Cicor wins large-volume contracts in the PCB Division

The contracts are from the medical and consumer-electronics sectors and represent an overall volume in the double-digit million range. They are already having an effect on sales in the current fiscal year and will continue to do so in 2013. At the beginning of 2012 Cicor consolidated its manufacturing capacities for printed circuit boards manufacturing in Switzerland at the Boudry site. Parallel to this, the Division invested in new production facilities for chemical plating and galvanic copper plating, among others. With the vertical integration of these additional processing stages, which were previously outsourced, the PCB Division achieved "significantly increased flexibility in handling large contracts", a press release states. Furthermore, manufacturing throughput times have been significantly reduced. 3D-MID technology – major customer order in the security sector Following intensive groundwork over the past few months and various successful pilot phases, Cicor received an initial order in the field of security from a major customer involved in building technologies.