© ams Business | March 04, 2021
ams' DPLTA with OSRAM in full force
ams says that the Domination and Profit and Loss Transfer Agreement (DPLTA) between its subsidiary ams Offer GmbH, and OSRAM Licht AG became effective on March 03, 2021.
In short this means that the companies will be operating as one company, with over 110 years of combined history and more than 15'000 granted and applied patents between them. “Adding intelligence to light and passion to innovation, our goal is to create leading technology to enrich people’s lives.” says Alexander Everke, CEO of the ams group, in a press release. “Through combining ams and OSRAM, we become a global leader in optical solutions,” With approximately 30'000 employees worldwide the goal is to innovate in the sensing, illumination and visualization technology areas resulting in solutions that help its customers to create new markets. “The combination of ams and OSRAM creates an extraordinary talent base to serve our approx. 20,000 customers globally, and I look forward to working with our combined team. Our technology is designed to make journeys safer, medical diagnosis more effective and daily moments in communication a richer experience. Together we will have a relentless focus on our customers. From emitters to optical components and modules, detectors, integrated circuits and algorithms, we serve the full value chain for optical solutions with an unmatched portfolio”, the CEO continues. Headquartered in Premstätten (Austria) with a co-headquarter in Munich (Germany), the company serves customers in the consumer, automotive, healthcare and industrial technology sectors.
Broadcom to acquire VMware for $61 billion Semiconductor design company Broadcom Inc. will acquire all of the outstanding shares in VMware, in a transaction that values the enterprise software company at approximately USD 61 billion.
GlobalFoundries launches GF Labs At its annual GF Technology Summit (GTS), GlobalFoundries announced the launch of GF Labs, a new program that extends the development horizon of differentiated semiconductor technology.
Sunway partners with BMF to develop next-gen antennas Sunway Communication has partnered with Boston Micro Fabrication (BMF) to develop next generation antennas. The companies have opened a joint development lab in San Diego, California.
InnovationLab acquires flexible printed battery technology from Evonik German printed electronics specialist, InnovationLab, has acquired the TAeTTOOz printable battery technology from Evonik.
Sponsored content by Proval ServiceSince 25 years your partner for SMT stencils and solder pallets. 25 years of experience makes Proval Service not just a supplier but your trustful and grounded partner to support you with SMT stencils and solder pallets. A qualified and unite team can satisfy every customer's need during the whole process.
Motorola secures chip supply with GlobalFoundries deal The US semiconductor foundry has entered into a long-term agreement to safeguard the supply of chip solutions for Motorola Solutions' radios, which are widely used by public safety, critical infrastructure and enterprise organisations.
Foxconn and Yageo JV invests in Taiwan MOSFET manufacturer Hon Hai Technology Group (more commonly know as Foxconn) and Yageo Group have – via their joint venture XSemi – invested NTD 2.89 billion (EUR 91.6 million) in Taiwanese MOSFET manufacturer Advanced Power Electronics Corp.
Nexperia and Kyocera to develop GaN automotive power modules Nexperia and Kyocera AVX Components (Salzburg) GmbH, have entered into a partnership with a focus on power components – the companies aims to jointly developing GaN applications for electric vehicles.
Intel invests $700 million in new Oregon mega lab The US chipmaker plans to invest more than USD 700 million for a 200,000 square-foot, research and development mega lab focused on data center technologies and addressing areas such as heating, cooling and water usage.
Sponsored content by FusionManufacturers Reassess their Supply Chains Prevailing obstacles since the COVID-19 Pandemic in 2020 have manufacturers reassessing their supply chain strategies. The following major disruptions that occurred entering 2022 added to existing setbacks, or created new ones altogether:
Obsolescence management cannot be an afterthought “Obsolescence has always existed. However, it usually only becomes really critical for companies when the exception mutates into the norm. And in recent years we have unfortunately experienced this unwanted development not only with semiconductor chips, but increasingly with many other components, materials and raw materials,” says IIOM President and COGD Chairman Dr Wolfgang Heinbach.
Tower record 1Q22 revenues of $421 Million, a 21% YoY Tower Semiconductor reported first quarter 2022 revenue of USD 421 million, an increase of 21% compared to USD 347 million in the first quarter of 2021.
Gallium Semiconductor opens its Nijmegen R&D center Gallium Semiconductor has officially held the grand opening of its European R&D center in a ceremony in Nijmegen, the Netherlands.
Ferrotec to add manufacturing capacity with new plant in Malaysia Ferrotec, a global supplier of materials, components, and precision system solutions, is establishing a new manufacturing facility at Kulim Hi-Tech Park, Kedah, facilitated by the Malaysian Investment Development Authority (MIDA).
Skeleton targets the Polish market – teams up with ZPUE Supercapacitor specialist, Skeleton Technologies, and ZPUE, a Polish manufacturer of electrical devices for electrical power distribution utilities, have entered into a commercial agreement to provide energy storage solutions to the Polish market.
Texas Instruments breaks ground $30 billion investment The semiconductor manufacturer has broken ground on its new 300mm semiconductor wafer fabrication plants in Sherman, Texas – an investment set to create as many as create as many as 3,000 jobs.
ERP partners with Flip to fulfill EOL and Obsolete component solutions Flip Electronics has signed a franchised distributor partnership agreement with ERP Power (ERP) to distribute its End-of Life (EOL) semiconductor products.
Foxconn and DNeX build and operate wafer fab in Malaysia Dagang NeXchange Berhad (DNeX) and Foxconn subsidiary Big Innovation Holdings (BIH), plan to set up a joint venture company to build and operate a new 300mm wafer fab in Malaysia.
Imec and semiconductor partners target greener chip manufacturing Nanoelectronics research and innovation center, imec, says that it has managed to pool together stakeholders from the semiconductor value chain – from companies such as Apple and Microsoft, to suppliers, including ASM, Kurita, SCREEN and Tokyo Electron – to participate in its Sustainable Semiconductor Technologies and Systems (SSTS) research program.
SiPearl reaches milestone – 100 employees The European chip designer has exceeded 100 employees across its six sites in France (Maisons-Laffitte, Grenoble, Massy, Sophia Antipolis), Germany (Duisburg) and Spain (Barcelona).
Renesas to convert closed factory to 300mm wafer fab Renesas plans to conduct a JPY 90 billion (EUR 664 million) investment in its Kofu factory, located in Kai City, Yamanashi Prefecture, Japan. The company closed the factory back in October 2014, but now intends to reopen the fab in 2024 as a 300mm wafer fab.
Arrow names Jörg Strughold as president EMEA components Arrow Electronics announces that Jörg Strughold will take over as president of its components business in EMEA. He succeeds Martin Bielesch who has decided to leave the company.
€14 billion to attract semiconductor players to Germany EUR 14 billion in state support is the German governments new strategy to attract more chipmakers to the country.
10 different companies have expressed interest in Toshiba Back in April 2022, Toshiba Corporation announced that it had resolved to solicit proposals on strategic alternatives from potential investors and sponsors. The Japanese company is seeking to enhance its corporate value and has since the announcement been holding discussions with the potential partners.
TDK expands with new MLCC production site in Japan Japanese TDK Corporation says that it will construct a new production building on the premises of the Kitakami Factory – located in Kitakami city, Iwate prefecture, Japan – in order to to enhance the company's MLCC production.
Avnet breaks ground on German expansion In order to better serve its customers’ local and global needs, Avnet is expanding in two locations in Germany. Avnet Embedded broke ground on a new manufacturing site in Eschbach and Avnet EMEA plans to build its third European logistics centre in Bernburg.Load more news