© Renesas Business | March 31, 2021
It will take Renesas 100 days to get back on track after the fire
While the company still aims to complete the recovery of the damaged cleanroom at the N3 Building of the Naka fab within one month as initially announced, the company is also aware that it might that much longer.
It was at At 2:47 am on March 19, 2021, that part of the N3 building of Renesas Naka factory caught fire. The N3 building of the Naka factory, which is located on the Ibaraki prefecture, houses the 300mm line. An initial investigation the following day confirmed the cause of the fire to be the plating equipment on the first floor of the N3 Building. The casing of the equipment and the plating tank have relatively low resistance to heat, and the equipment ignited due to overcurrent. The following day, March 21, an investigation led by the manufacturer of the equipment was held, and on March 23, 2021, a detailed investigation led by external specialists dispatched by the equipment manufacturer was also held. Adding to this, the fire department revisited the site to conduct an investigation on March 25 but was unable to determine why the equipment caught on fire and the cause is still under investigation. “We are receiving tremendous assistance from customers, equipment manufacturers, partner companies and construction companies, and they are working with Renesas employees to recover the clean room as early as possible,” Renesas writes in a new update regarding the recovery from the accident. The company says that the procurement of materials used in clean rooms such as filters as well as the clearing of soot and so on, is progressing mostly on track. Renesas currently expects the clean room to be recovered by around mid-April. Around three-quarters of the work-in-process products being manufactured in the N3 Building were not damaged and can be turned into finished products. In its initial updates regarding the damages caused by the fire, the company stated that 11 units of equipment had been damaged. Upon further investigations Renesas uncovered an additional 12 units of equipment that had been affected by the fire. Within the total of 23 units, 11 units are to be procured within April. The even worse news in all of this is that some equipment may not be procured until after June. “We are in discussions with equipment manufacturers to procure the equipment at an earlier date where possible,” the update reads. As stated earlier, the company is aiming to recover the clean room of the N3 Building by around mid-April and resume production within one month – as the company stated in previous update. However, this all hinges on if the company is able to procure all necessary manufacturing equipment by the end of April. If so, Renesas expects to begin product shipment – utilising the remaining work-in-processes from the first floor of the N3 Building – to customers in about 60 days after the fire. And in about 90 days after the fire, the company expects to begin product shipment of the remaining work-in-process of the second floor of the N3 Building. If this plan hold, that would mean that the company would make a 100% recovery of product shipment of products manufactured at the N3 Building in about 100 days after the fire. However, Renesas stresses that this is only viable if all the necessary manufacturing equipment can be procured by the end of April. If there are any delays in the procurement of the equipment, the recovery process will also be delayed.
TSMC's looking to expand with new chip plant in Japan During an online earnings briefing, TSMC CEO C. C. Wei, announced the company's intention to build a specialty technology fab in Japan.
Bosch to set up R&D centre for automotive electronics in Ireland The German engineering and technology company has announced that it will establish an automotive R&D centre in Limerick, Ireland, creating over 30 new jobs over the course of the next two year.
Sponsored content by KyzenThe Effects of pH: Cleaning Agent Properties and Performance in Production As cleaning agents evolve to meet customer and supplier environmental challenges, we take a closer look at the effect of pH cleaning agent properties and performance including material compatibility and rinsing behavior all while answering questions with SIR data.
RFMW and CML Microcircuits ink global distribution agreement RFMW and CML Microcircuits (USA) Inc. announces that the companies are expanding their business relationship. Their existing distribution agreement has now been widened to include global marketing and sales of the CML product portfolio.
New Yorker Electronics acquires Omni-Pro Franchised distributor of passive electronic components and discrete semiconductors, New Yorker Electronics, announces that it has acquired Omni Pro Electronics, Inc., an electronic component distributor, located in Addison, Texas.
Pepperl+Fuchs adds to its capacity with a new facility Pepperl+Fuchs has officially opened its new production site in Trutnov, Czech Republic. This marks the conclusion of a project which started in 2019 and will allow the company to strengthen its position as a producer of industrial sensors.
RISC-V player announces expansion of US operation Andes Technology USA Corp., the HQ of the North America operations of Taiwan-based Andes Technology Corporation, a supplier a RISC-V processor cores, is planning a major expansion of Its US operation.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
NXP Semiconductors names new CFO NXP Semiconductors announces that the company names Bill Betz has been named NXP’s Executive Vice President and Chief Financial Officer, effective immediately.
GlobalWafers / Siltronic deal gets a green light from the US GlobalWafers has provided an update regarding its ts all-cash tender offer for the outstanding ordinary shares of Siltronic AG.
Samsung starts mass production of its 14nm EUV DDR5 DRAM Samsung Electronics says that it has begun mass producing its 14-nanometer DRAM, based on extreme ultraviolet (EUV) technology.
Schurter completes its latest Swiss expansion The new construction and conversion of the Schurter Group headquarters in Lucerne, Switzerland has been completed.
Sponsored content by iTACiTAC presents milestone at productronica 2021: MES becomes MOM The MES specialist iTAC Software AG will present an important milestone in its product development at productronica 2021: The iTAC.MES.Suite becomes the iTAC.MOM.Suite. The company is thus decisively further developing the existing Manufacturing Execution System for the digitalized factory world. The solution, which is being developed in cooperation with iTAC's holding company Dürr AG, has significant new features for controlling, optimizing and predicting production processes in real time. It is based on a completely new, open architecture and can therefore be integrated into existing ecosystems. iTAC will be attending the trade fair from November 16 to 19, 2021 in hall A3 at booth 161.
UK is off the table for potential Intel fab after Brexit The UK would have been a potential site for an Intel fab, but not after Brexit, Intel CEO Pat Gelsinger told the BBC.
Solution from Fingerprint Cards integrated in new Honor MagicBook Swedish biometrics company, Fingerprint Cards, announces that the the company’s new biometric solution for the PC market is integrated in the new HONOR MagicBook V14.
Kanthal sells its semiconductor capital equipment business Heating technology company Kanthal announces that it has reached an agreement to divest its semiconductor capital equipment business to Yield Engineering Systems, Inc. (YES), headquartered in Fremont, California, USA.
Sponsored content by Rochester ElectronicsThe POWER of Authenticity and Reliability Critical End-of-Life Component Management
Product lifecycles typically extend far beyond active semiconductor component availability, making lifecycle status a key factor when planning, at any phase, in the new product introduction (NPI) process.
GaN power IC supplier opens new office in China Navitas Semiconductor, a provider of gallium nitride (GaN) power ICs, has opened a new office in Shenzhen, China which offers the company 300% increase in capabilities to support revenue growth in the region.
Generating very low voltages with standard regulators Question: What is a good solution for generating a tiny dc supply voltage of a few hundred millivolts?
SiPearl opens new design center in France Microprocessor designer SiPearl has opened yet another European design center, this time in Grenoble, France.
Infineon plans to increase investments by 50% next year The German chip manufacturer has provided its investors with an update on its strategy, business performance and long-term perspective as well as on the outlook for the fiscal year 2022.
Sponsored content by HamamatsuModuł C14093 do detekcji promieniowania rentgenowskiego metodą Dual Energy Moduł został wyposażony w matrycę fotodiod do detekcji rentgena. 32-elementowa linijka na wierzchniej stronie przeznaczona jest do detekcji promieniowanie o niskiej energii, a 32-elementowa linijka na spodniej stronie do detekcji promieniowania z wyższego zakresu. Każda linijka połączona jest ze scyntylatorem.
HEICO subsidiary acquires specialised electronics company HEICO Corporation's dB Control subsidiary has acquired 100% of Paciwave, Inc. The RF and microwave specialist is HEICO's 6th acquisition this year.
TI might not be done with Sherman Early last year the news that Texas Instruments disclosed that it planned to close two wafer plants within three to five years. The plants in question were two 50+ year old factories, located in Dallas and Sherman. But TI might not be done with Sherman just yet, the city is a finalist for a new multi-billion dollar production plant.
Business is booming for Flip - Moves into expanded location Flip Electronics has had major success and growth in the last five years. So much so that the authorised distributor of obsolete and excess semiconductor and electronic components recently moved from a 12,000 square feet facility to a new one which provides the company with a total of73,000 square feet.
Marvell completes its acquisition of Innovium The provider of infrastructure semiconductor solutions has completed its acquisition of Innovium, Inc.,and thus broaden its portfolio of silicon solutions targeting cloud data centers.
Cree is no more - welcome Wolfspeed Following a massive four-year transformation, involving the divestiture of two-thirds of the business and a repositioning of the company’s overall core strategy, the company formerly known as Cree is now officially Wolfspeed.
US semiconductor distributor opens office in Germany Smith, a global distributor of electronic components and semiconductors, today announces the opening of its sales office in Berlin, Germany.
Qualcomm and SSW Partners win the battle for Veoneer Qualcomm Incorporated and investment firm SSW Partners, have reached a definitive agreement to acquire Veoneer, Inc. for USD 37.00 per share in an all-cash transaction, representing a total equity value for Veoneer of USD 4.5 billion.Load more news