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© SiPearl Business |

SiPearl opens new design center in France

Microprocessor designer SiPearl has opened yet another European design center, this time in Grenoble, France.

SiPearl, currently recruiting 10 engineers per month, is targeting 1,000 employees in 2025. To attain this goal, SiPearl is creating design centers in semiconductor and HPC skills pools. Laure Perfetti has been appointed Head of Human Resources for SiPearl. Laure’s career to date has been with STMicroelectronics, where she notably built an important network of contacts in the semiconductor sector, in France and internationally. As Human Resources Business Partner in the microcontrollers and digital ICs group, she had responsibility for two product and support functions divisions with 1,100 employees worldwide, the company states in a press release. Laure joined SiPearl on August 30th with the mission is to define and deploy an agile and flexible human resources strategy in line with the rapid rise of SiPearl in Europe and its future business challenges. In this capacity, she will steer recruitment, integration and retention of employees, skills development, social aspects and remuneration policy. With headquarters in Maisons-Laffitte and design centers in Barcelona (Spain), Duisburg (Germany) and Sophia Antipolis (France), SiPearl is currently recruiting 10 engineers per month with a view to reaching 1,000 staff by 2025. The new design center in Grenoble is the company's 5th center in Europe.
Kioxia starts operation at two new R&D facilities Kioxia has officially started operation at two new R&D facilities — its flagship building at the Yokohama Technology Campus and the Shin-Koyasu Technology Front — strengthening the company’s R&D capabilities in flash memory and SSDs.
Macom establishes European semiconductor centre Macom Technology Solutions Holdings has completed the acquisition of the key manufacturing facilities, capabilities and technologies of Ommic SAS. Going forward, the facility, which is located near Paris in Limeil-Brévannes, France, will become the foundation for Macom's newly established European semiconductor centre.
Magnachip to separate its display and power businesses Magnachip Semiconductor sya that it plans to separate its display and power businesses into separate entities.
Vitesco and onsemi sign SiC long-term supply deal Vitesco Technologies and onsemi have entered into a 10-year long-term supply agreement worth USD 1.9 billion (EUR 1.75 billion) for SiC products to enable Vitesco's ramp in electrification technologies.
Tenstorrent partners with LG to build AI and RISC-V chiplets Tenstorrent and LG Electronics are collaborating to build a new generation of RISC-V, AI, and video codec chiplets to potentially power LG's future premium TV and automotive products and Tenstorrent's data center products.
Siemens Healthineers invests € 80 million in new semiconductor factory Siemens Healthineers says that the company is building a new factory in Forchheim, Germany for the cultivation of crystals for semiconductor production.
MediaTek partners with Nvidia to provide full-scale product roadmap to the auto industry MediaTek has entered into a partnership with Nvidia to deliver a complete range of in-vehicle AI cabin solutions for the next generation of software-defined vehicles.
Apple investments with European suppliers top €20 billion in 2022 Apple's spending with European suppliers has increased more than 50% since 2018, totalling EUR 85 billion over the past five years and more than EUR 20 billion in 2022 alone.
China requests Japan to lift export restrictions on chips Commerce Minister Wang Wentao has requested Japan to stop its restrictions on semiconductor exports, calling it a "wrongdoing" that "seriously violated" global trade and economic norms.
Innoscience responds to EPC's lawsuits Innoscience Technology says that it "vigorously responds" to Efficient Power Conversion Corporation (EPC) lawsuit against the Chinese company. Innoscience says that the investigation and lawsuit initiated by EPC are inconsistent with the facts.
EPC sues competitor Innoscience for patent infringement Gallium nitride (GaN) technology specialist, Efficient Power Conversion Corporation (EPC), has filed complaints in federal court and in the US International Trade Commission (ITC) asserting four patents of its foundational patent portfolio against Innoscience (Zhuhai) Technology Co Ltd. and its affiliates.
White Horse Laboratories expands facility to boost services White Horse Laboratories announces a significant expansion of its Hong Kong facility, emphasising the enhancement of test capabilities to include AS6081 methods A1-A6 and drawing attention to its logistics services.
Mitsubishi Electric and Coherent to scale SiC manufacturing Mitsubishi Electric and materials specialist Coherent Corp.have signed a memorandum of understanding to collaborate on a program looking to scale manufacturing of SiC power electronics on a 200 mm technology platform.
Sivers Semiconductors kicks off foundry capacity project Sivers Photonics, a business unit of Swedish Sivers Semiconductors, is looking to expand its capacity to meet volumes of more than 1,000 wafers per week.
Ayar Labs adds $25 million in expansion of its $130 million series C Ayar Labs, a leader in silicon photonics for chip-to-chip connectivity, today announced it has raised an additional USD 25 million in Series C1 funding, bringing its total Series C raise to USD 155 million.
Global semiconductor packaging materials market to near $30B by 2027 Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach USD 29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the USD 26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International reports.
Apple inks multibillion-dollar deal with Broadcom for US made components Apple has entered into a new multiyear, multibillion-dollar agreement with Broadcom under which the semiconductor company will develop 5G radio frequency components — including FBAR filters — and wireless connectivity components.
Infineon builds a new logistics building at its Villach site In March earlier this year, Infineon Austria started the construction of a new logistics building at its site in Villach.
Henkel opens technology centre in Bridgewater Henkel has officially opened its Technology Centre in Bridgewater, New Jersey, US. Occupying 70,000 square feet, the facility showcases Henkel’s entire technology portfolio of adhesives, sealants, functional coatings and specialty materials.
Marvell to set up semiconductor design centre in Vietnam Marvell Technology says that it plans to establish a "world-class" design centre in Ho Chi Minh City, Vietnam. Once completed, the site is said to become the home to advanced semiconductor engineering.
Mitsubishi Electric & Movensys team up to expand AC servo and motion control business Mitsubishi Electric and Movensys have entered into a business partnership to strengthen collaboration in their respective AC servo and motion control businesses. As part of the agreement, Mitsubishi Electric will take an equity stake in Movensys.
Würth Elektronik expands its capacities in Sweden The Swedish subsidiary of the German technology group has moved, something that has resulted in the company getting their hands on significantly more available space.
Samsung's 12nm-Class DDR5 DRAM has started mass production Samsung Electronics' 16-gigabit (Gb) DDR5 DRAM, which utilises 12nm-class process technology, has started mass production.
Applied Materials to invest billions in new Silicon Valley R&D center Applied Materials says that it intends to build the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment R&D.
China shuts the door on Micron The Cyberspace Administration of China (CAC) says that Micron Technology's products are a national security risk and that operators of critical information infrastructure in China should stop purchasing Micron products.
Micron to bring EUV technology to Japan Micron Technology says it will be introducing extreme ultraviolet (EUV) technology to Japan to manufacture its next generation of DRAM, the 1-gamma (1γ) node.
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May 29 2023 3:20 pm V20.14.29-1
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