Business | August 16, 2012
Corning MobileAccess leads; Commscope and TE Connectivity follow
Corning MobileAccess has been ranked number one in the latest DAS (Distributed Antenna System) equipment vendor matrix released by ABI Research.
This research is published as a part of a Competitive Assessment report on the in-building wireless coverage market, where DAS systems are the most widely deployed technology. Commscope and TE Connectivity claim overall second and third spots in the vendor matrix, which evaluates companies on the two main axes of “innovation” and “implementation”. The top three companies on the innovation scale include Corning MobileAccess, Zinwave, and Alvarion, while the top three companies on implementation are Commscope, Corning MobileAccess, and TE Connectivity. Aditya Kaul, practice director for mobile networks says, “While traditional incumbents like Commscope and TE Connectivity still dominate the DAS market due to their size and footprint, it is emerging vendors like Corning MobileAccess who are grabbing market share on back of their technology innovation in areas like single cable MIMO support, DAS optimization, and their unique CAT5 based DAS solution for small enterprises.” Kaul continues, “The next generation of vendors like Zinwave, Alvarion, SOLiD Technologies, and Optiway are the ones to watch out for as they each bring unique DAS innovations that push the limits on cost, flexibility, and scalability, especially when it comes to supporting multiple technologies and multiple operators on fewer infrastructure elements.” Kaul goes onto add, “The DAS market has seen major consolidation in the last few years, and as these fresh, small innovative vendors emerge onto the scene, it won’t be surprising if some of the large traditional base station vendors like Ericsson or Huawei make acquisitions, and establish a presence of DAS equipment in the indoor coverage market, which is a hotbed of activity right now.”
Dr. Arne Schneider takes over as CEO of Elmos in 2021 The Supervisory Board of Elmos Semiconductor has decided to extend the appointment of CEO Dr. Anton Mindl until the end of 2020. After this he will have had 15 successful years as CEO and will remain closely associated with the company as consultant.
Magna expands lighting capabilities by acquiring Wipac Czech Magna has agreed to acquire Wipac Czech s.r.o., a automotive lighting engineering firm located in Ostrava, Czech Republic.
Cree, STMicroelectronics fortify SiC agreement Cree Inc. and STMicroelectronics have expanded their existing multi-year, long-term silicon carbide wafer supply agreement to more than USD 500 million.
LPKF expands in Garbsen, Germany The laser specialist has started the construction of a new clean room factory for the production of glass microstructure components at its headquarters in Garbsen, Germany.
Sponsored content by EsemdaContract manufacturer Esemda opens new facility in Vilnius and expands EMS The new facility has been built with reserved space for future expansions. As Esemda constantly grows, it is of great importance to be able to rapidly increase production capacity in large volumes.
Cree, ABB form partnership for SiC technology Silicon carbide technology specialist Cree and ABB’s Power Grids business have announced a partnership to jointly expand the rollout of silicon carbide for semiconductors.
Soitec & Applied Materials to develop next-gen SiC substrates Designer and manufacturer of semiconductor materials, Soitec, is entering a joint development program with Applied Materials on next-generation silicon carbide substrates.
Swissbit to stay on top of demand with new Berlin fab Back in late July of 2018, Swissbit AG, broke ground on its new R&D and manufacturing facility in Berlin with the aim of tripling the production capacity of location. Now its already up and running.
Nuvia closes series A, eyes data center servers Santa Clara semiconductor design startup Nuvia Inc., formed earlier this year by three former top Apple Inc. design executives, has closed its series A round with USD 53 million secured.
Sponsored content by Z ElektronikaZ Elektronika opens new factory in Pécs To keep up with rapid growth of the company, on the 13th September Z Elektronika celebrated the grand opening of its new electronic design and manufacturing facility close to the highway in Pécs, Hungary, which adds new features and production site to its nearby location.
Ingun's going global; expands in Latin America and Eastern Europe Benjamin Sontag (INGUN Prüfmittel GmbH) gave a short update on expansion plans in Latin America and Eastern Europe.
Yageo to acquire KEMET in a $1.8 billion deal Yageo Corporation and KEMET Corporation have entered into a definitive agreement under which Yageo will acquire all of the outstanding shares of KEMET’s common stock for USD 27.20 per share in an all-cash transaction valued at USD 1.8 billion.
EVG and DELO partner to expand materials and process capabilities Supplier of wafer bonding and lithography equipment for the MEMS and semiconductor industry, EV Group (eVG), is partnering with DELO, a manufacturer of industrial high-tech adhesives, in the area of wafer-level optics.
Osram recommends current takeover offer from ams Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.
EpiWorld speeds up commercialisation of SiC devices with AIXTRON AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.
FlexEnable makes acquisition for flex displays FlexEnable, developer of flexible organic electronics, has purchased Merck's portfolio of high-performance organic thin-film transistor (OTFT) materials.
Samsung’s CPU project ends, layoffs in CA and TX Samsung has confirmed in a letter to the Texas Workforce Commission that layoffs as a result of the closure of the CPU project at the Samsung R&D Center (SARC) in Austin, Texas and the San Jose Advanced Computing Lab (ACL) in San Jose, California, will begin December 31.
Marvell completes acquisition of Avera Semi Marvell has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GlobalFoundries.
IAR Systems opens office in Taiwan Swedish IAR Systems, a supplier of software tools and services for embedded development, says the company is expanding in Asia with the opening of an office in Taipei, Taiwan.
ZF and Cree partners up to advance the electric drive ZF Friedrichshafen is teaming up with silicon carbide semiconductor specialist Cree, to create industry-leading, highly efficient electric drivelines.
Broadcom completes acquisition of Symantec Enterprise Security business Semiconductor company Broadcom, says that the company has completed its acquisition of the Enterprise Security business of Symantec Corporation
AVX acquires Chengdu OK New Energy AVX Corporation says it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE).
Vesper names new SVP of worldwide sales & business development MEMS sensor company Vesper, announces that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive global growth.
Gigaphoton establishes new company in China Gigaphoton, a manufacturer of light sources used in semiconductor lithography, says it has established and started running the business of a new company – Gigaphoton China Inc. in China.Load more news