© blotty-dreamstime.com Analysis | June 12, 2013
Smartphones push 802.11ac & 802.11ad chipset shipments
Smartphones will account for nearly half of both 802.11ac and 802.11ad chipset shipments in 2018
The growth of 802.11ac and 802.11ad will occur in very different ways. 802.11ac will explode into devices, including smartphones, from the start while 802.11ad will see a more modest and staggered growth. 802.11ac is being pushed into smartphones by key carriers’ device requirements that are in sync with 802.11ac hotspot plans for more robust Wi-Fi offloading. “The push towards 11ac adoption overpowers the minor additional cost of dual-band 802.11n/802.11ac chipsets that will be used in smartphones,” states research director Philip Solis. “Perhaps surprising even to industry insiders, we will likely see 2X2 802.11ac implementations in smartphones in a few years.” The proportion of various 802.11ac-enabled products will remain relatively consistent from 2013 to 2018, with smartphones making up 40% of those in 2013 and 46% in 2018, where over 3.5 billion Wi-Fi chipsets with 802.11ac will ship. The Wi-Fi Alliance is just about to start certification of products using the protocol, yet its shipments have started and are already on track to distribute hundreds of millions this year. 802.11ac finally pushes Wi-Fi more towards the 5 GHz spectrum which is cleaner and permits for the much larger channel sizes that allow for greater speeds and capacity. 802.11ad will phase from larger to smaller products, starting from peripherals and larger non-handset mobile devices and shift to smaller and thinner devices over time. 802.11ad will make its way into smartphones in 2015, changing the proportion of 802.11ad-enabled products compared to prior to 2015. Smartphones will account for nearly half of all 802.11ad-enabled products in 2018, though with less than half the volume in smartphones compared to 802.11ac. Even so, over 1.5 billion chipsets with 802.11ad will ship in 2018. 802.11ad pushes Wi-Fi into higher-speed, lower-power personal area networking that will be used simultaneously with other Wi-Fi protocols. “As the complexity of Wi-Fi increases, heading towards tri-band 802.11n/802.11ac/802.11ad chipsets, interesting design tradeoffs can be made to optimize for cost, size, and functionality,” notes Solis. “Choices can be made around the support of 80 MHz or 160 MHz channel and MIMO configurations based on whether or not 802.11ad is included. Smaller antennae arrays can also be used to save space.”
AMTE Power and Britishvolt sign MoU for GigaFactory AMTE Power and Britishvolt plans to investigate collaborating to build the UK’s first full cycle battery cell GigaPlant, servicing the automotive and energy storage markets.
ALLPCB’s new SMT factory has launched production On May 10 2020, ALLPCB’s new – self-operated – SMT factory in Guangde, Anhui Province, China was officially put into production.
Schweizer starts production at its new location in China Following a construction period of one and a half years, production has now started at the company’s new high-tech printed circuit board plant in Jiangsu, China.
Jenoptik supplies generators to a US customer Through its Vincorion investment, Jenoptik received a long-term order for generators that an unnamed US customer is integrating into military vehicles.
Rolls-Royce takes heavy hit from COVID-19 – reduces workforce by 9000 The impact of COVID-19 on Rolls-Royce and the whole of the aviation industry is unprecedented. RR has already taken action to strengthen the financial resilience of its business and to reduce cash expenditure in 2020. However, this will not be enough.
Data Link Solutions to provide MIDS cabinet terminals to US Navy The U.S. Navy has awarded a USD 3.2 million production contract to Data Link Solutions (DLS), a joint venture between BAE Systems and Collins Aerospace, for new Multifunctional Information Distribution System (MIDS) cabinet terminals.
Incap restarts production in India In a move to contain the COVID-19 pandemic, the government of India instructed all state governments to introduce a lockdown in March. As a consequence, Incap had to close its factory in Karnataka, India on 23 March.
NAND Flash Revenue Undergoes 8.3% QoQ Growth in 1Q20 NAND Flash bit shipment in 1Q20 was relatively on par with 4Q19, says the DRAMeXchange research division of TrendForce. The overall ASP of NAND Flash products also climbed during the period. As a result, the global NAND Flash revenue for the quarter went up by 8.3% QoQ to USD 13.6 billion.
Gorenje reduces the number of layoffs At the end of April, due to a sharp drop in orders and revenues as a result of the COVID-19 pandemic, the Hisense Europe Group launched a redundancy program in four companies in Slovenia.
NA semiconductor equipment industry posts April 2020 billings North America-based manufacturers of semiconductor equipment posted USD 2.26 billion in billings worldwide in April 2020 (three-month average basis), according to SEMI.
AWS Electronics to wear the Incap name Following the acquisition of AWS Electronics Group by Incap Corporation in January 2020, the company's units in the UK and Slovakia will now be trading as Incap Electronics UK Ltd. and Incap Electronics Slovakia s.r.o.
PCB manufacturer SQP invests in new plasma treatment system As part of the continuous upgrade of the PCB manufacturing processes the Slovakian PCB manufacturer SQP International has invested in a new plasma treatment system.
Nordson delivers solid quarter considering COVID-19's impact on global end markets Nordson Corporation reported second quarter sales of USD 529 million, a 4% decrease compared to the prior year’s second quarter sales of USD 551 million.
Cicor expands its clean room set up in Bronschhofen Swiss EMS provider Cicor Group is currently expanding its site in Bronschhofen with a 60 square metre ISO Class 6 clean room.
Senate Dems to Trump: Release details of TSMC plant deal Democratic lawmakers are pressuring the Trump administration to respond to serious questions about Taiwan Semiconductor Manufacturing Co Ltd’s (TSMC) plans to build a USD 12 billion plant in Arizona, which the company announced last week.
SOS LAB completes series A+, inks MOU with ON Semi LiDAR sensor maker SOS LAB has secured series A+ investment funding of USD 8 million as of April.
Expanded US rules sanctioning Huawei to have little impact on memory industry TrendForce believes that the latest updates to the sanctions will have a relatively low impact, in the short term, on Huawei’s shipment of smartphones, notebook computers, and servers – products for which Huawei is relatively well stocked on components.
PCB Connect expands with new office Due to the PCB suppliers’ successful growth in Denmark, the company has now decided to invest further in the Danish Market.
Panasonic, Tesla discuss beefing up Nevada battery plant Panasonic Corporation this week said strong demand for battery cells from its U.S. partner, Tesla, has led to negotiations on the expansion of their joint plant in Storey County, Nevada.
Flex taps new leadership for automotive business Flex has named Mike Thoeny, president, Automotive Business Group, effective June 1, 2020.
Current pandemic slows down business development in German component distribution German distribution of electronic components (according to FBDi e.V.) continues to decline in the first quarter of 2020. The order situation improves slightly, at a low level. The FBDi calls for future-oriented course-setting and investments in infrastructure.
Progress is being made for BMW’s new plant in Hungary Preparations for the future BMW Group plant in Debrecen, Hungary, have reached important milestone. Following successful preparation of the land by the City, the official handover process has now started.Load more news