© Soitec - For illustrative purposes only Components | January 11, 2022
A*STAR and Soitec to develop next-gen SiC semiconductors
The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec have entered into a research collaboration with the aim of developing next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles.
The parties are looking to leverage Soitec’s proprietary technologies such as Smart Cut and IME’s pilot production line to create 200mm diameter SiC semiconductors substrates. The companies states that the joint research will contribute towards developing a holistic SiC ecosystem and boosts semiconductor manufacturing capabilities in Singapore and the region. The research collaboration is planned to run until mid-2024. By 2024 the companies aims to have developed SiC epitaxy and MOSFET fabrication processes for Smart Cut SiC substrates to produce higher quality microchip transistors with less defects and enhanced yield during the manufacturing process. “This joint research between A*STAR’s Institute of Microelectronics and Soitec to develop next-generation semiconductor devices using innovative technologies is made possible by both organisations’ deep capabilities in R&D,” says Mr. Terence Gan, Executive Director of IME in a press release. “We look forward to working together with Soitec to add value to the local R&D ecosystem and the growing pool of silicon carbide players in the semiconductor industry.” “This is a great opportunity for us to partner with Singapore’s Institute of Microelectronics and demonstrate SmartSiC substrate’s scalability to 200mm,” adds Christophe Maleville, CTO and Senior Executive VP at Soitec. “The collaboration paves the way for the development of advanced epitaxy solutions to produce higher quality SiC wafers with energy-efficient characteristics, given the exciting potential of this material. As the main beneficiaries of this new process, the semiconductor ecosystem in Singapore will be given the opportunity to validate the superior energy efficiency of the SiC wafers produced through our collaboration.”
New Heilind Electronics Europe warehouse in Poland Due to the dynamic development and customer acquisition in new European markets, Heilind Electronics Europe decided to rent the first warehouse and office in Poland.
Leuze starts operations at new Malaysian plant Following just 16 months of construction, Leuze has opened its new production site in Malacca, Malaysia.
Indium partners with SAFI-Tech on solder product development Indium Corporation and SAFI-Tech will evaluate market applications for supercooled solder materials and explore the development of new products.
Rohm SiC MOSFETs qualified for automotive use Rohm’s latest 4th generation of SiC MOSFETs has been fully qualified in Semikron’s eMPack modules for automotive use.
Gapwaves and Bosch to jointly develop radar antennas Swedish tech company Gapwaves have entered into an agreement with Bosch regarding the development and large-scale production of high-resolution radar antennas for automotive vehicle applications aiming at highly automated driving.
Würth Elektronik ICS opens subsidiary in Italy Würth Elektronik ICS is expanding its activities in Italy with the opening of the new subsidiary Würth Elektronik ICS Italia s.r.l.
Semtech to acquire Sierra Wireless Semtech and Sierra Wireless have entered into a definitive agreement under which Semtech will acquire all outstanding shares of Sierra Wireless for USD 31 per share in an all-cash deal valued at USD 1.2 billion.
Materion looking to accelerate growth with new facility Materion Corporation, a supplier of advanced materials, has established a new facility in Milwaukee, Wisconsin to accelerate the growth of advanced chemical solutions for the semiconductor and EV battery markets.
Cyber incident at SEMIKRON The SEMIKRON Group has become a victim of a cyber-attack by a professional hacker group.
Alexander Battery and Anglia sign distribution agreement Anglia Components, a distributor of electronic components, has signed an agreement with Alexander Battery Technologies for exclusive distribution in the UK and Ireland.
MKS and Atotech deal receive China antitrust clearance MKS Instruments and Atotech have received unconditional merger approval from China’s State Administration for Market Regulation for MKS’ pending acquisition of Atotech.
Micron plans to invest in US memory manufacturing Micron Technology commends the passing of the “Chips and Science” legislation. The company says that this is a big step towards securing the future of semiconductor manufacturing in the United States and advancing American innovation and competitiveness.
Applied Materials looking to future-ready its workforce Applied Materials South East Asia Pte. Ltd. has signed an MoU with the Singapore Institute of Technology (SIT) to develop and implement continuing education and training (CET) programmes for Applied Materials employees.
Kioxia & WDC to receive government subsidy for JV fab Kioxia Corporation and Western Digital Corporation say that their joint venture, the Fab7 manufacturing facility at Yokkaichi Plant, has been approved to receive up to JPY 92.9 billion (USD 699.3 million) in subsidy from the Japanese government.
Green light for the CHIPS and Science Act of 2022 The United States House of Representatives has passed the CHIPS and Science Act of 2022. A decision applauded by SEMI. The bill provides a 25% tax credit for US facilities that produce semiconductors or chipmaking equipment and USD 52 billion in funding for new semiconductor programs.
Littelfuse completes its acquisition of C&K Switches Littelfuse has completed its acquisition of designer and manufacturer of high-performance electromechanical switches and interconnect solutions, C&K Switches.
Intel to make chips for MediaTek MediaTek will use Intel Foundry Services to manufacture new chips for a range of smart edge devices.
Indie Semiconductor opens Dresden center of excellence The center is said to be part of a company strategy to deliver local technical support for a rapidly growing base of OEM and Tier 1 automotive customers in the EMEA region.
Soitec: "We recorded our highest first quarter ever" Semiconductor materials specialist Soitec reported consolidated revenue of EUR 203 million for the first quarter of FY’23, up 12% compared with EUR 180 million during the first quarter of FY’22.
ClassOne acquires complete chip line ClassOne Equipment says it has acquired a major semiconductor fab’s complete chip manufacturing line.
SkyWater to bolster chip fabrication at Purdue SkyWater plans to open a $1.8 billion semiconductor manufacturing facility in Discovery Park District at Purdue University to create 750 new direct jobs within five years.
Toyo Ink Group to focus on electronics materials in Shenzhen Toyo Ink SC Holdings Co., Ltd., the parent company of the Tokyo-based materials manufacturer Toyo Ink Group, recently opened the Shenzhen Toyo Ink Technical Center in Shenzhen, China.
SkyWater awarded $27M option to facilitate US semiconductors The Department of Defense is funding a $27 million Other Transactional Agreement Option for SkyWater to further develop intellectual property (IP) for its 90 nm Strategic Rad-Hard by Process (RH90) FDSOI technology platform.Load more news