Topline Electronics invests in component lead tinning system
Hentec Industries/RPS Automation has announced that Topline Electronics has finalized the purchase of a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning machine.
The Odyssey 1750 is described as a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys, a press release reads.
Headquartered in Patterson, New Jersey, Topline Electronics is a supplier of dummy electronic components for the electronics assembly industry.
Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.