Toppan partners with IBM on 2nm logic semiconductor node
Toppan Photomask has confirmed a five year agreement with IBM to develop a 2 nanometer logic semiconductor node using extreme ultraviolet (EUV) lithography.
This partners say their collaboration will "bring essential material and process control skills together to provide commercial solutions for printing 2nm nodes and beyond semiconductors." The project will proceed at the Albany NanoTech Complex and Toppan Photomask’s Asaka Plant.
Mass production of 2nm node and beyond semiconductors requires advanced knowledge in material selection and process control. These skills exceed the requirements of conventional mainstream exposure technology using an ArF excimer laser as a light source. The IBM and Toppan Photomask agreement brings these essential material and process control skills together to provide commercial solutions for 2nm node and beyond printing.
IBM and Toppan Photomask have a long history of technical cooperation. From 2005 to 2015, they jointly developed photomasks for advanced semiconductors – starting with 45nm node generation.
Since then, Toppan Photomask has continued to actively develop and produce masks and substrate materials for EUV lithography. The firm is currently installing several multi-beam lithography systems to meet the latest semiconductor technology roadmap requirements.
Teruo Ninomiya, President and CEO at Toppan Photomask, said, "Our cooperation with IBM is very important for both companies. This agreement will play a crucial role in supporting semiconductor miniaturization, promoting the advancement of the industry, and contributing to the growth of Japan's semiconductor sector. We are truly honored to have been selected as a partner based on a comprehensive evaluation of our technological capabilities and cost competitiveness, and we are committed to accelerating the realization of miniaturization for 2nm and beyond."