Electronics Production | February 29, 2012

Diodes adds to machine park

Pac Tech GmbH has installed an Advanced PacLine 300 System at Diodes, Inc.
Packaging Technologies GmbH has sold their latest PacLine 300 A50 system for electroless deposition of Ni, Pd and Au on advanced semiconductors to Diodes Incorporated in Plano, Texas. The system will be installed at Diodes wafer fabrication facility in Kansas City, Missouri.

Dr. Thorsten Teutsch, President of Pac Tech USA says, ”It is exciting to see that Pac Tech’s low cost technologies automated equipment lines are assisting to keep manufacturing jobs secured in the US.”


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