Components | November 30, 2021
WiLAN subsidiary acquires wired connectivity patent portfolio
Wi-LAN Inc. ( WiLAN), a Quarterhill company, says that one of its subsidiaries has acquired a patent portfolio from a publicly-traded company working in the semiconductor space.
The acquired patents, from the unnamed semiconductor technology company, relate to wired connectivity functionality, including various USB-C technologies used in a wide range of applications such as desktop and laptop computers, tablets, mobile phones, gaming consoles, and smart TVs, a press release reads. No further details on the transaction have been made public.
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Filtronic opens new design centre in Manchester Filtronic, a designer and manufacturer of RF-to-mmWave components and subsystems, has recently employed several additional engineers to extend the capabilities of both its design team and its process engineering team. Adding to this expansion, the company has also opened a new design centre in Manchester, UK
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The UK is looking into Broadcom’s acquisition of VMware The UK’s Competition and Markets Authority (CMA) is looking into whether chipmaker Broadcom’s USD 61 billion acquisition of VMware may substantially lessen competition.
Heilind's SVP Alan Clapp looks back at 2022 2022 has been a year of challenges for most companies, for connector specialist Heilind these challenges proved to be a "blessing in disguise" as they opened up a lot of customer opportunities due to the supply chain issues.
Cambridge GaN Devices secures funds to scale up The fabless semiconductor company has raised USD 19m in Series B funding. The investment will enable Cambridge GaN Devices (CGD) to begin mass production of its range of GaN transistors for power applications.
Sponsored content by congatec GmbHHeterogeneous core technology for multifunctional embedded client systems Computer-on-Modules with 12th generation Intel Core processors (formerly codenamed Alder Lake) deliver tremendous performance scalability with their 4 to 16 cores and 8 to 24 threads. Their hybrid architecture, with Performance- and Efficient-cores, suits a wide range of applications, from industrial workstations to workload consolidation in IoT-connected machines and systems. To ensure high cybersecurity, the IIoT gateway functions are implemented in real-time capable virtual machines instead of containers. Meanwhile, these new Computer-on-Modules also solve many of the procurement problems OEMs face for their existing products.
EU agree to foot €2.4 billion for satellite internet system The Council and the European Parliament reached a provisional agreement on a regulation establishing the EU's secure connectivity programme for the period 2023-2027.
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Nexperia ordered to divest almost all of Newport Wafer Fab The UK government has ordered Nexperia to divest 86% of its semiconductor wafer factory in South Wales, known as Newport Wafer Fab (NWF).
Harting and TTI Europe expand their sales partnership The Harting Technology Group and TTI, Inc. Europe are expanding their authorised sales partnership to the European region.
Sivers Semiconductors enters new emerging radar markets Sivers Semiconductors' close cooperation with the Canadian start-up aiRadar has resulted in "a line of sophisticated radar products", a press release states.
BorgWarner invests $500 million in Wolfspeed Wolfspeed and BorgWarner are entering into a strategic partnership under which BorgWarner will invest USD 500 million in Wolfspeed's financing transaction in exchange for a SiC device capacity corridor.
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South Korea to get ASML's new hub The Dutch semiconductor production equipment maker ASML will open a new support hub in South Korea.
Berkshire Hathaway buys stake in TSMC Warren Buffett's Berkshire Hathaway has disclosed a USD 4 billion stake in Taiwan Semiconductor Manufacturing.Load more news