© otnaydur dreamstime.com General | April 11, 2019
Kyocera and Vicor team up on advanced PoP solutions
Kyocera Corporation and Vicor Corporation are teaming up on next-gen Power-on-Package solutions to maximise performance and minimise time-to-market for emerging processor technologies, the companies announced today.
As a part of the collaboration between the two comapnies, Kyocera will provide the integration of power and data delivery to the processor with organic packages, module substrates and motherboard designs. Vicor will provide Power-on-Package current multipliers enabling high density, high current delivery to processors. This collaboration aims to address the rapid growth of higher performing processors, which has created proportionate growth and complexity in high-speed I/Os and high current consumption demands. Vicor’s Power-on-Package technology enables current multiplication within the processor package, allowing for higher efficiency, density, and bandwidth. Providing current multiplication within the package can reduce interconnect losses by up to 90%, while allowing processor package pins, typically required for high current delivery, to be reclaimed for expanded I/O functionality, a joint press release reads. Kyocera has cultivated design expertise by applying Vicor's Power-on-Package devices in multiple applications. Through this collaboration, Kyocera and Vicor aims bring new solutions for AI and high-performance processor applications to market.