Ad
Ad
Ad
Ad
Ad
SMT & Inspection | March 30, 2006

Almit to launch new solder paste at Nepcon

Almit mainly operating in Germany, U.K. and Japan will launch its new SAC soldering paste LFM-48 TM HP at Nepcon.
The new lead-free soldering paste LFM-48 TM HP, manufactured by Japanese Nihon, has a melting pint at 217 Celsius degrees and a liquidpoint at 220 Celsius degrees.

The Nihon LFM-48 TM HP SAC soldering paste is distributed in Europe in Sweden by VENSO Elektronik, in Finland by Teletekno, in France by Nouvel Ocean, in Germany by Almit GmbH and in U.K. by Almit Technology Ltd.

Comments

Please note the following: Critical comments are allowed and even encouraged. Discussions are welcome. Verbal abuse, insults and racist / homophobic remarks are not. Such comments will be removed.
Further details can be found here.
Ad
Ad
Ad
Ad
Load more news
May 11 2018 10:46 am V9.5.4-1