Electronics Production | February 10, 2006
TES acquires eDFX Services
French electronic design and manufacturing company, has aqcuired the assets of US based eDFX Services. By this TES creates the first design centre in the USA.
This allows TES to offer local design support for TES's rapidly growing customer base in the USA as well as enhancing the company's innovative design resources. This acquisition increases TES's global design resources to more than 500 design engineers in 17 design centres around the world, with strong design capabilities and skills across IC, board, software and full-system design. eDFX Services is based in the heart of Silicon Valley, California, offering a range of hardware design and product development capabilities to systems and semiconductor companies. The company is particularly known for its expertise in High Speed Hardware Designs, signal integrity analysis, PCB layout, IC Package design and for its strong track record of supporting System-On-a-Chip products. "eDFX has a reputation for offering high-quality design services, and their unique "first time right" processes dramatically reduce time to market," said Michel Desbard, CEO of TES. "This acquisition enhances the global reach of our design services, expanding our ability to serve global customers at a local level." eDFX services works with a number of equipment OEMs and semiconductor manufacturers, providing expertise in a range of technologies including networking, telecommunications, wireless design, healthcare, embedded systems and internal system interface standards. eDFX team members are highly experienced in a complete product development cycle from architecture and feasibility study to releasing into high volume production. eDFX also helps customers to achieve compliance with various standards including NEBS, FCC, EN, UL and TÜV. "Joining TES offers us the chance to rapidly expand our design team, and gives us the opportunity to take advantage of the company's other design teams around the world," added Bhavesh Patel, President, founder and CEO of eDFX Services. "We look forward to being part of the TES vision of offering IP, design services and manufacturing capabilities to leading electronics companies throughout the world." The combination of eDFX Services and TES will now operate under the name of TES Electronic Solutions US Inc and has established a new location at 2350 Mission College Boulevard, Suite 300, Santa Clara, California 95054. Bhavesh Patel joins TES as head of US Design and will be responsible for the growth of the US engineering team and the execution of projects for US customers. Financial details of the transaction are confidential.
EUV photoresist company Inpria raises $31 million in funding Inpria, a pioneer in high-resolution metal oxide photoresists for extreme ultraviolet lithography (EUV), has secured USD 31 million in Series C funding from a broad syndicate including two of the biggest names within the semiconductor manufacturing space.
Semiconductor industry avoids direct impact of coronavirus The semiconductor industry appears to have escaped the direct impact of the coronavirus crisis so far, but the market is likely to suffer the repercussions as the outbreak slows or suspends production among electronics manufacturers, according to Omdia.
Plessey partners with Axus Technology Plessey, an embedded technologies developer, is partnering with Axus Technology (Axus), a provider of CMP, wafer thinning and wafer polishing surface-processing solutions for semiconductor applications, to bring high-performance GaN-on-Silicon monolithic microLED technology to the mass market.
GPV Electronics CN resumes production On 19 February 2020, the Chinese Central Government informed that all enterprises in the Guangdong province are now allowed to resume production.
Nano Dimension moves its main commercial activity to USA Nano Dimension announces that the company is establishing its headquarters for the Americas in South Florida.
Rockwell Automation inks deal for Italy’s ASEM Rockwell Automation Inc. has signed a purchase agreement to acquire digital automation technologies provider ASEM S.p.A.
IFR releases ‘Top Trends 2020 Robotics’ The International Federation of Robots (IFR) has forecasted an uptick of 2 million industrial factory robotic units in the next two years.
Paslin, Rivian fuel EV factory expansion The Paslin Company, a builder of robotic assembly lines for Tier 1 suppliers and OEM auto companies, is expanding in Warren, Michigan.
Nokia plans to acquire US-based company The Finnish telecom company is planning to acquire Elenion Technologies, a U.S.-based company focusing on silicon photonics technology.
neutec electronic to handle Asymtek and Dima in Switzerland Asymtek, a part of Nordson Electronics Solutions - announces that their distributor, neutec electronic AG, has expanded its representation of all Asymtek and DIMA products to the French-speaking areas of Switzerland.
BMZ subsidiary Poland reports successful business year 2019 BMZ Poland, the second largest production site of the BMZ Group, is expanding its production area and is reporting 10% sales growth and thereby reached record results for the business year 2019.
Scanfil CEO: ‘Our operations are making good progress’ The last quarter of 2019 was the strongest one for the EMS provider. Scanfil recorded a turnover of EUR 155 million, a growth of EUR 15 million or 10% year-over-year.
Prime Technological Services acquire ITS EMS provider Prime Technological Services LLC has acquired Georgia-based I Technical Services (ITS).
Florida’s Sypris snags BAE Systems contract Sypris Electronics LLC, a subsidiary of Sypris Solutions Inc., has won a contract award from London-based BAE Systems’ Electronic Systems sector.
Into the future, San Diego style IPC APEX EXPO, the North American electronics manufacturing industry’s biggest gig, has left the teenage years behind with this year’s 20th anniversary show held Feb 3-8 in San Diego.
5 semiconductor companies hold 53% of global wafer capacity The world’s top-five wafer capacity leaders each had capacity of more than 1,000,000 wafer starts per month, says IC Insights.
Global DRAM revenue holds steady in 4Q19 The DRAM inventory finally returned to a relatively normal level for most OEMs in 4Q19 after nearly three consecutive quarters of adjustments, says the DRAMeXchange research division of TrendForce.
Mitsubishi Electric completes new satellite production facility Mitsubishi Electric has completed construction of a new facility for the production of satellites at the company’s Kamakura Works in Kamakura, Japan.
ISS-Broadband delivered by Kongsberg Kongsberg equipment is to enable broadband transmission for the International Space Station (ISS) to 'significantly improve communication between the ESA astronauts manning the station and earth.
Mycronic receives order for an SLX mask writer Swedish equipment provider, Mycronic AB, has received an order for the new SLX mask writer from a customer in Asia. The customer already has mask writers from Mycronic.
A new production unit for mirror segments for ELT Safran's new production unit at the company's Saint-Benoît facility near Poitiers in central France will make the primary mirror segments for Europe's Extremely Large Telescope (ELT).
A more sustainable approach to semiconductor manufacturing Reuse; that is the key to driving environmental sustainability in global semiconductor manufacturing, says Steven Zhou, CEO of Moov Technologies.Load more news