© lavitreiu dreamstime.com Analysis | October 22, 2015
Intel's Dalian upgrade to help China’s market move forward
Intel announced on October 20 that it will convert its fab in Dalian, China, from making processor chips on the 65nm process to making 3D-NAND Flash chips, which is currently the most advanced memory chip product.
Intel also stated that it will invest up to USD 5.5 billion in this project and work with the local government in its implementation. The Dalian fab is scheduled to begin producing memory chips in the second half of 2016. The latest data from DRAMeXchange, a division of TrendForce, show that China is set to consume USD 6.67 billion worth of NAND Flash in 2015, accounting for 29.1% of the industry’s revenue for this year. The country is also projected to consume a third of the global NAND Flash demand in 2016, representing a giant leap in growth. DRAMeXchange Assistant Vice President Sean Yang said that the Dalian fab began operation in 2010 and its main products were CPUs made from 12-inch wafers using the 65nm process technology. Since the fab was not yielding profits at the expected level, Intel has decided to upgrade the fab so it can produce the more advanced 3D-NAND Flash chips. Besides raising the profitability of the Dalian fab, the global chip maker can take advantage of China’s soaring NAND-Flash demand. More importantly, Intel would be able to participate as a partner in the Chinese government’s efforts to establish a domestic memory industry. This fab conversion project is therefore a timely and mutually beneficial solution for all parties involved. Based on DRAMeXchange’s analysis of the capital investment and the plant’s capacity, the Dalian fab’s 3D-NAND Flash capacity in the initial period will be around 30,000~40,000 wafer starts per month. As the strategic alliance between Intel and Micron becomes ever tighter with their collaborations on 3D-NAND Flash and 3D X Point technologies, the Dalian fab will offer greater flexibility for their camp in capacity planning so that they can meet the exploding demand for SSD products. Yang added that even though the NAND Flash market will still be in oversupply from the fourth quarter of this year to the first quarter of next year, the Chinese government intends to continue and greatly accelerate the development of domestic supply chains for NAND Flash and SSDs during this slump. Notable examples include major Chinese memory module maker Netcom’s collaboration with U.S.-based controller chip designer Marvell and XMC’s recent efforts in developing its own 3D-NAND Flash technology. The Chinese government is also eagerly courting major international memory suppliers such as Samsung, which plans to raise its Xian fab’s capacity to 100,000 wafer starts per month in 2016. DRAMeXchange expects the Chinese NAND Flash market to see a much larger boom when Intel completes the conversion of its Dalian fab in the first half of next year.
Big Ass Fans adds third Hentec/RPS machine Complementing the purchase of two Hentec Industries/RPS Automation Vector 300 selective soldering machines in 2018, Big Ass Fans (BAF), a high-volume, low- speed (HVLS) airflow manufacturer, has just added a third machine to its factory in Newman Lake, Washington.
CE3 Electronics Inc. taps MIRTEC for 3D AOI technology Canada-based CE3 Electronics has purchased a MIRTEC MV-6 OMNI 3D AOI machine.
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AMTE Power and Britishvolt sign MoU for GigaFactory AMTE Power and Britishvolt plans to investigate collaborating to build the UK’s first full cycle battery cell GigaPlant, servicing the automotive and energy storage markets.
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Rolls-Royce takes heavy hit from COVID-19 – reduces workforce by 9000 The impact of COVID-19 on Rolls-Royce and the whole of the aviation industry is unprecedented. RR has already taken action to strengthen the financial resilience of its business and to reduce cash expenditure in 2020. However, this will not be enough.
Data Link Solutions to provide MIDS cabinet terminals to US Navy The U.S. Navy has awarded a USD 3.2 million production contract to Data Link Solutions (DLS), a joint venture between BAE Systems and Collins Aerospace, for new Multifunctional Information Distribution System (MIDS) cabinet terminals.
Incap restarts production in India In a move to contain the COVID-19 pandemic, the government of India instructed all state governments to introduce a lockdown in March. As a consequence, Incap had to close its factory in Karnataka, India on 23 March.
NAND Flash Revenue Undergoes 8.3% QoQ Growth in 1Q20 NAND Flash bit shipment in 1Q20 was relatively on par with 4Q19, says the DRAMeXchange research division of TrendForce. The overall ASP of NAND Flash products also climbed during the period. As a result, the global NAND Flash revenue for the quarter went up by 8.3% QoQ to USD 13.6 billion.
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NA semiconductor equipment industry posts April 2020 billings North America-based manufacturers of semiconductor equipment posted USD 2.26 billion in billings worldwide in April 2020 (three-month average basis), according to SEMI.
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