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Electronics Production | October 18, 2006

Flip Chip and WLPs experience strong growth

According to a new report frpm TechSearch International Flip chip and wafer-level package sales will grow more than 24% between 2005 and 2010.

The performance and form factor are expected to continue to drive the flip chip development. Flip chip interconnect is expanding into high performance logic to a variety of devices found in wireless products. An increasing number of suppliers of ASICs, FPGAs, DSPs, chipsets, graphics, and microprocessors are expanding their use of flip chip in package (FCIP).
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