Rochester Electronics invests in system from Hentec/RPS
Hentec Industries/RPS Automation is pleased to announce that Rochester Electronics has finalised the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
The Odyssey 1325 is a MIL-spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal, and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling.
Selective soldering offers flexibility to the increased demands of soldering on printed circuit boards (PCBs) with mixed components, including through-hole (THT) and surface mount technologies (SMT).
If you manage a mixed-component PCB soldering process, or your aging equipment or PCB designs are pushing the limits of your wave soldering process, consider selective soldering.
Download our ebook to learn about soldering techniques and how moving to selective soldering reduces cost while increasing process flexibility for consistent, high-quality soldering results.