TSMC's looking to expand with new chip plant in Japan
During an online earnings briefing, TSMC CEO C. C. Wei, announced the company's intention to build a specialty technology fab in Japan.
Bosch to set up R&D centre for automotive electronics in Ireland
The German engineering and technology company has announced that it will establish an automotive R&D centre in Limerick, Ireland, creating over 30 new jobs over the course of the next two year.
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The Effects of pH: Cleaning Agent Properties and Performance in Production
As cleaning agents evolve to meet customer and supplier environmental challenges, we take a closer look at the effect of pH cleaning agent properties and performance including material compatibility and rinsing behavior all while answering questions with SIR data.
RFMW and CML Microcircuits ink global distribution agreement
RFMW and CML Microcircuits (USA) Inc. announces that the companies are expanding their business relationship. Their existing distribution agreement has now been widened to include global marketing and sales of the CML product portfolio.
New Yorker Electronics acquires Omni-Pro
Franchised distributor of passive electronic components and discrete semiconductors, New Yorker Electronics, announces that it has acquired Omni Pro Electronics, Inc., an electronic component distributor, located in Addison, Texas.
Pepperl+Fuchs adds to its capacity with a new facility
Pepperl+Fuchs has officially opened its new production site in Trutnov, Czech Republic. This marks the conclusion of a project which started in 2019 and will allow the company to strengthen its position as a producer of industrial sensors.
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RISC-V player announces expansion of US operation
Andes Technology USA Corp., the HQ of the North America operations of Taiwan-based Andes Technology Corporation, a supplier a RISC-V processor cores, is planning a major expansion of Its US operation.
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iTAC presents milestone at productronica 2021: MES becomes MOM
The MES specialist iTAC Software AG will present an important milestone in its product development at productronica 2021: The iTAC.MES.Suite becomes the iTAC.MOM.Suite. The company is thus decisively further developing the existing Manufacturing Execution System for the digitalized factory world. The solution, which is being developed in cooperation with iTAC's holding company Dürr AG, has significant new features for controlling, optimizing and predicting production processes in real time. It is based on a completely new, open architecture and can therefore be integrated into existing ecosystems. iTAC will be attending the trade fair from November 16 to 19, 2021 in hall A3 at booth 161.
NXP Semiconductors names new CFO
NXP Semiconductors announces that the company names Bill Betz has been named NXP’s Executive Vice President and Chief Financial Officer, effective immediately.
GlobalWafers / Siltronic deal gets a green light from the US
GlobalWafers has provided an update regarding its ts all-cash tender offer for the outstanding ordinary shares of Siltronic AG.
Samsung starts mass production of its 14nm EUV DDR5 DRAM
Samsung Electronics says that it has begun mass producing its 14-nanometer DRAM, based on extreme ultraviolet (EUV) technology.
Schurter completes its latest Swiss expansion
The new construction and conversion of the Schurter Group headquarters in Lucerne, Switzerland has been completed.
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The POWER of Authenticity and Reliability
Critical End-of-Life Component ManagementProduct lifecycles typically extend far beyond active semiconductor component availability, making lifecycle status a key factor when planning, at any phase, in the new product introduction (NPI) process.
UK is off the table for potential Intel fab after Brexit
The UK would have been a potential site for an Intel fab, but not after Brexit, Intel CEO Pat Gelsinger told the BBC.
Solution from Fingerprint Cards integrated in new Honor MagicBook
Swedish biometrics company, Fingerprint Cards, announces that the the company’s new biometric solution for the PC market is integrated in the new HONOR MagicBook V14.
Kanthal sells its semiconductor capital equipment business
Heating technology company Kanthal announces that it has reached an agreement to divest its semiconductor capital equipment business to Yield Engineering Systems, Inc. (YES), headquartered in Fremont, California, USA.
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The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
GaN power IC supplier opens new office in China
Navitas Semiconductor, a provider of gallium nitride (GaN) power ICs, has opened a new office in Shenzhen, China which offers the company 300% increase in capabilities to support revenue growth in the region.
SiPearl opens new design center in France
Microprocessor designer SiPearl has opened yet another European design center, this time in Grenoble, France.
Infineon plans to increase investments by 50% next year
The German chip manufacturer has provided its investors with an update on its strategy, business performance and long-term perspective as well as on the outlook for the fiscal year 2022.
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Moduł C14093 do detekcji promieniowania rentgenowskiego metodą Dual Energy
Moduł został wyposażony w matrycę fotodiod do detekcji rentgena. 32-elementowa linijka na wierzchniej stronie przeznaczona jest do detekcji promieniowanie o niskiej energii, a 32-elementowa linijka na spodniej stronie do detekcji promieniowania z wyższego zakresu. Każda linijka połączona jest ze scyntylatorem.
HEICO subsidiary acquires specialised electronics company
HEICO Corporation's dB Control subsidiary has acquired 100% of Paciwave, Inc. The RF and microwave specialist is HEICO's 6th acquisition this year.
TI might not be done with Sherman
Early last year the news that Texas Instruments disclosed that it planned to close two wafer plants within three to five years. The plants in question were two 50+ year old factories, located in Dallas and Sherman. But TI might not be done with Sherman just yet, the city is a finalist for a new multi-billion dollar production plant.
Business is booming for Flip - Moves into expanded location
Flip Electronics has had major success and growth in the last five years. So much so that the authorised distributor of obsolete and excess semiconductor and electronic components recently moved from a 12,000 square feet facility to a new one which provides the company with a total of73,000 square feet.
Marvell completes its acquisition of Innovium
The provider of infrastructure semiconductor solutions has completed its acquisition of Innovium, Inc.,and thus broaden its portfolio of silicon solutions targeting cloud data centers.
Cree is no more - welcome Wolfspeed
Following a massive four-year transformation, involving the divestiture of two-thirds of the business and a repositioning of the company’s overall core strategy, the company formerly known as Cree is now officially Wolfspeed.
US semiconductor distributor opens office in Germany
Smith, a global distributor of electronic components and semiconductors, today announces the opening of its sales office in Berlin, Germany.
Qualcomm and SSW Partners win the battle for Veoneer
Qualcomm Incorporated and investment firm SSW Partners, have reached a definitive agreement to acquire Veoneer, Inc. for USD 37.00 per share in an all-cash transaction, representing a total equity value for Veoneer of USD 4.5 billion.
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