© Continental AG Business | September 30, 2021
Continental and Horizon Robotics form JV on Automotive AI Technology
Continental and Horizon Robotics signed a Joint Venture (JV) contract, focusing on providing hardware and software integrated solutions for Advanced Driver Assistance Systems and automated driving. The JV will be located in Shanghai, China.
Continental will be the majority shareholder. They also signed the investment contract with Shanghai Jiading Industrial Zone that the new JV will be located in Jiading District Shanghai. The JV is expected to have around 200 employees. Continental and Horizon Robotics have been cooperating for several years already. This has led first to a Memorandum of Understanding (MoU) to cooperate, which was published early last year. This was followed by another MoU at the Auto Shanghai this year, to form a JV. At that time the cooperation had picked up further momentum so that both companies decided to work together even more closely. The target of the JV is to integrate Horizon Robotics’ processors and algorithms in smart cameras and control units for ADAS and Automated Driving from Continental and to give Horizon Robotics a global reach and manufacturing footprint for its technology. It will serve the Chinese market as well as international OEMs globally. Some Chinese car manufacturers have already shown interest in working with the JV for mass production. The Joint Venture also signed a MOU for a cooperation with global automotive software specialist Elektrobit., who will provide reliable software products and solutions of underlying standardised vehicle infrastructures, so that the JV can focus on developing differentiated features and innovations. “We highly respect the focus and speed with which our partner Horizon Robotics is driving forward automotive AI technology. This approach to innovation is what the market needs. By forming a Joint Venture with our new partner, we can leverage a powerful combination of cutting-edge AI technology and the longstanding manufacturing and quality process expertise with best-in-class and affordable products”, said Frank Petznick, head of the Advanced Driver Assistance Systems business unit at Continental. "The automobile industry has fully entered the intelligent stage. Being in the center of the stadium, only by embracing new thinking, innovative mentality and open mind can we seize the opportunity of industrial transformation”, said Kai Yu, founder and CEO of Horizon Robotics. “Continental has a century-old history and continues to lead the innovation and upgrading of the global automotive industry. And Horizon Robotics has a deep accumulation of artificial intelligence technology and the ultimate local service. We two parties establish a joint venture company to create a brand-new industrial cooperation model and will work together to become the firm implementer and practitioner of the industrialization of smart cars.”
onsemi divests Niigata, Japan fab onsemi continues to execute its "fab-liter" strategy and has completed of the sale of its Niigata, Japan facility to JS Foundry K.K.
Ixana raises $3M with wearable silicon chip Ixana, a wearable hardware company developing high-speed human-computer interfaces, has raised USD 3 million in funding backed by Uncorrelated Ventures, Samsung Next, Evonexus, Paradigm Shift and Hack VC.
STMicro and Soitec cooperate on SiC substrate manufacturing technology STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
Pendulum Instruments introduces a 4-channel Frequency Counter/Analyzer Pendulum Instruments, the global expert in time & frequency measurement, analysis, and calibration, announces today the release of the new CNT-104S Multi-channel Frequency Analyzer.
Intel is officially a landowner in Germany The US chip manufacturer has big plans for Europe and Germany in prearticular. The German city of Magdeburg won the lottery when Intel earlier this year announced that it would invest EUR 17 billion euros in a “leading-edge semiconductor fab mega-site”.
Kyocera AVX invests in Hentec/RPS system Kyocera AVX has purchased a Pulsar solderability testing system from Hentec Industries/RPS Automation for its Bangkok, Thailand facility.
Managing obsolescence: FED and COGD agree on cooperation The German Electronics Design and Manufacturing Association (FED) and the Component Obsolescence Group Deutschland (COGD) signed a cooperation agreement at Electronica in Munich.
Trading platform aims to alleviate chip shortage Precogs has launched CHIPSMARKET, an online marketplace for OEM-EMS-ODM businesses to trade chips directly between each other, with brokers, and with distributors.
Richardson portfolio with Gallium Semiconductor Richardson Electronics has entered into a a global distribution agreement with Gallium Semiconductor.
LITEON accelerates – inaugurates phase II Vietnam plant LITEON Technology says that the second phase of its manufacturing facility in Haiphong, Vietnam, has officially been inaugurated.
Layoffs await at GlobalFoundries as the company looks to cut costs The semiconductor manufacturer is planning to reduce its workforce as the company looks to navigate itself through a period of weaker demand and increased costs.
GlobalFoundries to tackle the supply chain with new appointment Ashlie Wallace will lead GlobalFoundries' global supply chain operations, including logistics, supply planning, sourcing, and procurement. She will step into her new role on November 28, 2022.
Filtronic opens new design centre in Manchester Filtronic, a designer and manufacturer of RF-to-mmWave components and subsystems, has recently employed several additional engineers to extend the capabilities of both its design team and its process engineering team. Adding to this expansion, the company has also opened a new design centre in Manchester, UK
Hunan Sanan secures order worth $524 million Hunan Sanan, a Sanan Optoelectronics subsidiary, has signed a procurement letter of intent (LOI) agreement with an automotive partner. Under the agreement, Hunan Sanan will supply USD 524 million worth of SiC chips to the automaker's new electric vehicle product line in the next few years.
The UK is looking into Broadcom’s acquisition of VMware The UK’s Competition and Markets Authority (CMA) is looking into whether chipmaker Broadcom’s USD 61 billion acquisition of VMware may substantially lessen competition.
Heilind's SVP Alan Clapp looks back at 2022 2022 has been a year of challenges for most companies, for connector specialist Heilind these challenges proved to be a "blessing in disguise" as they opened up a lot of customer opportunities due to the supply chain issues.
Cambridge GaN Devices secures funds to scale up The fabless semiconductor company has raised USD 19m in Series B funding. The investment will enable Cambridge GaN Devices (CGD) to begin mass production of its range of GaN transistors for power applications.
EU agree to foot €2.4 billion for satellite internet system The Council and the European Parliament reached a provisional agreement on a regulation establishing the EU's secure connectivity programme for the period 2023-2027.Load more news