Products | August 16, 2021
AT&S technology enables the world's smallest digicam
1mm2 in size and 1 gram in weight; the image sensor is smaller than a grain of rice, lighter than a postage stamp but more powerful than any previous development of its kind.
This is a product release announcement by AT&S Austria Technologie & Systemtechnik AG. The issuer is solely responsible for its content.
With a size of 1 mm² and a weight of about 1 gram, the image sensor is so small that it can not only be installed in smartphones, VR cameras, and other wearables but can also be integrated into medical applications such as endoscopes. After all, miniaturization is becoming increasingly important in microelectronics. High-end applications must become smaller and smaller, and at the same time, it is a matter of having more and more space available for additional or more powerful components and new features to increase the functionality of the respective applications. Especially in the field of medical technology, miniaturization takes on another important component: the smaller the devices used for diagnosis or treatment, the gentler it is for the patient. "The image sensor not only creates sharp images due to its 100,000-pixel resolution, but it also has low power consumption thanks to our smart connection architecture," says Markus Maier, Global Account Manager at AT&S. AT&S developed the printed circuit board for the sensor, while the sensor itself was built by the Styrian supplier of high-performance sensor solutions, ams OSRAM. ams OSRAM is a leading global supplier of optical solutions headquartered in Austria, with which AT&S has already collaborated on technology projects in the past. The successful cooperation between the two Styrian high-tech companies is also proof of how Austrian know-how is helping to shape the high-tech world. The digicam sensor, which provides digital video output, enables all kinds of visual sensing for mobile applications. One of the first products to integrate the AT&S solution is ams OSRAM's NanEye, one of the smallest digital cameras on the market. NanEye has a wide range of applications, such as eye-tracking in VR goggles, but can also be used in the medical field. The AT&S development is integrated, for example, in a camera head used for endoscopic examinations. For AT&S, this product is very special - firstly, the AT&S hardware design team from AISS (Advanced Interconnect Solution Services) created the layout. Second, the interconnect design was realized using ECP (Embedded Component Packaging) technology. ECP enables both active and passive components to be integrated into laminate-based substrates, i.e. high-tech printed circuit boards, in a minimum of space. "Instead of placing the components on the PCB, they are integrated into the PCB. They 'disappear' inside the PCB," Maier says. Moreover, the NanEye project is an example of one of those products that AT&S will be offering more frequently in the future, for in addition to the technology, AT&S has also developed the circuit board design. "This product fits perfectly into our strategy and also shows where our journey will take us," explains Günter Köle, Director Advanced Interconnect Solution Service at AT&S. "In the future, we will not only develop interconnect solutions, with which we have become one of the global technology leaders, but we will become a provider of complete solutions. I am proud that with our solutions we are helping to develop products that not only set new standards but can also be used to solve society's challenges and problems," says Günter Köle.
onsemi divests Niigata, Japan fab onsemi continues to execute its "fab-liter" strategy and has completed of the sale of its Niigata, Japan facility to JS Foundry K.K.
Ixana raises $3M with wearable silicon chip Ixana, a wearable hardware company developing high-speed human-computer interfaces, has raised USD 3 million in funding backed by Uncorrelated Ventures, Samsung Next, Evonexus, Paradigm Shift and Hack VC.
STMicro and Soitec cooperate on SiC substrate manufacturing technology STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.
Pendulum Instruments introduces a 4-channel Frequency Counter/Analyzer Pendulum Instruments, the global expert in time & frequency measurement, analysis, and calibration, announces today the release of the new CNT-104S Multi-channel Frequency Analyzer.
Intel is officially a landowner in Germany The US chip manufacturer has big plans for Europe and Germany in prearticular. The German city of Magdeburg won the lottery when Intel earlier this year announced that it would invest EUR 17 billion euros in a “leading-edge semiconductor fab mega-site”.
Kyocera AVX invests in Hentec/RPS system Kyocera AVX has purchased a Pulsar solderability testing system from Hentec Industries/RPS Automation for its Bangkok, Thailand facility.
Managing obsolescence: FED and COGD agree on cooperation The German Electronics Design and Manufacturing Association (FED) and the Component Obsolescence Group Deutschland (COGD) signed a cooperation agreement at Electronica in Munich.
Trading platform aims to alleviate chip shortage Precogs has launched CHIPSMARKET, an online marketplace for OEM-EMS-ODM businesses to trade chips directly between each other, with brokers, and with distributors.
Richardson portfolio with Gallium Semiconductor Richardson Electronics has entered into a a global distribution agreement with Gallium Semiconductor.
LITEON accelerates – inaugurates phase II Vietnam plant LITEON Technology says that the second phase of its manufacturing facility in Haiphong, Vietnam, has officially been inaugurated.
Layoffs await at GlobalFoundries as the company looks to cut costs The semiconductor manufacturer is planning to reduce its workforce as the company looks to navigate itself through a period of weaker demand and increased costs.
GlobalFoundries to tackle the supply chain with new appointment Ashlie Wallace will lead GlobalFoundries' global supply chain operations, including logistics, supply planning, sourcing, and procurement. She will step into her new role on November 28, 2022.
Filtronic opens new design centre in Manchester Filtronic, a designer and manufacturer of RF-to-mmWave components and subsystems, has recently employed several additional engineers to extend the capabilities of both its design team and its process engineering team. Adding to this expansion, the company has also opened a new design centre in Manchester, UK
Hunan Sanan secures order worth $524 million Hunan Sanan, a Sanan Optoelectronics subsidiary, has signed a procurement letter of intent (LOI) agreement with an automotive partner. Under the agreement, Hunan Sanan will supply USD 524 million worth of SiC chips to the automaker's new electric vehicle product line in the next few years.
The UK is looking into Broadcom’s acquisition of VMware The UK’s Competition and Markets Authority (CMA) is looking into whether chipmaker Broadcom’s USD 61 billion acquisition of VMware may substantially lessen competition.
Heilind's SVP Alan Clapp looks back at 2022 2022 has been a year of challenges for most companies, for connector specialist Heilind these challenges proved to be a "blessing in disguise" as they opened up a lot of customer opportunities due to the supply chain issues.
Cambridge GaN Devices secures funds to scale up The fabless semiconductor company has raised USD 19m in Series B funding. The investment will enable Cambridge GaN Devices (CGD) to begin mass production of its range of GaN transistors for power applications.
EU agree to foot €2.4 billion for satellite internet system The Council and the European Parliament reached a provisional agreement on a regulation establishing the EU's secure connectivity programme for the period 2023-2027.Load more news