Business | March 07, 2012
Six upcoming trends in the DRAM & NAND Flash industries
The following article presents a forecast of six major DRAM and NAND Flash industry trends in 2012-2015.
Trend-1: Mainstream PC DRAM specification DDR3 to dominate market until 2014 DDR3 has been the mainstream PC DRAM specification since 2011, and DRAMeXchange expects it will remain so until 2014. Although JEDEC will officially announce standards for DDR4 in 2012, DRAMeXchange is conservative as to whether the new specification will follow the historical pattern set by DDR and DDR2 and hit the market in 2014-2015, as the marginal benefit to PC performance provided by DDR4 will be limited. However, Intel will still hold decisive influence over the matter. Trend-2: Maturity of TSV and 2.5D/3D IC technology will influence Mobile DRAM mainstream specification Since 2011, the mainstream specification for mobile DRAM chips has been LPDDR 2Gb. 2Gb LPDDR2 shipment volume is expected to see rapid growth in 2012, replacing LPDDR as the mainstream. In the future, mobile device bandwidth requirements will continue increasing to meet 3D multimedia needs; for the current maximum LPDDR2 bandwidth is only enough to fulfill demand in 2012. LPDDR3 is expected to take over in 2013. However, DRAMeXchange believes the competition between the LPDDR series and Wide I/O will continue in order to meet bandwidth requirements in 2014-2015. DRAMeXchange anticipates that the future maturity of TSV and 2.5D/3D IC technology will decide whether or not Wide I/O will rise in popularity. Trend-3: Ultrabook to become battleground for PC and Mobile DRAM In 2011, the mainstream ultrabook chip specification was DDR3 2Gb, and standard content per box was 4GB. In the future, as Intel’s new Ivy Bridge and Haswell platforms hit the market, possible DRAM choices will include DDR3L and LPDDR3. This is an indication that ultrabooks will be a battleground for PC and mobile DRAM. Mobile DRAM has the advantage of supporting ultrabook features such as AOAC (Always On, Always Connected) and quick recovery while consuming less power than PC DRAM, thereby meeting the ultrabook standby time requirement. DRAMeXchange expects if mobile DRAM is able to successfully break into the ultrabook supply chain, the former’s market size may exceed that of the latter to become the largest DRAM application market in 2015. Trend-4: SSD unit cost may fall below USD 1 mark in 2H12, growth potential to be unleashed After SSD manufactured on the latest process technology enters mass production in 2H12, unit cost may fall below USD 1 – the pricing sweet spot the market has been anticipating. When this occurs, DRAMeXchange expects ultrabook makers will transition from adopting hybrid HDD solutions to pure SSD solutions, and mainstream capacity will increase to 128GB. Ultrabook market share is expected to rise rapidly beginning in 3Q12. SSD NAND Flash consumption volume is expected to increase from 5.1% in 2011 to 15% in 2012. SSD will become the NAND Flash application product with the most explosive growth momentum. Trend-5: SATA 3.0 to be main PC-SSD Interface, may see upgrade to higher speed, “PCle-like” interface in the future In 2011, the standard data transfer interface used by PC-SSD was SATA 2.0. In 2012, after Ivy Bridge hits the market, SATA 3.0 will gradually become the mainstream interface, pushing bandwidth to the 600MB/s mark. However, once ONFI 3.0 and toggle DDR 2.0 NAND Flash enters mass production, the SSD transfer speed bottleneck will move from the NAND Flash chip to the IC controller. This development has already caused SATA-IO to begin working on SATA Express standards(note: SATA Express integrates SATA software infrastructure and PCle transfer interface). SATA Express’ maximum transfer speeds will reach 1000MB/s and 2000MB/s. According to historical patterns, Intel could introduce new platforms with support for SATA Express or “PCle-like” high-speed interfaces to maximize the potential of ONFI 3.0 or toggle DDR 2.0 in 2014-2015 at the earliest. Trend-6: As system products bring “affordable elegance”, DRAM and NAND Flash competition heats up While DRAM and NAND Flash generally make up for each other’s shortcomings, as system products like ultrabooks and smartphones gradually exhibit a high quality, low price trend, the competition between DRAM and NAND Flash will only increase. DRAMeXchange believes, restricted by limited budgets, OEM/ODMs will devote their resources to NAND Flash as opposed to DRAM; increased product performance due to NAND Flash upgrades are more apparent, making it easier to attract consumers.
Osram recommends current takeover offer from ams Osram says it has concluded a business combination with Austrian chipmaker ams and is recommending its shareholders to accept the current takeover offer.
EpiWorld speeds up commercialisation of SiC devices with AIXTRON AIXTRON SE has provided an AIX G5 WW C system to EpiWorld International Co., Ltd for the further development of next generation silicon carbide (SiC) epitaxial wafers mainly used for the manufacturing of power devices for automotive applications.
FlexEnable makes acquisition for flex displays FlexEnable, developer of flexible organic electronics, has purchased Merck's portfolio of high-performance organic thin-film transistor (OTFT) materials.
Sponsored content by SourcengineComponent Aggregators vs E-Commerce Marketplaces What is the difference between electronic component aggregators and a marketplace?
67% of a buyer’s journey is now done digitally. Learn how marketplaces emerged as full-cycle procurement platforms and challenged the traditional component aggregators.
Samsung’s CPU project ends, layoffs in CA and TX Samsung has confirmed in a letter to the Texas Workforce Commission that layoffs as a result of the closure of the CPU project at the Samsung R&D Center (SARC) in Austin, Texas and the San Jose Advanced Computing Lab (ACL) in San Jose, California, will begin December 31.
Marvell completes acquisition of Avera Semi Marvell has completed its acquisition of Avera Semiconductor, the Application Specific Integrated Circuit (ASIC) business of GlobalFoundries.
IAR Systems opens office in Taiwan Swedish IAR Systems, a supplier of software tools and services for embedded development, says the company is expanding in Asia with the opening of an office in Taipei, Taiwan.
Sponsored content by EsemdaContract manufacturer Esemda opens new facility in Vilnius and expands EMS The new facility has been built with reserved space for future expansions. As Esemda constantly grows, it is of great importance to be able to rapidly increase production capacity in large volumes.
ZF and Cree partners up to advance the electric drive ZF Friedrichshafen is teaming up with silicon carbide semiconductor specialist Cree, to create industry-leading, highly efficient electric drivelines.
Broadcom completes acquisition of Symantec Enterprise Security business Semiconductor company Broadcom, says that the company has completed its acquisition of the Enterprise Security business of Symantec Corporation
AVX acquires Chengdu OK New Energy AVX Corporation says it has completed the purchase of Chengdu OK New Energy, Ltd. (COKNE).
Vesper names new SVP of worldwide sales & business development MEMS sensor company Vesper, announces that Lorenzo Ponzanelli has joined the company as senior vice president of worldwide sales and business development, overseeing sales strategy and execution to drive global growth.
Sponsored content by Nordson ASYMTEKStart-to-finish conformal coating with reliability and efficiency Nordson ASYMTEK’s flexible, modular, Panorama™ S-Line delivers conformal coating process control in a space-saving footprint with overlapping line processes that minimize manufacturing floor space. This innovative, patent-pending line layout trims 50% of the line’s length by using the lower compartment in each piece of equipment for functional use. Combined with Nordson ASYMTEK’s global support, this complete conformal coating line delivers quality, product reliability, efficiency, and safety for all your conformal coating applications.
Gigaphoton establishes new company in China Gigaphoton, a manufacturer of light sources used in semiconductor lithography, says it has established and started running the business of a new company – Gigaphoton China Inc. in China.
Prepare, adapt & overcome - how ‘to Brexit’ The looming, but yet unknown, effects of Brexit have forced companies to prepare for whatever may come. But how does one really prepare for unknown consequences?
Acal BFi signs pan-European agreement with Champs Technologies Acal BFi says it has added Champs Technologies to its magnetics portfolio. Acal BFi is a Europe-wide specialist technology supplier and design partner with a specialist portfolio of magnetic cores and inductive components products and services.
POET’s sale of DenseLight Semi to close POET Technologies Inc. announced the sale of its subsidiary, DenseLight Semiconductors Pte. Ltd. to DenseLight Semiconductor Technology (Shanghai) Co. Ltd. is scheduled to close on or before Friday, November 8, 2019.
Sponsored content by NCAB Group Benelux B.V.Failure is not an option for a PCB More than 30% of the Gerbers NCAB Group Benelux B.V. reviews, have problems. However, the PCB are integrated in key end-user product with more and more High Tech PCB. We are here to support you on the new technologies growth to maintain a high reliability and quality. Contact us to review it together.
Odyssey Semiconductor picks up wafer fab Ithaca, New York’s Odyssey Semiconductor Technologies, specializing in high-voltage power switching components and systems based on proprietary gallium nitride (GaN) processing technology, has acquired an integrated semiconductor design, fabrication, test, and packaging facility.
RBVC, Ford and BMW invests in flexible electric circuit start-up Robert Bosch Venture Capital GmbH (RBVC), the venture capital company of the Bosch Group, announces that it has completed a series B follow-on investment in CelLink Corporation.
Alex Davern to step down as CEO of National Instruments NI has announced that Alex Davern will step down as Chief Executive Officer of the company, effective January 31, 2020. The NI Board of Directors has appointed current President and COO, Eric Starkloff, as NI President and CEO, effective February 1, 2020.
RoodMicrotec takes leading role in APPLAUSE A consortium of 31 key players for packaging of electronics, optics and photonics, equipment suppliers and testing experts from 11 countries launched a new project, “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” simply called APPLAUSE.
Nidec provides an update on its Omron deal Nidec Corporation previously announced a plan to acquire Omron Automotive Electronics from Omron Corporation back inn April, 2019.
GlobalFoundries and TSMC bury the hatchet GlobalFoundries and TSMC says that the companies are dismissing all litigation between them as well as those that involve any of their customers.
Lite-On shareholders approve the Diodes deal Lite-On Semiconductor held a special meeting for its shareholders on October 25, 2019 during which the proposed acquisition by Diodes and the associated Share Swap Agreement were approved.Load more news