© Hentec RPS
PCB |
TTM Technologies invests in new Hentec/RPS system
TTM Technologies has purchased a Pulsar solderability testing system from Hentec Industries/RPS Automation.
The Pulsar utilises the highly proven dip-and-look test method which is a qualitative type test performed by comparative analysis after specimens are dipped in a bath of flux and molten solder.
An advantage of the dip-and-look method is since it is based on comparative analysis it can be performed rapidly by shop floor personnel with minimal training as well as requiring significantly lower capital investment then a wetting balance test system. The Pulsar solderability testing system complies with all applicable solderability test standards including MIL-STD-883 Method 2003, IPC J-STD-002 and MIL-STD-202 Method 208.
