© Renesas Business | March 31, 2021
It will take Renesas 100 days to get back on track after the fire
While the company still aims to complete the recovery of the damaged cleanroom at the N3 Building of the Naka fab within one month as initially announced, the company is also aware that it might that much longer.
It was at At 2:47 am on March 19, 2021, that part of the N3 building of Renesas Naka factory caught fire. The N3 building of the Naka factory, which is located on the Ibaraki prefecture, houses the 300mm line. An initial investigation the following day confirmed the cause of the fire to be the plating equipment on the first floor of the N3 Building. The casing of the equipment and the plating tank have relatively low resistance to heat, and the equipment ignited due to overcurrent. The following day, March 21, an investigation led by the manufacturer of the equipment was held, and on March 23, 2021, a detailed investigation led by external specialists dispatched by the equipment manufacturer was also held. Adding to this, the fire department revisited the site to conduct an investigation on March 25 but was unable to determine why the equipment caught on fire and the cause is still under investigation. “We are receiving tremendous assistance from customers, equipment manufacturers, partner companies and construction companies, and they are working with Renesas employees to recover the clean room as early as possible,” Renesas writes in a new update regarding the recovery from the accident. The company says that the procurement of materials used in clean rooms such as filters as well as the clearing of soot and so on, is progressing mostly on track. Renesas currently expects the clean room to be recovered by around mid-April. Around three-quarters of the work-in-process products being manufactured in the N3 Building were not damaged and can be turned into finished products. In its initial updates regarding the damages caused by the fire, the company stated that 11 units of equipment had been damaged. Upon further investigations Renesas uncovered an additional 12 units of equipment that had been affected by the fire. Within the total of 23 units, 11 units are to be procured within April. The even worse news in all of this is that some equipment may not be procured until after June. “We are in discussions with equipment manufacturers to procure the equipment at an earlier date where possible,” the update reads. As stated earlier, the company is aiming to recover the clean room of the N3 Building by around mid-April and resume production within one month – as the company stated in previous update. However, this all hinges on if the company is able to procure all necessary manufacturing equipment by the end of April. If so, Renesas expects to begin product shipment – utilising the remaining work-in-processes from the first floor of the N3 Building – to customers in about 60 days after the fire. And in about 90 days after the fire, the company expects to begin product shipment of the remaining work-in-process of the second floor of the N3 Building. If this plan hold, that would mean that the company would make a 100% recovery of product shipment of products manufactured at the N3 Building in about 100 days after the fire. However, Renesas stresses that this is only viable if all the necessary manufacturing equipment can be procured by the end of April. If there are any delays in the procurement of the equipment, the recovery process will also be delayed.
Helios Technologies to acquire the assets of Joyonway Helios Technologies, a motion control and electronic controls specialist, has entered into a definitive agreement to acquire assets related to the electronic control systems and parts business of Shenzhen Joyonway Electronics & Technology Co., Ltd and its related entities.
Teledyne e2v starts cleanroom upgrade Teledyne e2v Semiconductors have laid the first stone to what will become the company's new upgraded semiconductor assembly and test cleanroom at the factory near Grenoble, France.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
GaN IC company Navitas to go public GaN Power ICs specialis, Navitas Semiconductor, has entered into a definitive agreement to combine with Live Oak Acquisition Corp. II, a publicly-traded special-purpose acquisition company. The transaction, which values the combined entity at $1.4 billion, will result in Navitas becoming a publicly-traded company.
Physik Instrumente continues expansion in Asia Physik Instrumente (PI) is expanding its precision motion offering in the Asia-Pacific region having invested in a new R&D and manufacturing center in Changzhou, China to specifically focus on the local demands in the APAC region.
Overvoltage protection for RTD-based measurement ysstems Question: Is it possible to design a complete RTD module with overvoltage protection?
Ericsson and Samsung sign global patent license agreement Ericsson and Samsung have reached a multi-year agreement on global patent licenses between the two companies, including patents relating to all cellular technologies. The cross-license agreement covers sales of network infrastructure and handsets from January 1, 2021.
Jenoptik secures automation orders in North America Photonics company Jenoptik has secured new automation orders in the US and Canada in the first quarter of 2021 totaling more than 40 million USD that will help increase efficiencies in automotive manufacturing.
Sponsored content by Rochester ElectronicsUncovering the Truth about Semiconductor Counterfeiting Rochester Electronics discusses why AUTHORIZATION is the ultimate tool in the fight against Counterfeit.
In times of supply shortage, or where component obsolescence limits availability, counterfeit devices are more prevalent.
Counterfeiters have moved beyond incorrect logos and packages with no die inside caught by the simplistic visual inspection testing used by those following AS6081. The Counterfeiters now have more sophisticated operations than in the past.
Infineon looking to increase supply of SiC material Infineon says that the company has concluded a supply contract with the Japanese wafer manufacturer Showa Denko K.K. for an extensive range of silicon carbide material (SiC) including epitaxy.
Sources: TSMC is planning five additional fabs in Arizona The worlds biggest semiconductor foundry is reportedly planning to build several new manufacturing facilities in the US, more specifically in Arizona.
Foxconn and Yageo team up to form a semiconductor JV Yageo Group and Foxconn (Hon Hai) Technology Group announces their plans to for a new semiconductor joint venture, XSemi Corporation, for the development and sale of semiconductors.
H. K. Wentworth Group has been acquired MacDermid Alpha Electronics Solutions, a supplier of specialty chemicals and materials used in the semiconductor and PCB markets, has acquired H.K. Wentworth Group, the owner of the Electrolube & AF brands.
EMD Electronics opens new centre of excellence EMD Electronics, a business of Merck KGaA, has inaugurated its new centre of excellence for atomic engineering at Intermolecular's San Jose facility.
Infineon: "The semiconductor market is booming" "The semiconductor market is booming; electronics that help accelerate the energy transition and make work and home life easier remain in high demand. The push for digitalization continues unabated. Infineon is firmly on course to meet its targets for the current fiscal year," says Dr. Reinhard Ploss, CEO of Infineon in the company's quarterly report.
Intel to invest $3.5 billion to expand New Mexico operations The US chipmaker is sinking USD 3.5 billion into its Rio Rancho, New Mexico manufacturing operations to increase its capacity of advanced packaging technologies.
Mobix Labs and Richardson RFPD ink distribution agreement Mobix Labs Inc., a fabless RF (radio frequency) component company focused on next-generation wireless technologies, and Richardson RFPD, an Arrow Electronics company, have entered into a global distribution agreement.
Hprobe receives order for wafer-level magnetic tester Hprobe, a provider of Automatic Test Equipment (ATE) for magnetic devices, today announced a significant order from a tier-1 semiconductor manufacturer for a wafer-level magnetic tester.
Sony starts operations at new fab expansion Sony Semiconductor Solutions Corporation has begun operations on the production lines at the new fab built on the premises of Nagasaki Technology Center in Japan, a production center owned by Sony Semiconductor Manufacturing Corporation.
Optimized power supply measurement setup Question: How can I make sure I’m testing my switching regulator as efficiently as possible?
Vanguard to acquire AU Optronics facility Taiwanese contract chipmaker Vanguard International Semiconductor Corp. has agreed to purchase an 8-inch semiconductor fab (around 48'400sqm) at Hsinchu Science Park for USD 32.5 million.
Mouser adds record 31 new manufacturers to line card The first quarter of 2021 proved to be fruitful start to the year for Mouser Electronics as it bolstered its line card by adding 31 new manufacturers during the first three months of the year.
UMC to expand capacity at its 300mm Fab 12A P6 in Tainan Taiwanese semiconductor foundry, United Microelectronics Corporation (UMC), is planning to expand capacity at its 300mm Fab 12A Phase 6 (P6) in Taiwan’s Tainan Science Park through a collaboration model with several of its global customers. In total NTD 100 billion (EUR 2.96 billion) will be invested to bump up production.
SK hynix is optimistic about the market condition The South Korean semiconductor says that it made better results both QoQ and YoY in the first quarter as the semiconductor market conditions improved earlier this year.
SiPearl launches recruitment plan – aiming for 1'000 by 2025 The Franco-German microprocessor specialist is launching its first recruitment campaign for its sites in Maisons-Laffitte and Sophia-Antipolis, both in France; as well as its German site in Duisburg. The company says it's recruiting 10 engineers per month in France & Germany.Load more news