Business |
Rochester Electronics invests in system from Hentec/RPS
Hentec Industries/RPS Automation is pleased to announce that Rochester Electronics has finalised the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
The Odyssey 1325 is a MIL-spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal, and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.
