PCB | July 15, 2005
Swede invents new PCB technology
Lars-Anders Olofsson of Järfälla, outside of Stockholm, has developed a technology with thermal vias in Multi Layer PCBs.
The new vias, which can conduct both heat and electricity, can be applied to both Single- or Multi layer PCBs. The principle of the new technology is that a metal ball is inserted to each, plated- or non plated hole, and subjected to pressure. The pressure deforms the ball and attach it to the laminate.