Business | March 07, 2012
Six upcoming trends in the DRAM & NAND Flash industries
The following article presents a forecast of six major DRAM and NAND Flash industry trends in 2012-2015.
Trend-1: Mainstream PC DRAM specification DDR3 to dominate market until 2014 DDR3 has been the mainstream PC DRAM specification since 2011, and DRAMeXchange expects it will remain so until 2014. Although JEDEC will officially announce standards for DDR4 in 2012, DRAMeXchange is conservative as to whether the new specification will follow the historical pattern set by DDR and DDR2 and hit the market in 2014-2015, as the marginal benefit to PC performance provided by DDR4 will be limited. However, Intel will still hold decisive influence over the matter. Trend-2: Maturity of TSV and 2.5D/3D IC technology will influence Mobile DRAM mainstream specification Since 2011, the mainstream specification for mobile DRAM chips has been LPDDR 2Gb. 2Gb LPDDR2 shipment volume is expected to see rapid growth in 2012, replacing LPDDR as the mainstream. In the future, mobile device bandwidth requirements will continue increasing to meet 3D multimedia needs; for the current maximum LPDDR2 bandwidth is only enough to fulfill demand in 2012. LPDDR3 is expected to take over in 2013. However, DRAMeXchange believes the competition between the LPDDR series and Wide I/O will continue in order to meet bandwidth requirements in 2014-2015. DRAMeXchange anticipates that the future maturity of TSV and 2.5D/3D IC technology will decide whether or not Wide I/O will rise in popularity. Trend-3: Ultrabook to become battleground for PC and Mobile DRAM In 2011, the mainstream ultrabook chip specification was DDR3 2Gb, and standard content per box was 4GB. In the future, as Intel’s new Ivy Bridge and Haswell platforms hit the market, possible DRAM choices will include DDR3L and LPDDR3. This is an indication that ultrabooks will be a battleground for PC and mobile DRAM. Mobile DRAM has the advantage of supporting ultrabook features such as AOAC (Always On, Always Connected) and quick recovery while consuming less power than PC DRAM, thereby meeting the ultrabook standby time requirement. DRAMeXchange expects if mobile DRAM is able to successfully break into the ultrabook supply chain, the former’s market size may exceed that of the latter to become the largest DRAM application market in 2015. Trend-4: SSD unit cost may fall below USD 1 mark in 2H12, growth potential to be unleashed After SSD manufactured on the latest process technology enters mass production in 2H12, unit cost may fall below USD 1 – the pricing sweet spot the market has been anticipating. When this occurs, DRAMeXchange expects ultrabook makers will transition from adopting hybrid HDD solutions to pure SSD solutions, and mainstream capacity will increase to 128GB. Ultrabook market share is expected to rise rapidly beginning in 3Q12. SSD NAND Flash consumption volume is expected to increase from 5.1% in 2011 to 15% in 2012. SSD will become the NAND Flash application product with the most explosive growth momentum. Trend-5: SATA 3.0 to be main PC-SSD Interface, may see upgrade to higher speed, “PCle-like” interface in the future In 2011, the standard data transfer interface used by PC-SSD was SATA 2.0. In 2012, after Ivy Bridge hits the market, SATA 3.0 will gradually become the mainstream interface, pushing bandwidth to the 600MB/s mark. However, once ONFI 3.0 and toggle DDR 2.0 NAND Flash enters mass production, the SSD transfer speed bottleneck will move from the NAND Flash chip to the IC controller. This development has already caused SATA-IO to begin working on SATA Express standards(note: SATA Express integrates SATA software infrastructure and PCle transfer interface). SATA Express’ maximum transfer speeds will reach 1000MB/s and 2000MB/s. According to historical patterns, Intel could introduce new platforms with support for SATA Express or “PCle-like” high-speed interfaces to maximize the potential of ONFI 3.0 or toggle DDR 2.0 in 2014-2015 at the earliest. Trend-6: As system products bring “affordable elegance”, DRAM and NAND Flash competition heats up While DRAM and NAND Flash generally make up for each other’s shortcomings, as system products like ultrabooks and smartphones gradually exhibit a high quality, low price trend, the competition between DRAM and NAND Flash will only increase. DRAMeXchange believes, restricted by limited budgets, OEM/ODMs will devote their resources to NAND Flash as opposed to DRAM; increased product performance due to NAND Flash upgrades are more apparent, making it easier to attract consumers.
Sensata acquires Preco Sensata Technologies Inc. has acquired vehicle safety technology company PRECO Electronics, LLC.
It's official - Analog Devices will acquire Maxim Integrated Analog Devices, Inc. announced a definitive agreement under which ADI will acquire Maxim in an all stock transaction that values the combined enterprise at over USD 68 billion.
GaAs RF revenue projected to decline by 3.8% in 2020 RF front-end component IDM and foundry revenues will be affected under the dual influences of the COVID-19 pandemic and the Chinese government’s policy of decoupling from the U.S., driven by the ever-intensifying U.S.-China trade war that began in 2019, according to TrendForce’s latest investigations.
X-FAB on track to resume production after cyber attack Following the cyber attack that occurred on July fifth – which resulted in the company shutting down its IT systems and production lines – the company says it has resumed production at one of its manufacturing sites.
Sponsored content by Pegasus Components GmbHThe open market for electronic components as an opportunity in the current crisis. The past few months have also led to bottlenecks in the market for electronic components. The open market offers an attractive solution. Independent distributors like Pegasus Components react quickly and flexibly. Through procurement and stock items they offer a reliable as well sustainable alternative.
Rivian adds additional funding in investment round The electrics car manufacturer says it has closed an investment round of USD 2.5 billion. The financing was led by funds and accounts advised by T. Rowe Price Associates, Inc.
A new massive semiconductor deal on the horizon? Analog Devices Inc. (ADI) is reportedly in advanced talks with Maxim Integrated regarding a potential acquisition of the analog IC manufacturer.
ACM Research starts construction of new facility in Shanghai ACM Research, a supplier of wafer cleaning technologies for semiconductor devices, says that its operating subsidiary ACM Research (Shanghai), has begun construction of its new development and production facility in the Lingang Special Area of China (Shanghai) Pilot Free Trade Zone.
ALLOS Semiconductors has sold its high power electronics and RF business AZUR SPACE has acquired the electronics business of GaN-on-Si epiwafer expert ALLOS Semiconductors.
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STMicroelectronics team up with Fingerprint Cards Swedish Fingerprint Cards has teamed with global semiconductor powerhouse, STMicroelectronics, to develop an advanced Biometric System-on-Card (BSoC) solution based on fingerprint-recognition technology.
U.S.: Cancellation of Preferential Treatment for Hong Kong to impact chip industry The U.S. Department of Commerce announced on June 29 that the newly instituted Hong Kong national security law by the Chinese government will increase “the risk that sensitive U.S. technology will be diverted to [the Chinese government]”; the Department therefore put a temporary stop to the preferential treatment the U.S. had afforded to Hong Kong.
Arm to strengthen focus on core semiconductor IP business growth Arm is looking to strengthen its focus on growth and profitability. To achieve this the company has proposed strategic organisational changes – which involves the transferring of businesses.
ROHM and Leadrive establish a joint laboratory ROHM and Leadrive Technology, a Chinese manufacturer of automotive powertrain for new energy vehicles, have already held the opening ceremony for their joint laboratory on SiC technology in the China (Shanghai) Pilot Free Trade Zone (Lingang New Area).
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Imagination announces latest licensing deal with NXP Imagination Technologies says that NXP has extended its license for Imagination’s Ethernet Packet Processor (EPP) IP for use in S32 vehicle network processors.
Synaptics to buy rights to Broadcom’s Wireless IoT connectivity business Synaptics Incorporated has signed definitive agreements under which Synaptics will acquire certain assets and manufacturing rights associated with the wireless IoT business of Broadcom for approximately USD 250 million in an all-cash transaction.
Apple to start mass producing Mac SoC, projected to cost under US$100 According to the latest investigations by TrendForce, Apple officially unveiled its self-designed Mac SoC processors based on the ARM architecture in June, with the market release of the first Mac device with Apple Silicon (which broadly refers to chips designed by Apple) scheduled to take place by the end of this year.
Mini LED supply chain to benefit from Apple’s new 12.9-inch iPad Pro As Apple’s upcoming release of products featuring Mini LED backlight generates a growth in Mini LED demand, the company has also stimulated actors in the Mini LED supply chain to increase their production capacities.
National Instruments completes acquisition of OptimalPlus NI has officially closed the acquisition of OptimalPlus, a data analytics software provider for the semiconductor, automotive and electronics industries.
LeddarTech acquires VayaVision LeddarTech has acquired sensor fusion and perception software company VayaVision.
ON Semi to provide Danfoss with high power devices ON Semiconductor will supply Danfoss Silicon Power with high power IGBTs and diodes for inverter traction modules in the fast growing electric vehicle market.
X-FAB hit by cyber attack On the fifth of July, the mixed signal foundry expert, was the target of a cyber security attack.
UK and France on the map for Huawei Back in 2018, Huawei acquired 500 acres of land in Cambridge. Now the first phase of the Huawei Campus was approved by the local council and the company is gearing up to start the expansion. Adding to that, in late February, the Chinese telecom giant said it intends to build an automated factory will focus on 4G and 5G equipment in France.
Jenoptik is looking to accelerate growth with acquisition of TRIOPTICS Jenoptik is acquiring 100% of the shares in TRIOPTICS GmbH, a supplier of test equipment and manufacturing systems for optical components and sensors.
Global microelectronics market with overall stable development "Although the growth path of the global microelectronics market is intact, on a long-term trend-line, it declined by 12.1 percent to USD 412 billion in 2019," said Dr. Sven Baumann, ZVEI expert for microelectronics, sensors and actuators.
Jörg Doblaski takes on the role of X-FAB CTO X-FAB Silicon Foundries announced the appointment of Jörg Doblaski as its new Chief Technology Officer (CTO). He fills the role of former CTO Dr. Jens Kosch, who is becoming an X-FAB Fellow and will serve as an adviser to the company’s CEO Rudi De Winter.Load more news
- U.S.: Cancellation of Preferential Treatment for Hong Kong to impact chip industry
- Apple to start mass producing Mac SoC, projected to cost under US$100
- Arm to strengthen focus on core semiconductor IP business growth
- ALLOS Semiconductors has sold its high power electronics and RF business
- Delphi Technologies awarded new power electronics business