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Electronics Production | July 08, 2022

Topline Electronics invests in component lead tinning system

Hentec Industries/RPS Automation has announced that Topline Electronics has finalized the purchase of a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning machine.

The Odyssey 1750 is described as a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys, a press release reads. 

Headquartered in Patterson, New Jersey, Topline Electronics is a supplier of dummy electronic components for the electronics assembly industry. 

Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.  The Odyssey 1325 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards. 

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November 15 2022 12:19 am V20.10.16-2
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