Electronics Production | October 12, 2005
Freescale marks one year of 90-nm success at 300-mm
Continuing to build a track record of technology innovation and manufacturing know-how, Freescale Semiconductor today celebrates one year of technology leadership and manufacturing production at the 90-nanometer (nm) technology node.
Since initiating manufacturing of 90-nm product designs on 300-millimeter (mm) wafers in October 2004, Freescale has introduced 12 new products on 90-nm low-power CMOS technology. Freescale's 90-nm products include digital, analog, RF and embedded memory devices for diverse end applications, such as wireless handsets, printers, enterprise networking components and wireless infrastructure equipment. Freescale has completed these 12 successive 90-nm design releases "right-the-first-time," producing fully functional samples in customer applications after only one pass - a testament to the company's advanced semiconductor process technology, design technology and product design capabilities. This 100 percent first-pass success rate demonstrates Freescale's ability to reduce the design gap between ever-improving technology and manufacturing capabilities and the industry's capacity to generate designs able to keep pace with these advances. High first-pass success rates help minimize the design gap, significantly decrease time to market and reduce the design efforts and costs required for each new product introduction. "We have addressed many of the industry's widely reported challenges with 90-nm and are applying our expertise to the next generations of technology," said Freescale's Chief Technology Officer Dr. Claudine Simson. "Our achievements at 90-nm over the past year set the stage for successful 65-nm prototyping, which we will begin in November." Freescale's newest 90-nm products were introduced in Crolles2, the joint Freescale, STMicroelectronics and Phillips R&D/pilot manufacturing facility located in Crolles, France near the city of Grenoble. The three microelectronics giants lead the Crolles2 Alliance - a partnership established in 2002 to speed the advancement of CMOS process technology.
dSPACE adds West Coast office Simulation and validation specialist dSPACE has opened a Silicon Valley office in San Jose, California as part of its strategic realignment.
Cogiscan, BasiCAE form strategic partnership Quebec-based Cogiscan Inc. has announced a partnership with China’s BasiCAE Technology, a provider of traditional shop control systems and software customization services.
Korea hits new record of industrial robots in operation The World Robotics report presented by the International Federation of Robotics (IFR) shows a new record stock of about 300,000 operational industrial robots in the Republic of Korea in 2018 (+10%).
Keytronic starts production at its new Vietnam facility Keytronic Corporation says it has started shipping product from its new Da Nang, Vietnam manufacturing facility.
Sponsored content by CMLCML putting the drive into e-mobility As the global demand and trend for e-mobility grows, we understand that customers are looking for products with better performance, stricter tolerance, increased reliability and cost effectiveness. This means your PCB provider must understand the challenge you are facing, be able to support you throughout the whole process – from the first technical questions to the end of life.
USI's looking to accelerate expansion - acquires Asteelflash It looks like we’re ending 2019 with a bang. One of the worlds biggest EMS providers wants to acquire one of Europe’s largest electronics manufacturers.
Devon manufacturer adds capabilities in Dorset via acqusition Devon-based PCB manufacturer, EuroTech Group, is acquiring PCB manufacturer Lyncolec, based in Poole, Dorset.
Kyocera and TactoTek collaborate on IMSE solution Kyocera and TactoTek has singed a marketing agreement which aims to bring IMSE solutions to several new market segments, including industrial and automotive components, electronic devices, and more.
IPC: Unanimous approval of USMCA needed IPC issued a statement this week expressing support of the recently bi-partisan approval of the United States-Mexico-Canada Agreement (USMCA), and a strong desire for legislative approval by Canada, Mexico, and the U.S.
Nordson's CFO to retire in 2020 after 30 years with the company Nordson's Executive Vice President and Chief Financial Officer, Gregory A. Thaxton, plans to retire in 2020 after thirty successful years with the company, with the last 12 years as CFO.
KUKA restructures subdivision due to economic uncertainty KUKA is restructuring a subdivision in the Robotics segment that is responsible for automated manufacturing solutions such as cells and special machines.
PCB industry recovers slightly in Q3 PCB manufacturers in the D/A/CH region were able to increase sales sequentially in the third quarter of 2019 by 1.1%. However, sales figures are 11% lower than those recorded for the third quarter of 2018, reports the industry association ZVEI PCB and Electronic Systems.
Garz & Fricke moves into new HQ in Hamburg-Harburg Garz & Fricke GmbH continues to expand. As of late October, the business operations of the HMI and Panel PC specialist will be transferring to the new headquarters in in Hamburg-Harburg.
TF Massif Technologies taps new CEO British Columbia-based TF Massif Technologies has announced the appointment of Tom Peregoodoff as the company’s new chief executive officer.
DoJ: Google, Fitbit deal under review The U.S. Justice Department is looking into anti-trust issues concerning Google's bid to buy Fitbit Inc.
L3Harris Tech secures U.S. Marine Corps order L3Harris Technologies received a USD 50 million follow-on delivery order for Falcon III AN/PRC-160 HF radios and related equipment from the U.S. Marine Corps .
Metair completes Romanian lithium-Ion battery cell factory South African energy storage company, Metair Investments, says that its Romanian units Prime Batteries and Rombat have completed the installation of the group's first Lithium-Ion battery cell manufacturing and assembly facility in Bucharest, Romania.
£5m award marks ‘topping out’ of Cardiff research powerhouse An GBP 80 million Cardiff University powerhouse for Welsh scientific research has been ‘topped out’ by Bouygues UK – backed by over GBP5 million support from Welsh Government and industrial partners.
Advanced Energy expands with new lab near Frankfurt Advanced Energy Industries, Inc. has opened its Advanced Materials Processing (AMP) Showcase Lab near Frankfurt, Germany.
TTM Technologies unveils NY engineering center On the heels of its acquisition of manufacturing and IP assets from i3 Electronics Inc., TTM Technologies has announced the opening of a new engineering center in Binghamton, NY.
EU Commission to support pan-European battery development Seven member states will provide, in the coming years, up to EUR 3.2 billion in funding to support research and innovation in the common European priority area of batteries.
The pulse of the electronics industry Growth is slowing worldwide and the industry’s outlook is less optimistic than in previous quarters, although it is still generally positive, according to the results of IPC’s fourth-quarter 2019 Pulse of the Electronics Industry survey.
Teradyne delivers J750 semiconductor test system to Ardentec Teradyne has hit a milestone with the 6,000th shipment of the J750 family of semiconductor testers.
Season Group names new SvP for global business development Season Group has appointed Stephen Tsao as the company's new Senior Vice President, Global Business Development.
Zestron appoints new sales director Europe Mr. Adam Meinert recently joined ZESTRON as the Sales Director of Europe.Load more news