the German VeTeSS partners exida.com, an internationally recognized certification body, will share its know-how during the implementation of the ISO 26262, and will make the VeTeSS results usable for industrial applications. The IIS-Design Automation Division EAS of the Fraunhofer-Gesellschaft is developing methods and tools for the rapid evaluation of the entire system, which includes intelligent sensor technology, the electronic control unit with the microcontroller and power electronics. ikv++ technologies, as a supplier of analysis and design methods for the automotive market, will work on the definition of requirements for the use and development of demonstrators. In terms of the ISO 26262 standard, TWT GmbH Science & Innovation will contribute its know-how in digital product development and develop complex simulation methods to identify possible errors quickly and reliably. TWT is also responsible for the requirements analysis for ISO 26262-based information management. Infineon is in charge of verifying hardware and software components and developing the test software.
Ingun's going global; expands in Latin America and Eastern Europe Benjamin Sontag (INGUN Prüfmittel GmbH) gave a short update on expansion plans in Latin America and Eastern Europe.
Yageo to acquire KEMET in a $1.8 billion deal Yageo Corporation and KEMET Corporation have entered into a definitive agreement under which Yageo will acquire all of the outstanding shares of KEMET’s common stock for USD 27.20 per share in an all-cash transaction valued at USD 1.8 billion.
EVG and DELO partner to expand materials and process capabilities Supplier of wafer bonding and lithography equipment for the MEMS and semiconductor industry, EV Group (eVG), is partnering with DELO, a manufacturer of industrial high-tech adhesives, in the area of wafer-level optics.
Osram recommends current takeover offer from ams Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.
Sponsored content by Nordson ASYMTEKStart-to-finish conformal coating with reliability and efficiency Nordson ASYMTEK’s flexible, modular, Panorama™ S-Line delivers conformal coating process control in a space-saving footprint with overlapping line processes that minimize manufacturing floor space. This innovative, patent-pending line layout trims 50% of the line’s length by using the lower compartment in each piece of equipment for functional use. Combined with Nordson ASYMTEK’s global support, this complete conformal coating line delivers quality, product reliability, efficiency, and safety for all your conformal coating applications.
EpiWorld speeds up commercialisation of SiC devices with AIXTRON AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.
FlexEnable makes acquisition for flex displays FlexEnable, developer of flexible organic electronics, has purchased Merck's portfolio of high-performance organic thin-film transistor (OTFT) materials.
Sponsored content by NCAB Group Benelux B.V.Failure is not an option for a PCB More than 30% of the Gerbers NCAB Group Benelux B.V. reviews, have problems. However, the PCB are integrated in key end-user product with more and more High Tech PCB. We are here to support you on the new technologies growth to maintain a high reliability and quality. Contact us to review it together.
Samsung’s CPU project ends, layoffs in CA and TX Samsung has confirmed in a letter to the Texas Workforce Commission that layoffs as a result of the closure of the CPU project at the Samsung R&D Center (SARC) in Austin, Texas and the San Jose Advanced Computing Lab (ACL) in San Jose, California, will begin December 31.
Marvell completes acquisition of Avera Semi Marvell has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GlobalFoundries.
IAR Systems opens office in Taiwan Swedish IAR Systems, a supplier of software tools and services for embedded development, says the company is expanding in Asia with the opening of an office in Taipei, Taiwan.
ZF and Cree partners up to advance the electric drive ZF Friedrichshafen is teaming up with silicon carbide semiconductor specialist Cree, to create industry-leading, highly efficient electric drivelines.
Sponsored content by EsemdaContract manufacturer Esemda opens new facility in Vilnius and expands EMS The new facility has been built with reserved space for future expansions. As Esemda constantly grows, it is of great importance to be able to rapidly increase production capacity in large volumes.
Broadcom completes acquisition of Symantec Enterprise Security business Semiconductor company Broadcom, says that the company has completed its acquisition of the Enterprise Security business of Symantec Corporation
AVX acquires Chengdu OK New Energy AVX Corporation says it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE).
Vesper names new SVP of worldwide sales & business development MEMS sensor company Vesper, announces that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive global growth.
Gigaphoton establishes new company in China Gigaphoton, a manufacturer of light sources used in semiconductor lithography, says it has established and started running the business of a new company – Gigaphoton China Inc. in China.
Sponsored content by SourcengineComponent Aggregators vs E-Commerce Marketplaces What is the difference between electronic component aggregators and a marketplace?
67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged the traditional component aggregators.
Prepare, adapt & overcome - how ‘to Brexit’ The looming, but yet unknown, effects of Brexit have forced companies to prepare for whatever may come. But how does one really prepare for unknown consequences?
Acal BFi signs pan-European agreement with Champs Technologies Acal BFi says it has added Champs Technologies to its magnetics portfolio. Acal BFi is a Europe-wide specialist technology supplier and design partner with a specialist portfolio of magnetic cores and inductive components products and services.
POET’s sale of DenseLight Semi to close POET Technologies Inc. announced the sale of its subsidiary, DenseLight Semiconductors Pte. Ltd. to DenseLight Semiconductor Technology (Shanghai) Co. Ltd. is scheduled to close on or before Friday, November 8, 2019.
Odyssey Semiconductor picks up wafer fab Ithaca, New York’s Odyssey Semiconductor Technologies, specializing in high-voltage power switching components and systems based on proprietary gallium nitride (GaN) processing technology, has acquired an integrated semiconductor design, fabrication, test, and packaging facility.
RBVC, Ford and BMW invests in flexible electric circuit start-up Robert Bosch Venture Capital GmbH (RBVC), the venture capital company of the Bosch Group, announces that it has completed a series B follow-on investment in CelLink Corporation.
Alex Davern to step down as CEO of National Instruments NI has announced that Alex Davern will step down as Chief Executive Officer of the company, effective January 31, 2020. The NI Board of Directors has appointed current President and COO, Eric Starkloff, as NI President and CEO, effective February 1, 2020.
RoodMicrotec takes leading role in APPLAUSE A consortium of 31 key players for packaging of electronics, optics and photonics, equipment suppliers and testing experts from 11 countries launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.Load more news