© II VI Business | November 10, 2021
II-VI to supply SiC substrates for Tianyu's power electronics
II‐VI Incorporated says it has been selected by Dongguan Tianyu Semiconductor Technology Co., Ltd., as the company's primary strategic partner for supply of 150 mm SiC substrates for power electronics.
The electrification of the transportation infrastructure is driving a market transition to power electronics based on SiC, a third-generation or wide-bandgap semiconductor, which enables power electronics to be smaller, more efficient, and with lower total system-level cost of ownership compared with state-of-the-art silicon-based devices. Tianyu is one of China’s first and largest SiC epitaxial wafer manufacturers. “We’re excited to support Tianyu’s high-volume requirements for SiC substrates,” says Sohail Khan, Executive Vice President, New Ventures & Wide-Bandgap Electronics Technologies Business Unit in a press release. “Tianyu will immediately benefit from our 150 mm SiC global production capacity in the U.S. and in China.” “II-VI is a world-class supplier of high-quality 150 mm silicon carbide substrates,” adds Li Xiguang, GM of Tianyu. “Together, Tianyu and II-VI will provide the high-quality and reliable supply chain and future 200 mm capability that will be critical to support the rapidly growing demand for SiC power electronics in the mega-markets of electric vehicles, renewable energy, smart grids, microgrids, and power supplies for data networks.”
Nexperia uses Aixtron equipment as it enters the SiC market Semiconductor manufacturer Nexperia, is using Aixtron's production technology to enter the high performance SiC device market.
Micron and UMC team up to strengthen supply chains Micron says it is expanding its business relationship with United Microelectronics Corporation (UMC), which will provide "Micron opportunities to secure supply for automotive, mobile and critical customers into the future."
Sponsored content by OMRON EuropeInvest in advanced solutions from OMRON, Industry-leader. Achieving flawless operation takes ongoing investment in technologies such as 3D AOI. The Omron VT-S1080 3D AOI delivers value through advanced, stable, and accurate 3D capabilities. The AI-assisted and IPC-correlated Solder Joint Inspection is ideal for today’s more dynamic assemblies.
Global Semiconductor equipment billings jump 38% YoY in Q3 Global semiconductor equipment billings increased a robust 38% year-over-year to US D26.8 billion in the third quarter of 2021, an 8% rise from the prior quarter to register their fifth consecutive quarter-over-quarter record high, SEMI reports.
Littelfuse completes its acquisition of Carling Littelfuse has completed its previously announced acquisition of Carling Technologies.
Amphenol acquires Halo Technology Amphenol Corporation announces that the company has acquired Halo Technology Limited for approximately USD 715 million. Separately, Amphenol also announced the closing of the sale of the MTS Test & Simulation business to Illinois Tool Works Inc.
Jenoptik completes the acquisition of BG Medical and SwissOptic With these acquisitions, Jenoptik continues to focus on its core competency in photonics while speeding up profitable and sustainable growth.
Sponsored content by Siemens EDADigital transformation: How Siemens EDA helps you engineer a smarter future faster We are living in an age of ever-accelerating digital innovation, where worldwide knowledge, commerce and communication are broadly accessible and literally at our fingertips. Over the past six decades, thousands of companies in the tech sector have worked diligently to bring new, ever-more sophisticated electronic innovations to market daily, culminating in today’s age of digitalization, which is rapidly changing how we live, travel, conduct business and communicate. This pace of digital transformation will accelerate even more rapidly as more companies begin to incorporate artificial intelligence (AI) and machine learning (ML) into their systems to leverage and even monetize the exponentially increasing amount of data produced by seemingly “everything digital.”
TouchNetix gains automotive qualification for family of touchscreen controller ICs UK manufacturer of high-performance touchscreen controller ICs, TouchNetix, announces that its aXiom AX112 user interface chip has gained qualification to the Automotive Electronics Council’s AEC-Q100-6 standard, validating the device’s use in applications such as the central information display in passenger cars and other types of vehicles.
Mercury Systems acquires RF module manufacturer Mercury Systems announces that the company has acquired Norcross, Georgia based RF module manufacturer, Atlanta Micro.
Syntronixs Asia becomes part of Infineon German semiconductor manufacturer, Infineon, has via its subsidiary Infineon Technologies (Malaysia) Sdn. Bhd. acquired Syntronixs Asia Sdn. Bhd., a Melaka-based electroplating company.
Intel’s EU investment: Details to be expected soon Earlier this year US chip manufacturer Intel launched a USD 20 billion expansion plan which would see the construction of two new chip plants in Arizona – as well as an expansion in Europe.
X-FAB releases statement following explosion at Texas fab On November 12, 2021, an explosion occurred at X-FAB’s site in Lubbock, Texas, during maintenance work done at the deionized water system. One employee lost his life, another employee was taken to hospital with non-life-threatening injuries and was later released.
AKM provides an update on its fire damaged fab In late October last year a fire broke out at Asahi Kasei Microsystem’s (AKM) semiconductor factory in Nobeoka, Miyazaki prefecture. The fire completely ravished the fab and took a total of three days to completely extinguish. But how does the company fare today?
Micron and UMC reaches a global settlement According to the global settlement agreement, both companies will globally withdraw their complaints against the other party, and UMC will make a one-time payment of an undisclosed amount to Micron.
Sponsored content by ElectrolubeAre Encapsulation Resins Suitable for EV Applications? Beth Turner from Electrolube (MacDermid Alpha Electronic Solutions) discusses how and where encapsulation resins can be incorporated into electric vehicle design to protect vital electronics and improve overall efficiency.
A*STAR and STMicro team up on SiC R&D for the EV market The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and STMicroelectronics are launching an R&D collaboration in the field of silicon carbide for power-electronics applications in the automotive and industrial markets.
Jochen Hanebeck to succeed Reinhard Ploss as CEO of Infineon The Supervisory Board of German chip giant, Infineon, has decided that Jochen Hanebeck will take over as the new Chief Executive Officer of Infineon Technologies AG on 1 April 2022.
European Semiconductor distribution sales sets new records DMASS reports a whopping 31.8% growth in semiconductors in Q3 and +44.7% in interconnect, passive and electromechanical components. Shortages remain biggest problem for entire industry.
Jenoptik signs agreement to sell Vincorion Jenoptik AG has signed an agreement to sell the Vincorion division. It will be acquired by a fund managed by private equity firm STAR Capital Partnership LLP.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
NAND Flash revenue rises by 15% QoQ for 3Q21 The growth of the NAND Flash market in 3Q21 was primarily driven by strong demand from the data center and smartphone industries, according to TrendForce’s latest investigations.
Samsung to invest $17 billion in new Texas fab South Korean electronics giant, Samsung, has chosen Taylor, Texas to build a new, USD 17 billion, semiconductor manufacturing facility.
Qualcomm acquires Clay AIR Clay AIR, an AI powered hand tracking and gesture recognition technology company, has been acquired by Qualcomm.
AmpliTech to acquire Spectrum Semiconductor Materials AmpliTech Group, a designer, developer and manufacturer of signal-processing components, has executed a definitive agreement to acquire the assets and operations of San Jose-based Spectrum Semiconductor Materials Inc., a specialty distributor of semiconductor components.
Veeco ships first system from new manufacturing facility Veeco Instruments says that the company has shipped the first LSA101 Laser Spike Annealing System from its new San Jose, California facility to an unnamed semiconductor manufacturer.
Smith to divest its Its solar division The distributor of electronic components says that it has signed an agreement to sell its solar sales and services division, known as ONTILITY Powered by Smith, to BBB Industries, LLC under its new division, TerrePower.
TTI to acquire SMD Inc. Specialty distributor of electronic components, TTI, Inc.,has entered into a purchase agreement to acquire SMD Inc., a privately held electronic component distributor headquartered in Irvine, California.
Former GlobalFoundries executive to lead IQE Following an extensive and rigorous search process, the board of the UK supplier of compound semiconductor wafer products announces that it has appointed Americo Lemos as Chief Executive Officer, starting on 10 January 2022.Load more news