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TSMC to phase out 6-inch wafer production
TMSC is planning to gradually phase out its 6-inch wafer production over the next two years, while consolidating its 8-inch wafer operations to enhance efficiency, Reuters reports.
The semiconductor giant told Reuters that the decision follows a comprehensive review of market conditions and is in line with TSMC’s long-term business strategy. The company emphasised that it is working closely with clients to ensure a smooth transition during the phase-out period – meeting customer requirements during this time.
TSMC added that the move will not impact its previously stated financial targets. Currently, the company operates a single 6-inch wafer fabrication facility and four 8-inch fabs in Taiwan for mature-node chip production.