SMT & Inspection | May 08, 2006
Scanflex JTAG/Boundary Scan<br>integrates into Takaya Flying Prober
GÖPEL electronic, vendor of IEEE-Std. 1149.x compliant JTAG/Boundary Scan solutions, and ITOCHU SysTech have developed a Boundary Scan option for TAKAYA Flying Probe Testers (FPT) series 8xxx and 9xxx within the scope of an OEM agreement.
The solution is based upon the integration of the CASCON GALAXY® software and new SCANFLEX® hardware into the flexible Flying Probe test system, involving the FPT probes. “Combining the flexible abilities of TAKAYA Flying Probe test system with GÖPEL electronic JTAG/Boundary Scan test advantages, increases the customers' test opportunities of both products in the market. Due to this development cooperation we're presently able to offer a highly powerful solution.” Stefan Meissner, GÖPEL electronic's spokesman gladly announces. “In particular, the parallel control of the Flying Probes – independent from serial TAP vectors – results in a considerable improvement in test quality as well as process handling. Each probe can be an additional virtual scan pin in all types of Boundary Scan tests without modifying projects and test programs already generated at the lab stage.” Boris Opfer, Product Manager, ICT Sales and Technical Services for ITOCHU SysTech, adds: “Only by the long-term partnership with GÖPEL electronic was it possible to provide this innovative solution not exclusively for the new generation of TAKAYA Flying Probe systems but previous systems can also be refitted. Now existing TAKAYA users are able to upgrade their test solutions and benefit from GÖPEL electronic's CASCON software and SCANFLEX® hardware products.” In terms of hardware, the integration is based on the high-performance SCANFLEX® PCI controller models SFX/PCI1149-x with programmable TCK frequencies up to 20MHz (A type) and 50MHz (B type), respectively. The UUT connection is completed by using a SCANFLEX® transceiver model SFX-TAP4/C, which provides four parallel TAPs, interposing relays and up to eight programmable interface parameters for the optimal adaptation to the UUT The UUT is connected by means of the standard interface of the Flying Prober. The reliable SCANFLEX® TAP-Transceiver with CION™ interface enables the direct control of UUTs up to 1.5m distances. No additional signal conditioning electronics is required. The probes are parallel controlled by the recently introduced multi functional module SFX-5704. Thus, each probe can digitally measure and drive, and can be used for scanning analog voltage. In terms of software, the complete CASCON GALAXY® development and execution environment was integrated into the operating system via the user friendly CAPI interface (CASCON Application Programming Interface). Thus, all CASCON software editions can be configured per enable codes on the FPT. The Flying Probes' control is managed with the integrated SFX-5704 module by means of HYSCAN™ technology implemented in CASCON GALAXY®. HYSCAN™ enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors through a special emulation process. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The manual or automated generation of test vectors, the debugging, and the fault diagnostic is executed by the native JTAG/Boundary Scan tools. Each Flying Probe acts as a Boundary Scan pin at the contacted net, completely transparent to the user. Special knowledge about the detailed runs is not necessary because data handling is executed automatically. First systems incl. customer application have already been delivered in the first quarter of 2006.
EUV photoresist company Inpria raises $31 million in funding Inpria, a pioneer in high-resolution metal oxide photoresists for extreme ultraviolet lithography (EUV), has secured USD 31 million in Series C funding from a broad syndicate including two of the biggest names within the semiconductor manufacturing space.
Semiconductor industry avoids direct impact of coronavirus The semiconductor industry appears to have escaped the direct impact of the coronavirus crisis so far, but the market is likely to suffer the repercussions as the outbreak slows or suspends production among electronics manufacturers, according to Omdia.
Plessey partners with Axus Technology Plessey, an embedded technologies developer, is partnering with Axus Technology (Axus), a provider of CMP, wafer thinning and wafer polishing surface-processing solutions for semiconductor applications, to bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
GPV Electronics CN resumes production On 19 February 2020, the Chinese Central Government informed that all enterprises in the Guangdong province are now allowed to resume production.
Nano Dimension moves its main commercial activity to USA Nano Dimension announces that the company is establishing its headquarters for the Americas in South Florida.
Rockwell Automation inks deal for Italy’s ASEM Rockwell Automation Inc. has signed a purchase agreement to acquire digital automation technologies provider ASEM S.p.A.
IFR releases ‘Top Trends 2020 Robotics’ The International Federation of Robots (IFR) has forecasted an uptick of 2 million industrial factory robotic units in the next two years.
Paslin, Rivian fuel EV factory expansion The Paslin Company, a builder of robotic assembly lines for Tier 1 suppliers and OEM auto companies, is expanding in Warren, Michigan.
Nokia plans to acquire US-based company The Finnish telecom company is planning to acquire Elenion Technologies, a U.S.-based company focusing on silicon photonics technology.
neutec electronic to handle Asymtek and Dima in Switzerland Asymtek, a part of Nordson Electronics Solutions - announces that their distributor, neutec electronic AG, has expanded its representation of all Asymtek and DIMA products to the French-speaking areas of Switzerland.
BMZ subsidiary Poland reports successful business year 2019 BMZ Poland, the second largest production site of the BMZ Group, is expanding its production area and is reporting 10% sales growth and thereby reached record results for the business year 2019.
Scanfil CEO: ‘Our operations are making good progress’ The last quarter of 2019 was the strongest one for the EMS provider. Scanfil recorded a turnover of EUR 155 million, a growth of EUR 15 million or 10% year-over-year.
Prime Technological Services acquire ITS EMS provider Prime Technological Services LLC has acquired Georgia-based I Technical Services (ITS).
Florida’s Sypris snags BAE Systems contract Sypris Electronics LLC, a subsidiary of Sypris Solutions Inc., has won a contract award from London-based BAE Systems’ Electronic Systems sector.
Into the future, San Diego style IPC APEX EXPO, the North American electronics manufacturing industry’s biggest gig, has left the teenage years behind with this year’s 20th anniversary show held Feb 3-8 in San Diego.
5 semiconductor companies hold 53% of global wafer capacity The world’s top-five wafer capacity leaders each had capacity of more than 1,000,000 wafer starts per month, says IC Insights.
Global DRAM revenue holds steady in 4Q19 The DRAM inventory finally returned to a relatively normal level for most OEMs in 4Q19 after nearly three consecutive quarters of adjustments, says the DRAMeXchange research division of TrendForce.
Mitsubishi Electric completes new satellite production facility Mitsubishi Electric has completed construction of a new facility for the production of satellites at the company’s Kamakura Works in Kamakura, Japan.
ISS-Broadband delivered by Kongsberg Kongsberg equipment is to enable broadband transmission for the International Space Station (ISS) to 'significantly improve communication between the ESA astronauts manning the station and earth.
Mycronic receives order for an SLX mask writer Swedish equipment provider, Mycronic AB, has received an order for the new SLX mask writer from a customer in Asia. The customer already has mask writers from Mycronic.
A new production unit for mirror segments for ELT Safran's new production unit at the company's Saint-Benoît facility near Poitiers in central France will make the primary mirror segments for Europe's Extremely Large Telescope (ELT).
A more sustainable approach to semiconductor manufacturing Reuse; that is the key to driving environmental sustainability in global semiconductor manufacturing, says Steven Zhou, CEO of Moov Technologies.Load more news