Products | February 22, 2021
New 3D Solder Paste Inspection with Cutting-Edge Camera Technology from Viscom
Viscom’s new S3088 ultra chrome system is a 3D SPI solution with cutting-edge camera technology. Developed in-house, the new 3D camera technology is designed to deliver the best performance with respect to optical resolution, inspection speed and inspection quality.
This is a product release announcement by Viscom AG. The issuer is solely responsible for its content.
The compact system design also offers optimized handling to achieve maximum throughputs for single and dual-track operation. Networking the 3D SPI system with the other process stages in SMD manufacturing makes it possible to automatically correct process fluctuations, further enhancing product quality. The 3D SPI S3088 ultra chrome with integrated verification inspect all quality criteria for printed pads, including volume, surface, height, offset, paste bridges and paste smearing – for solder and sinter paste. Viscom’s successful high-end XM camera technology for 3D AOI has now been optimized for 3D SPI. Four angled camera views deliver precise, shadowfree measuring results for 3D solder paste inspection. The XM camera technology enables more precise error detection at a high inspection speed. The orthogonal resolution is 10 µm, which further enhances the inspection of very small areas such as solder paste for 01005 components as well as gaps. The inspection speed is 90 cm²/s with a field of view size of 58.2mmx58.2mm. Thanks to optimized external handling, the time it takes to switch assemblies can be reduced to as little as 2.5 seconds for standard-sized PCBs. The 3D SPI can be networked with AOI and AXI via Viscom Quality Uplink and also networked with paste printers and pick-and-place machines from a wide range of manufacturers via closed loop. Viscom creates all standard interfaces for this purpose. When the S3088 ultra chrome system indicates that there are deviations in the paste print, these can be automatically transferred via a printer-specific closed loop function, e.g. for adjusting the screen cleaning cycles or by correcting print displacement or placement offset. Effective process analysis, quality optimization, and therefore sustainable process monitoring are also made possible via communication with a Viscom AOI, AXI or MXI – and the best first pass yield results can be achieved. With this new development, Viscom offers a more powerful 3D SPI system at an attractive price-performance ratio.
Marvell and Fujitsu partner to deliver 5G baseband technology Fujitsu has selected Marvell's baseband processor silicon to power its new 5G New Radio (NR) base station offerings.
With the shortage still weighing heavy ADI delays fab closure In January Evertiq reported that Analog Devices was planning to permanently close its facility Milpitas, California.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Tower Semi invests to expand its manufacturing capabilities The company is planning a capacity expansion for 200mm and 300mm to answer the exceeding demand forecast.
Synchronous Rectification on the Secondary Side Question: How can I increase the efficiency of my isolated power supply?
Biden to push for $37 billion to boost chip manufacturing US President Joe Biden has responded to the industry’s call to reinvigorate domestic semiconductor manufacturing. The president is pushing a USD 37 billion bill to identify solutions to the semiconductor shortfall.
Kioxia starts the expansion of its Yokkaichi Plant Kioxia has started the construction of new fabrication facility at its Yokkaichi plant, located on the Mie Prefecture, Japan, to support the production of sixth-generation 3D flash memory.
Mycronic receives US order for two SLX systems The Swedish technology company has received an order for two SLX mask writers from an unnamed, but existing customer in the USA. The total order value is between USD 8 and 12 million.
HP to acquire HyperX in a $425 million HP Inc. has entered into a definitive agreement to acquire HyperX, the gaming division of Kingston Technology Company, for USD 425 million.
TSMC ranks in Top10 in three wafer size categories As of December 2020, only TSMC—the world’s largest foundry—was listed among the wafer capacity leaders in each of the three wafer size categories. It had the most 200mm wafer capacity last year and ranked second, trailing only Samsung, in 300mm wafer capacity.
SK Hynix ink $4.3 billion deal with ASML The Dutch supplier of semiconductor equipment has signed a five-year long deal, worth USD 4.3 billion, with SK Hynix as the South Korean company works to secure equipment to boost it output.
Microchip invests $20M in new Irish development centre Up to 200 new engineering jobs will be created in Cork, Ireland as Microchip Technology invests USD 20 million to create a new development centre.
Explosive growth in Automotive DRAM demand expected Driven by such factors as the continued development of autonomous driving technologies and the build-out of 5G infrastructure, the demand for automotive memories will undergo a rapid growth going forward, according to TrendForce’s latest investigations.
Renesas Naka facility is back to full operation Following the earthquake that hit the coast of Fukushima Prefecture and the surrounding areas on February 13, Renesas shut down production at its Naka factory to investigate potential damages. Since then then company has brought the plant back online bit by bit.
Rücker Lypsa is now EDAG Engineering Spain Barcelona-based company Rücker Lypsa S.L. has been operating under the name of "EDAG Engineering Spain, S.L." since January, 2021.
Continental invests in German-US AI chip start-up Continental has acquired a minority stake in the German-US start-up Recogni, a company working on a new chip architecture for object recognition in real time based on artificial intelligence (AI).
Edmund Optics opens new assembly and design facility Edmund Optics, a provider of optical and imaging components, has opened a new Assembly and Advanced Design Facility in Tucson, Arizona, the second Edmund Optics location in the state.
SEMI calls on Biden to reinvigorate US semiconductor manufacturing SEMI, along side 16 industry groups have sent a letter to President Biden urging the administration to bolster domestic semiconductor manufacturing and research.
Solas OLED settles patent disputes with LG Display Solas OLED, an Irish company that specialises in OLED technologies that it licenses to consumer electronics manufacturers, has entered into a Settlement and License Agreement with LG Display, resolving a number of patent infringement actions brought by Solas against LG Display and a certain number of its customers, including Sony.
Panthronics seals global partnership agreement with AdvanIDe Panthronics AG, a fabless semiconductor company specialising in high performance wireless technology, has signed a global partnership agreement with specialist supplier of NFC, RFID and smart card components, AdvanIDe.
Logic ICs account for the largest share of China’s IC market China became the largest IC market in the world in 2005 and has continued to grow in size since then. In 2020, the Chinese IC market increased to USD 143.4 billion, a 9% gain from USD 131.3 billion in 2019.
Why Is my processor leaking power? That sounds like an open-ended question Question: Why is my processor consuming more power than its data sheet suggests?Load more news