Electronics Production | September 30, 2004
Infineon, VW roll telematics platform
Volkswagen and Infineon find new ways to integrate the telephone into cars - wireless communication soon to be standard equipment in motor vehicles.
Infineon Technologies and Volkswagen have jointly developed a platform concept for wireless telecommunication and use of location-based information services in motor vehicles. The aim of the cooperation was to build a scalable telephone and telematics platform that additionally provides telematics functions for the price of an existing in-car telephone unit and so permits advanced information services that were previously the preserve primarily of the luxury car category to be used in all classes of vehicle. Volkswagen and Infineon intend marketing the platform as a manufacturer-independent solution by making it available to all interested automobile manufacturers and suppliers. Installing a platform that is standardized as far as possible across the industry will result in considerable cost savings, particularly with high-volume vehicle models. Differentiation will be provided by the application software, the functions offered, and also by the user interface and retention of the vehicle-specific interior design. The new platform - known by the project name “Basic Telematics Unit” - removes the need for a corded handsfree facility in order to use a mobile phone in a car. The data on the SIM card from the chosen mobile phone of a vehicle passenger is made available to the basic telematics unit via Bluetooth™ and all telephone calls are automatically diverted to the unit. SMS messages, telephone numbers or names of callers appear on the instrument panel display. The driver can dial telephone numbers directly by voice input or using controls on the steering wheel. Other potential applications include in-car fault diagnosis with subsequent relaying of the fault information by GSM/GPRS mobile radio to the nearest repair shop, as well as automatic calls to breakdown and recovery services. The joint project with Infineon is part of Volkswagen’s electronics strategy. “For Volkswagen as an automobile manufacturer, mastering the increasing complexity of electronic components is an important objective in the development of future-oriented, customer-centric vehicle concepts. Volkswagen is committed to the earliest possible integration into the supplier’s development process and to the development of software which is reusable group-wide and which, wherever possible, should be used on a manufacturer-independent basis,” said Dr. Volkmar Tanneberger, Head of Function Electronics Development at Volkswagen. “Only a holistic approach will guarantee the car becomes a stable complete system. Closer cooperation between all automotive suppliers and the car makers will bring huge benefits to all involved and build mutual understanding and know-how,” said Dr. Reinhard Ploss, Senior Vice President & General Manager of the Automotive and Industrial Group at Infineon Technologies AG. “With this cooperation project we have pooled our comprehensive expertise in the automotive and communications sector and will deliver hardware that meets the exacting requirements of the automobile industry.” The basic telematics unit is based on Infineon’s TriCore™ 32-bit chip architecture, which was developed specifically for automotive use. Infineon has also incorporated its system know-how for linking different communication technologies. The basic telematics unit includes Infineon’s SingleStone module for the Bluetooth application, its GPS chipset for satellite-based positioning, and its GSM/GPRS chipsets for mobile communication and Internet access. Volkswagen developed the software architecture and the complete software package, which is modular in design and reusable. The use of standardized interfaces and rejection of manufacturer-specific software was a basic condition for this. Volkswagen integrated the unit into the vehicle in accordance with its own requirements for electrics, mechanical equipment, design and user guidance. Volkswagen will trial the basic telematics unit in an internal fleet pilot starting in fall 2004. The scalable telephony/telematics platform co-developed by Volkswagen and Infineon can be used by interested carmakers and automotive suppliers for their own products.
New group structure at Mycronic aimed securing future growth Swedish creator of production equipment, Mycronic, has grown quite a bit during the last years; both organically but also through acquisitions. And with that growth some structure is in order.
Zenuity and HP Enterprise team up to develop next-gen autonomous driving cars Hewlett Packard Enterprise (HPE) has been selected by Zenuity, a Swedish developer of software for self-driving and assisted driving cars, to provide the crucial artificial intelligence (AI) and high-performance computing (HPC) infrastructure it needs in order to develop next generation autonomous driving (AD) systems.
Honeywell, Lockheed Martin win NASA contracts Honeywell and Lockheed Martin have both announced recent contracts for the supply of key components to NASA’s Orion spacecraft fleet for the upcoming Artemis lunar missions.
Libra Industries welcomes new VP EMS provider Libra Industries has welcomed David Chavez to its leadership team as the new VP of Integrated Business Development.
Sponsored content by CMLCML manufactures Metal Substrate solutions Printed circuit boards (PCBs) plays an important role in our day to day life. Whether it’s the car you’re driving, the phone that you’re scrolling through or computers that you’re sending emails from. What happens when you use heat generating components on a PCB? That’s right, cooling is needed!
Danfoss shuts down site – hundreds of jobs lost Danish industrial group, Danfoss, is taking steps to optimise and strengthen its competitiveness. This will result in a closure of the groups manufacturing site in Kolding, Denmark. Production from the site will be moved to the groups manufacturing location in Poland.
USI builds its third antenna chamber measurement system USI is currently building its third antenna chamber measurement system with a targeted completion date in the first quarter of 2020.
AT&S receives NADCAP accreditation With the NADCAP accreditation, new doors in the aerospace sector has been opened for the Austrian company.
Toshiba Carrier to establish new manufacturing subsidiary in Europe Toshiba Carrier Corporation announced the establishment of a new manufacturing subsidiary in Gniezno, a mid-western city of Poland.
Ericsson opens new R&D site in France Ericsson says it will establish a new R&D site in France with up to 300 employees, accelerating 5G momentum in Europe.
GKN team up with Delta on eDrive technology GKN Automotive and Delta Electronics are collaborating on the joint development that aims to enable the rapid acceleration of next generation integrated 3-in-1 eDrive systems of power classes from 80kW to 155kW.
Samsung’s planning Indian smartphone display plant The South Korean tech-giant is reportedly planning a USD 500 million investment to set up a display manufacturing plant in India.
Elmaticas gets green light to audit SAAB Avionics sub-suppliers. Elmaticas Jan Pedersen successfully completed the Part 21 Subpart G training, regarding auditing of Printed Circuit Boards suppliers for SAAB Avionics Systems earlier this year. Allowing Elmatica to conduct audits of SAAB Avionics sub-suppliers.
Jenoptik to keep its mechatronic activities The Executive Board of Jenoptik AG has decided to stop the process of selling the mechatronic business operating under the brand name VINCORION.
U.S. polysilicon makers laud Phase 1 of China deal The United States’ three remaining manufacturers of polysilicon expressed appreciation to President Trump and praised U.S. negotiators for securing the Chinese commitment to purchase U.S. polysilicon in the first phase of the U.S.-China trade deal.
Dupont explores divestiture of electronics unit Following its recent USD 26.2 billion deal to sell off its nutrition business, DuPont de Nemours Inc. is weighing a divestiture of its electronics unit, according to people familiar with the matter.
AMD bolsters exec leadership team AMD has announced several promotions and one new hire to its senior leadership team, in an effort to enable the company’s continued growth in the high-performance computing, graphics and visualization technologies market.
Webasto opens new battery centre in Jiaxing Webasto has inaugurated its new roof plant and battery center in Jiaxing (Zhejiang Province) close to Shanghai.
Panasonic to expand its manufacturing footprint in India Panasonic is looking to build a new wiring device factory in southern India. The new factory is scheduled to start production in autumn 2021, responding to the increased demand in the country.
Season Group strengthens wireless R&D & manufacturing capability Season Group has invested in, and installed, two high-speed and high-precision wireless communication testers - Rohde & Schwarz’s R&S CMW500 Wideband Radio Communication Tester and R&S CMW100 Communications Manufacturing Test Set.
Rocket Lab expands capabilities in So Cal Rocket Lab announced this week it will open a new facility to serve as its corporate headquarters and provide increased production capacity.
PCB Piezotronics unveils new clean rooms PCB Piezotronics Inc., a wholly owned subsidiary of MTS Systems Corporation, has announced the completion of environmentally controlled clean rooms at their DePew, New York facility.
European loudspeaker company brings production back home Difficulties manufacturing smaller design series among reasons for the decision to return back to base.
China only region to register pure-play foundry market growth Rise of China-based fabless IC suppliers offers increased opportunities for foundries, IC Insights states in a recent report.
Mycronic receives first SLX order Swedish production equipment specialist, Mycronic, has recieved their very first order of its mask writer SLX.Load more news