© mikael damkier dreamstime.com Business | May 11, 2021
CEVA to acquire chip design specialist
CEVA, a licensor of wireless connectivity and smart sensing technologies, will acquire Massachusetts-based chip design specialist Intrinsix for approximately USD 33 million in cash.
For nearly 35 years, Intrinsix has been providing complex System-on-Chip (SoC) design expertise in the areas of RF, mixed signal, digital, software, secure processors and interface IP for Heterogenous SoCs (HSoCs), otherwise referred to as chiplets. Intrinsix has a strong foothold in aerospace & defense, a market that is estimated to reach USD 6 billion in semiconductor spending in 2022. The company is also involved in the development of chiplets and secure processors for DARPA projects. "The acquisition of Intrinsix will provide us with new growth vectors and a larger market reach. We will be able to offer our key customers a comprehensive portfolio of turnkey IP solutions that will capitalize on our off-the-shelf IP and Intrinsix's reputable design capabilities in RF, mixed-signal, security and more. Furthermore, Intrinsix's experience and customer base in the growing chip development programs with the U.S. Department of Defense and DARPA and its IP offerings for processor security and chiplets will extend CEVA's serviceable market and revenue base. We are delighted to welcome the Intrinsix team to CEVA and look forward to the opportunities ahead," says Gideon Wertheizer, CEO of CEVA, in a press release. Jim Gobes, CEO of Intrinsix, adds: "This is an exciting time for the semiconductor industry, with many system companies intending to develop chips and to use IP to build a sustainable, competitive edge and to achieve differentiation. We are thrilled to be joining our development solutions with the wireless connectivity and smart sensing technologies of CEVA, a company at the forefront of the IP space. This combination creates a powerful entity with a strong IP portfolio and advanced chip design capabilities to address and accelerate the strategic need of system companies for custom semiconductors." The closing of the acquisition is anticipated to take place during the second quarter of 2021.
AI chipmaker Hailo collaborates with Renesas The collaboration is said to result in a powerful and energy-efficient processing solution enabling advanced driver-assistance (ADAS) functions and automated driving (AD) systems in motor vehicles.
Mediatek to open design center at U.S. university Fabless chipmaker Mediatek announces commitment to support its first Midwest semiconductor chip design center in West Lafayette, Indiana.
Japan’s next chip challenge: finding engineers Japan, along with a number of companies, has invested a lot to build up the country’s domestic chip industry. The next challenge is to find a multitude of engineers to run and operate it.
Dexerials and SemsoTec to set up an optical solution center Dexerials Corporation, a provider of leading-edge technologies, materials, and devices for smartphones, automobiles, and other products, and German automobile design house SemsoTec Group, will jointly establish an Optical Solution Center for leading-edge In-Vehicle HMIs in Cham, Germany.
90,000 square metres – Arrows new Dutch distribution centre Arrow recently opened its new primary distribution centre (PDC) in Venlo, the Netherlands. The new centre is one of the company’s largest warehouses globally and replaces the existing facilities in the region and also provides increased capacity for future growth.
Nanya breaks ground on new fab in Taiwan Nanya Technology Corporation has broken ground on its new semiconductor fab in New Taipei City’s Nanlin Technology Park. Once completed, the NTD 300 billion (EUR 9.6 billion) investment will result in an advanced fab with a double-deck cleanroom.
First tool arrive at GlobalFoundries new Singapore fab One year after breaking ground, GlobalFoundries can celebrate a significant milestone on the path to expand its semiconductor manufacturing capacity in Singapore. The first tool has been moved into the company's new facility on its Singapore campus.
Sivers Semiconductors completes the integration of MixComm Swedish Sivers Semiconductors says it has completed the integration of MixComm, creating a challenger in 5G, SATCOM and radar.
Inventronics to acquire ams Osram digital systems business Inventronics has entered into an agreement to acquire the Digital Systems business in Europe and Asia from ams Osram, a global leader in optical solutions.
Allied Motion Technologies acquires Airex Allied Motion Technologies, a designer and manufacturer of precision and specialty controlled motion products, has acquired Airex, LLC, a privately-owned company providing high precision electromagnetic components and solutions.
Arrow opens new distribution centre in the Netherlands Arrow Electronics has opened a new primary distribution centre (PDC) in Venlo, the Netherlands. The PDC will function as a key hub serving all customers of Arrow’s electronics components business in Europe.
Smith adds 30,000 square feet of space in Houston The distributor of electronic components has officially opened its new global services hub in Houston, Texas. The new location adds 30,000 square feet of space for the company’s services.
Samsung invests in Israeli AI systems & semiconductor company Samsung Ventures has made an investment in NeuReality, an Israeli AI systems and semiconductor company.
Swedes develop new method for manufacturing semiconductor components AlixLabs from Lund, Sweden, has developed a new method for manufacturing semiconductor components with a high degree of packing, eliminating several steps in the manufacturing process - Atomic Layer Etch Pitch Splitting (APS).
Kinetic closes asset purchase agreement with Gain Semiconductor Analog and mixed-signal semiconductor company, Kinetic Technologies, has completed the acquisition of certain assets of Gain Semiconductor Incorporated.
Socionext relocation of its US HQ to Milpitas Fabless SoC supplier, Socionext America Inc. (SNA), has relocated its US headquarters to a34,000 square foot single floor building in the City of Milpitas.
TF-AMD expands with new manufacturing site in Malaysia TF-AMD Microelectronics plans to expand its manufacturing facility in Penang with the construction of a second site at Batu Kawan Industrial Park, Penang. A move set to create more than 3,000 new jobs.
Ericsson boosts distribution center in Malaysia Swedish telecom company, Ericsson, has commissioned a new facility at the Kuala Lumpur International Airport (KLIA) that will expand its regional distribution capacity and role of Malaysia in the company.
Applied Materials acquires of Finland-based Picosun Applied Materials has acquired Finnish atomic layer deposition (ALD) technology specialist Picosun Oy.
Melexis adds new manufacturing and R&D space in Bulgarian In an update on LinkedIn the company states that it has officially opened ints new “high-tech” building in Sofia, Bulgaria. Melexis says that this new facility will contribute to Bulgaria's presence in areas such as microelectronic, automotive, and innovation.
Arduino finds backing among giants Open-source company, Arduino, plans to expand its portfolio of hardware, software, connectivity and developer tools for professionals. To reach its goals the company launched a Series B financing round, raising USD 32 million from the likes of Bosch, Renesas and ARM.
Farnell expands Toshiba portfolio to support design engineers The global distributor says that it has strengthened its global partnership with Toshiba Electronics Europe GmbH (Toshiba), resulting in a significant product line expansion and increased stock holding.
SK hynix pick Lam solution to enhance DRAM production SK hynix has selected Lam Research's dry resist fabrication technology as a development tool for two key process steps in the production of advanced DRAM chips.
Altair expands and acquires Concept Engineering Computational science and artificial intelligence company, Altair, has acquired Concept Engineering, a provider of electronic system visualization software.
Infineon liquidating its entity in Russia One hundred days after the start of the war, Infineon Technologies reaffirms its solidarity with the people of Ukraine. The company states that it made the decision to liquidate its entity in Russia in March already, which is currently being executed.
Newport Wafer Fab deal called-in for national security assessment The acquisition of the UK’s UK's biggest chip plant – Newport Wafer Fab – has been called in for a full national security assessment.Load more news