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Business | August 17, 2022

Rochester Electronics invests in system from Hentec/RPS

Hentec Industries/RPS Automation is pleased to announce that Rochester Electronics has finalised the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.

The Odyssey 1325 is a MIL-spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal, and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.

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September 29 2022 3:24 pm V20.8.40-1
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