SMT & Inspection | December 18, 2008
Siemens EAS and SEHO in development cooperation
Siemens Electronics Assembly Systems and SEHO Systems GmbH are closely working together on the development of new processes to make electronics production more efficient. The first result of this cooperation is now ready for field testing.
The SEHO DualReflow oven carries forward the dual-lane concept of Siplace's placement solutions and is the first oven to feature separately adjustable temperatures for each lane. Thanks to the cooperation between the two companies, users can for the first time manufacture two products with different soldering requirements side-by-side from the placement to the reflow process without the need for additional floor space. This integrated manufacturing solution maximizes the productivity enhancements of the Siplace dual-lane transport and makes the entire production process faster, more efficient and more flexible. To enable users to take advantage of their high performance in all situations, placement solutions from Siplace offer a broad range of manufacturing concepts such as intelligent concepts for populating two-sided boards or processing boards side-by-side. These options are being implemented via various options like the flexible dual-lane transport or the Siplace Productivity Lane that let users implement the best available setup, placement and production strategy for any product mix. Two reflow ovens in one Previously, these options were restricted to the placement segment in the SMT line. By working closely together and sharing their process knowledge, Siplace and SEHO are extending this flexibility to the soldering section of the production line. The SEHO DualReflow is the first convection reflow soldering system that continues the Siplace dual-lane concept and is able to solder two different PCBs with different thermal requirements side-by-side. When the PCBs come from the SMT line's placement section, they enter the SEHO DualReflow in two parallel lanes. The soldering system features two vertically separate and independent heating areas with 18 separately adjustable heating zones each, for maximum temperature profile flexibility. The thermal separation between the two lanes and heating sections with differences of up to 50 Kelvin delivers maximum flexibility for soldering products with different placement densities and component spectrums as well as lead-free and conventional PCBs side-by-side. Consistent manufacturing solutions for maximum efficiency The preparation phase for a field test of the SEHO DualReflow at a reference customer's site is almost complete. Thanks to the technology partnership between Siplace and SEHO, it will be the first integrated manufacturing solution on which two different processes and products can be run consistently and in parallel on a single line. Such solution delivers significantly more productivity and flexibility without taking up more floor space and resources. A single production line with full-length dual lanes can now do the work of two separate lines while generating barely more expenses for energy, exhaust, nitrogen, supervision and maintenance than a conventional single-lane line. Integrated manufacturing solutions offer other benefits as well. Since they require fewer setup changeovers, the production process becomes more stable, which improves quality. Since users are also able to produce more continuously and in a more job-oriented manner, they benefit in areas like storage logistics and scheduling, which reduces the amount of assets being tied up in production and inventory. Siplace network For many years, Siplace has maintained a global network of leading manufacturers and technology suppliers from all areas of electronics production. The members of this network regularly exchange their process and technology expertise in order to combine individual products into integrated manufacturing solutions that deliver new levels of efficiency to their customers, thus enabling them to make their production more efficient, flexible and job-oriented.
Sypris Electronics tapped for NASA project Sypris Electronics LLC has been awarded a contract from Collins Aerospace in association with NASA’s Orion Spacecraft project.
NexLogic eyes implantable med-electronics NexLogic Technologies Inc. has announced its entry into assembly and manufacturing of implantable medical devices, a rapidly growing segment in the medical electronics market.
International Wire Group buys Owl Wire and Cable International Wire Group (IWG) has acquired New York-based Owl Wire and Cable from Marmon Holdings Inc.
ZF to set up third research and development centre in China ZF Friedrichshafen AG is establishing a third Chinese R&D centre in Guangzhou southern China. Representatives of ZF and the local authorities have signed an agreement and ZF plans to invest approximately EUR 90 million in the new development center.
Semiconductor market suffers another plunge in Q3 With revenue plunging by a gut-wrenching 14.7% in the third quarter, the global semiconductor market appears destined for a year of double-digit decline, despite some signs of growth in the critical memory segment, says IHS Markit.
Ericsson to pay $1B to resolve US corruption investigations Swedish telecom company Ericsson has reached a resolution on U.S. FCPA investigations by the the U.S. Department of Justice (DOJ) and the Securities and Exchange Commission (SEC).
Bel acquires CUI Inc. power assets Bel Fuse Inc. has closed on its previously-announced deal with CUI Global for the majority of the power business of its subsidiary, CUI Inc.
Accel Robotics more than quadruples initial funding San Diego-based start-up Accel Robotics has announced a USD 30 million Series A funding round led by SoftBank Group Co.
General Motors, LG Chem partner in Ohio General Motors and LG Chem have announced plans to form a joint, equally-owned company to mass-produce electric vehicle battery cells.
Swissbit opens electronics production facility in Berlin Swissbit has been manufacturing in Germany since 2002 and has now official opened its new electronics production facility in Berlin.
Revenue ranking of global top 10 IC design companies The newest analysis from TrendForce shows that several U.S.-based IC design companies experienced continually expanding losses in 3Q19 revenue because of the ongoing China-U.S. trade war and because Huawei had yet to be removed from the Entity List.
Mycronic receives order for an upgrade of a Prexision system Swedish production equipment specialist, Mycronic AB, has received an order to upgrade a system to a full-scale Prexision 8.
Kurtz Ersa inaugurates new extension buildingin Asia Kurtz Ersa Asia Ltd. celebrated its 15th anniversary in China and at the same time opened its extension building in Zhuhai.
Clover Wireless acquires Teleplan Illinois-based Clover Wireless has acquired Teleplan International N.V., a global electronics supply chain services and solutions provider.
FLIR Systems, Providence Photonics finalize deal Oregon-based FLIR Systems has completed its strategic investment in Providence Photonics, developers of advanced software used to quantify invisible gas emissions using FLIR optical gas imaging (OGI) cameras.
Lucid Motors sees EV facility groundbreaking Lucid Motors has officially begun phase-one construction of its EV manufacturing facility in Arizona, representing an investment of more than USD 300 million.
Precogs’ CEO: ‘If we can’t help you, it won’t cost you’ The business model of Precogs, the company that has created a global marketplace that connects a buyers ERP with component distributors, is quite intriguing; you will only pay out of what the company can save you.
Cre8tek invests in robotics to increase efficiency and quality Danish-Chinese electronics manufacturer, Cre8tek, has recently invested in added automation in the shape of robots; which are currently moving into the company’s production plant in Shenzhen with the aim to increase efficiency and quality.
Global semiconductor sales increase 2.9% MoM in October The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors reached USD 36.6 billion for the month of October 2019, an increase of 2.9% from the previous month's total of USD 35.6 billion, but down 13.1% compared to the October 2018 total of USD 42.1 billion.
Standex International buys Torotel Inc. Standex International Corporation and Torotel Inc. have reached a definitive agreement for Standex to acquire Torotel for approximately USD 48 million in cash.
SPEA unveils new digs in Chandler, Arizona SPEA, a provider of in-test equipment for electronics, semiconductor, MEMS, and sensor industries, has opened a new office in Chandler, Arizona, in the metropolitan area of Phoenix.
SUSS MicroTec, BRIDG team up on NA applications center SUSS MicroTec has announced a broad collaboration agreement with BRIDG, a Florida not-for-profit microelectronics fabrication facility with 200 mm (8-inch) wafer fab capabilities.
Universal adds software center in Bratislava Universal Instruments has extended its EMEA capabilities with the addition of a Software Center in its Bratislava, Slovakia corporate facility.
Sono Motors launches community funding campaign The German mobility provider Sono Motors launched one of the biggest community funding campaigns in Europe yesterday. The company’s campaign target is to generate EUR 50 million between now and December 30, 2019, with preorders from existing and new supporters.Load more news