Electronics Production | August 27, 2007
Molex expands copper flex production
Molex Incorporated has begun production at its new facility in St. Paul, Minn, the US. From high speed signals to power requirements, Molex Copper Flex assemblies provide solutions for a wide array of packaging problems, including situations where high signal speed, low loss and real estate are essential.
Molex relocated to the new facility from the former Century Circuits operation Molex acquired in 2006. The new, expanded facility offers improved manufacturing process flow and provides more than double the production capacity for Copper Flex Products. The company has also made significant investments in new equipment to ensure that the facility is both more efficient and capable of producing expanded product technologies for the future. The new facility features improved temperature and humidity controls that provide the capability to produce multi-layer flex products with more than 20 layers, which is more than a 10 percent increase in circuit density. Molex can now also prototype and manufacture rigid flex assemblies entirely under one roof. "Molex continues to invest in its operational facilities to provide the most efficient manufacturing processes and best possible products to our customers," said Todd Hester, general manager, printed circuit products group, Molex Incorporated. “Our new Copper Flex facility will not only increase our product output, but provide a better work environment for employees to manufacture the industry's leading product solutions." The location also employs new lean manufacturing processes that support progressive manufacturing techniques that will improve plant efficiency and overall product quality. The implementation of Class 10,000 clean room capabilities will also allow for future product directions for fine line flex products. Designed to be significantly lighter and thinner than traditional circuit boards, Copper Flex allows products to naturally be lighter without minimizing the product's high-speed integrity. The flexible design can be bent around hardware and even over itself in order to fit into much smaller device enclosures. Materials used in the construction of the circuit assemblies have closely matching thermal expansion rates that allow Copper Flex to be resistant to hot and cold temperatures, as well as large temperature fluctuations. This property is essential for situations where high speed, low loss and real estate are important to maintain a system's operational integrity. "Molex Copper Flex products meet the challenging needs of today's technology driven world and are able to replace a variety of electronic interconnects, simplifying the production process and making it more dependable," said Gary Manchester, marketing director, Molex Incorporated. “Molex has invested in its capabilities to ensure we produce Copper Flex materials that are superior, quality products." Available in single-sided, double-sided, multi-layer and rigid flex configurations, Molex Copper Flex materials can provide a high yield of circuits using the latest instruments, which can precisely design products to fit specifications. In addition, new facility machinery allows for the transportation of ultrathin materials used in the manufacturing of advanced multilayer and rigid-flex designs, ensuring that products will assure the integrity required in the most advanced designs.
dSPACE adds West Coast office Simulation and validation specialist dSPACE has opened a Silicon Valley office in San Jose, California as part of its strategic realignment.
Cogiscan, BasiCAE form strategic partnership Quebec-based Cogiscan Inc. has announced a partnership with China’s BasiCAE Technology, a provider of traditional shop control systems and software customization services.
Korea hits new record of industrial robots in operation The World Robotics report presented by the International Federation of Robotics (IFR) shows a new record stock of about 300,000 operational industrial robots in the Republic of Korea in 2018 (+10%).
Keytronic starts production at its new Vietnam facility Keytronic Corporation says it has started shipping product from its new Da Nang, Vietnam manufacturing facility.
USI's looking to accelerate expansion - acquires Asteelflash It looks like we’re ending 2019 with a bang. One of the worlds biggest EMS providers wants to acquire one of Europe’s largest electronics manufacturers.
Devon manufacturer adds capabilities in Dorset via acqusition Devon-based PCB manufacturer, EuroTech Group, is acquiring PCB manufacturer Lyncolec, based in Poole, Dorset.
Kyocera and TactoTek collaborate on IMSE solution Kyocera and TactoTek has singed a marketing agreement which aims to bring IMSE solutions to several new market segments, including industrial and automotive components, electronic devices, and more.
IPC: Unanimous approval of USMCA needed IPC issued a statement this week expressing support of the recently bi-partisan approval of the United States-Mexico-Canada Agreement (USMCA), and a strong desire for legislative approval by Canada, Mexico, and the U.S.
Nordson's CFO to retire in 2020 after 30 years with the company Nordson's Executive Vice President and Chief Financial Officer, Gregory A. Thaxton, plans to retire in 2020 after thirty successful years with the company, with the last 12 years as CFO.
KUKA restructures subdivision due to economic uncertainty KUKA is restructuring a subdivision in the Robotics segment that is responsible for automated manufacturing solutions such as cells and special machines.
PCB industry recovers slightly in Q3 PCB manufacturers in the D/A/CH region were able to increase sales sequentially in the third quarter of 2019 by 1.1%. However, sales figures are 11% lower than those recorded for the third quarter of 2018, reports the industry association ZVEI PCB and Electronic Systems.
Garz & Fricke moves into new HQ in Hamburg-Harburg Garz & Fricke GmbH continues to expand. As of late October, the business operations of the HMI and Panel PC specialist will be transferring to the new headquarters in in Hamburg-Harburg.
TF Massif Technologies taps new CEO British Columbia-based TF Massif Technologies has announced the appointment of Tom Peregoodoff as the company’s new chief executive officer.
DoJ: Google, Fitbit deal under review The U.S. Justice Department is looking into anti-trust issues concerning Google's bid to buy Fitbit Inc.
L3Harris Tech secures U.S. Marine Corps order L3Harris Technologies received a USD 50 million follow-on delivery order for Falcon III AN/PRC-160 HF radios and related equipment from the U.S. Marine Corps .
Metair completes Romanian lithium-Ion battery cell factory South African energy storage company, Metair Investments, says that its Romanian units Prime Batteries and Rombat have completed the installation of the group's first Lithium-Ion battery cell manufacturing and assembly facility in Bucharest, Romania.
£5m award marks ‘topping out’ of Cardiff research powerhouse An GBP 80 million Cardiff University powerhouse for Welsh scientific research has been ‘topped out’ by Bouygues UK – backed by over GBP5 million support from Welsh Government and industrial partners.
Advanced Energy expands with new lab near Frankfurt Advanced Energy Industries, Inc. has opened its Advanced Materials Processing (AMP) Showcase Lab near Frankfurt, Germany.
TTM Technologies unveils NY engineering center On the heels of its acquisition of manufacturing and IP assets from i3 Electronics Inc., TTM Technologies has announced the opening of a new engineering center in Binghamton, NY.
EU Commission to support pan-European battery development Seven member states will provide, in the coming years, up to EUR 3.2 billion in funding to support research and innovation in the common European priority area of batteries.
The pulse of the electronics industry Growth is slowing worldwide and the industry’s outlook is less optimistic than in previous quarters, although it is still generally positive, according to the results of IPC’s fourth-quarter 2019 Pulse of the Electronics Industry survey.
Teradyne delivers J750 semiconductor test system to Ardentec Teradyne has hit a milestone with the 6,000th shipment of the J750 family of semiconductor testers.
Season Group names new SvP for global business development Season Group has appointed Stephen Tsao as the company's new Senior Vice President, Global Business Development.
Zestron appoints new sales director Europe Mr. Adam Meinert recently joined ZESTRON as the Sales Director of Europe.Load more news