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SMT & Inspection | December 02, 2005

Indium wins Global Technology Award

Indium Corporation has received the Global Technology Award for its NF260 No-Flow Underfill.
Sponsored by Global SMT & Packaging magazine, the award recognizes product excellence and innovation in semiconductor packaging and electronics assembly. It was presented at Productronica in Munich, Germany.

Read full story at EMSNow.
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