Kinwong is a PCB manufacturer headquartered in Shenzhen, China, with 28 years of manufacturing experience and ranks 19th in the PCB industry globally. Kinwong has Multiple Technology Capabilities, such as PCB, FPCB, MPCB, High Layer Count PCB, Substrate-Like PCB. The picture below shows the specialty of Kinwong’s 11 factories. Even when faced with Covid-19, Kinwong has achieved revenue of more than 1 billion USD in 2020. Kinwong provides global localized FAE and business development support. Kinwong cooperates with numerous top brands in the world with an excellent reputation. Automotive-Development Trend & Kinwong’s Technical Solution 1. E-mobility ● High Power ● High Voltage ● High Current ● Thermal Management Solution Cu/Aluminum-based IMS Cu Pedestal High Thermal Conductivity Excellent thermal performance Good electrical performance Heavy Copper Less Thermal Stress Max. 6oz base Cu UL recognized Cu/AIN Inlay “I”,”T”,”U”-shaped Cu Coin Max. ±30um height performance 2. ADAS /Autonomous Driving ●Higher Transmission Rate ●Lower Loss High Frequency Millimeter Wave Radar HC/PTFE-based Raw Material Hybrid | Blind Via High Accuracy Copper Image Pattern（±15um） High Layer Registration (±5mil) HDI 2+N+2 0.65mm BGA Pitch (Better in 2021 Zhuhai Factory) 60um/60um Trace Width/Spacing Large-size Display Screen FPC ● More Feature-rich ● Last Longer ◗ Longer Finger Pitch length (>100mm) ◗ Surface Finish: ENIG ◗ Drill Hole Min. 0.1mm, Laser Blind Via Min. 0.05mm ◗ Min. Trace Width/Spacing of 45um/45um ◗ Impedance Control Battery Management System FPC ●High Heat Resistance ● High Power ◗ FPC Length is more than 1000mm ◗ Copper Thickness > 2 OZ ◗ 3D Stiffener Assemble ◗ Conformal Coating for Component 5G Development Trend & Kinwong’s Technical Solution ● High Speed ● Super Transmission Rate ● Lower Loss High Layer Count Large Panel Size Small Hole Backed Drilled POFV Skip Via Impedance Control Insertion Loss Optical Module ENIG/ENEPIG+G/F High Speed Material Hybrid HDI | N+N | Cavity Cu Inlay Segmented/Graded G/F Tight Size Tolerance Antenna 2L~4L High Frequency Material Hybrid Cavity Strict RF Trace ToleranceAntenna TRX/PA/Base Band/Backplane Large Size Back drilling POFV Half-plated Hole Edge Plating Consumer Products Development Trend & Kinwong’s Technical Solution ● High Density ● Small Hole Size ● High Capacity ● Light & Thinner & Much More Mini HDI ◗ 3+N+3 ◗ Anylayer (Zhuhai 2021) ◗ SLP (Zhuhai 2021) ◗ mSAP (Zhuhai 2023) ◗ amSAP (Zhuhai 2023) ◗ Min. Trace Width/Spacing of 30um/30um ◗ Stack Via/Stagger Via/Step Via ◗ Min. Board Thickness of 0.2mm 5G Cellphone 5G Antenna FPC 5G Transmission Line FPC ◗ PTFE/LCP/MPI-based Material ◗ 3L~4L ◗ Laser Drilled Blind Via ◗ Copper Filled Via ◗ Impedance Control ◗ Insertion Loss Control ◗ Signal Simulation ◗ 3D SUS Stiffener Unmanned Aerial Vehicle ( UAV ) UAVs FPC ◗ L1~6L ◗ Drill Hole min. 0.1mm, Laser Blind Via min. 0.05mm ◗ Min. Trace Width/Spacing of 45um/45um ◗ Surface Finish: ENIG & ENEPIG & OSP ◗ Impedance Control ◗ 3D SUS Stiffener Industrial & Medical Device’s Development Trend & Kinwong’s Technical Solution ● Long Term Reliability ● High Stability Rigid-Flex ◗ ENIG/LF HASL/OSP ◗ Max.16L ◗ Max. 6L Flexible Layer Count ◗ Flexible Area with Different Layer Count ◗ CVL at Rigid ◗ HDI ◗ Gold Finger Design ◗ Dispensing ◗ ±10% Impedance Control Semi-flex ◗ Max. 2L Bendable Layer ◗ Bending Area Thickness, 0.25mm±0.05mm ◗ Bending Angle 0~180° • Portable ● Miniaturized ●Intelligent Rigid-flex ◗ Bendable and 3D assembly for small size ◗ Middle/High Tg Base Material ◗ Soldermask Plugging Contact info: www.kinwong.com Email: marketing@kinwong.com Germany: +49 151 5787 6249 （Mr. Bischoff） USA Eastcoast:+1-540-816-2419 (Mr.Wilson) USA Westcoast: +1 847-707-6400 (Mr. Bickner) United Kingdom: +44 7943 781 279 (Mr.Lumsden)