A molded chip scale package

Compared to existing Chip Scale Package (CSP) solutions, MCSP reduces package height by 50% and improves the mechanical robustness of the package by protecting the encapsulated die with a layer of molding compound. MCSP can easily replace a standard CSP by offering the same footprint, pin-out, and pitch, with the benefits of a more rugged and ultra-thin package. The MCSP encapsulates AOS's low on-resistance MOSFET silicon in a Green (halogen-free) molding compound, which end result is to give it a thinner and more robust structure to solve die chipping and placement issues associated with standard CSP products. "The Molded Chip Scale Package offers an innovative solution to ultra-slim designs while improving the package robustness compared to existing CSP solutions. The innovative package, along with the low on-resistance AOS MOSFET technology, provides designers of ultra-portable systems with a compelling new power management solution," said Peter Wilson, Director of Low Voltage MOSFETs at AOS. AOC2403 is a 20V 95mOhm P-Channel MOSFET housed in a halogen-fee MCSP. The package dimensions are 0.97mm x 0.97mm x 0.3mm. Pricing and Availability The AOC2403 is immediately available in production quantities with a lead-time of 12 weeks. The unit price for 1'000 pieces is USD 0.35.