Products | December 23, 2020
Winbond’s 1Gb LPDDR3 DRAM in Tsing Micro’s new AI image-processing SoC
Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today that a high-performance, low-power Winbond 1Gb LPDDR3 DRAM product has achieved another great success in high bandwidth memory with Tsing Micro latest artificial intelligence (AI) system-on-chip (SoC).
This is a product release announcement by Winbond Electronics Corporation. The issuer is solely responsible for its content.
Beijing, China-based Tsing Micro’s TX510 SoC is a highly advanced AI edge computing engine optimized for functions such as 3D sensing, face recognition, object recognition and gesture recognition. Paired with Winbond’s LPDDR3 DRAM, which offers maximum bandwidth of 1866Mb/s and operates from a dual 1.2V/1.8V supply with power-saving features such as Deep Power-Down mode and a Clock Stop capability, the TX510 offers outstanding speed and accuracy in AI imaging applications. Tsing Micro (www.tsingmicro.com) has implemented an innovative architecture in the TX510 SoC: it includes a 32-bit RISC processor, a reconfigurable neural network engine, a reconfigurable general computing engine, an image signal processor and a 3D sensing engine. For shipping to customers, the TX510 is combined with Winbond’s 1Gb LPDDR3 DRAM die in a single 14mm x 14mm TFBGA System-in-Package (SiP). Achieving computing throughput of up to 1.2 TOPS (tera operations per second), this SiP can perform accurate face recognition (false acceptance ratio of 1 in 10 million) in less than 100ms, and compare features with a library of 100,000 faces in less than 50ms. Peak operating power consumption is just 450mW, and the chip uses just 0.01mW in quiescent mode. The TX510 is intended for use in applications which require high-speed image detection and recognition, including biometric sensing, video surveillance, smart retail operations, smart home automation and advanced industrial automation. Wang Bo, CEO of Tsing Micro, says: “Evaluation of the Winbond LPDDR3 DRAM shows that it is highly competitive both in terms of speed and power consumption. But equally important to us when developing the TX510 was the support and expertise that Winbond provided to us in integrating the DRAM die into a SiP in such a way that it maintained high performance and high signal integrity while taking care of thermal management.” “Winbond is fast gaining a reputation for providing excellent support to chip and SoC manufacturers which are developing leading-edge AI products. With Winbond low-power DRAM inside, AI products such as the TX510 can set new benchmarks for high performance and throughput while operating from a limited battery power supply,” said Winbond. Winbond’s LPDDR3 DRAM is in mass production. More information can be found at www.winbond.com. More information about the TX510 can be found at www.tsingmicro.com.
Micron to invest $100 billion in New York megafab Micron says it will invest up to USD 100 Billion to build a megafab in central New York, creating approximately 9,000 direct Micron jobs.
onsemi expands operations in Romania The American semiconductor company is opening a new – 3,000 square metre – design center for semiconductor chips in Bucharest, Romania.
Swedish semiconductor manufacturer plans to increase production following investment round SweGaN, a Swedish manufacturer of custom-made Gallium Nitride on Silicon Carbide (GaN-on-SiC) epitaxial wafers, has completed a Series A financing round totaling SEK 125 million (EUR 12 million).
1,000 GF employee’s to transfer to onsemi following fab sale Back in April of 2019, GlobalFoundries agreed to sell its 300 mm fab in East Fishkill, New York, to onsemi. The sale is now nearing completion and the fab, along with its employees will transfer to onsemi.
Fusion Sourcing Group to represent Intelligent Memory Intelligent Memory (IM), a manufacturer of industrial-grade memory product solutions, has signed Fusion Sourcing Group as its representative in the Northeast United States.
Arm names new Chief Financial Officer Arm has appointed Jason Child as Chief Financial Officer (CFO). Child brings more than 30 years of experience in leadership at high-growth companies and scaling global finance functions to his new role.
Spain launches foundry for III-V semiconductors Spain launches its first commercial foundry for III-V Semiconductors targeting integrated photonics.
Silicon Labs expands in India – opens new office in Hyderabad Silicon Labs has officially inaugurated its new office in Hyderabad, located at Salarpuria Sattva Knowledge City. This new office will also be Silicon Labs' largest global centre for engineering and wireless connectivity innovation.
Poland and Taiwan sign agreement on semiconductor collaboration The Polish Office in Taipei and the Taipei Representative Office in Poland have signed a memorandum of understanding (MoU) to establish the Taiwanese-Polish working group on semiconductors.
Kioxia to adjust flash memory production by 30% at two plants Japan’s Kioxia Corporation says that it will reduce the production volume at two of its flash memory plants.
TI starts production at new 300mm fab in Richardson, Texas Texas Instruments' newest 300-millimeter wafer fab in Richardson, Texas, has started initial production and will ramp output over the coming months.
KLA to build a new R&D and manufacturing facility in Wales KLA Corporation says that it plans to build a new R&D and manufacturing center for the SPTS division, in Newport, Wales, UK.
Additional DoD funding reaches SkyWater US semiconductor foundry SkyWater Technology says that the Department of Defense (DoD) has awarded the company up to USD 99 million as a continuation of the previous initiative to advance onshore production capabilities for strategic radiation-hardened (rad-hard) electronics.
Comet Technologies expands manufacturing in Malaysia Comet Technologies says that it aims to double its production capacity in Malaysia – the company will add 30,000 square feet and about 200 employees to its operations in the country.
Swissbit expands its manufacturing capability in Berlin A new USD multi-million investment will add a new new semiconductor packaging line to Swissbit's electronics production in Berlin, Germany.
Henkel acquires Thermexit business from Nanoramic Henkel has completed the acquisition of the Thermal Management Materials business of Nanoramic Laboratories (Nanoramic) headquartered in Boston, Massachusetts, USA, marketed under the brand Thermexit.
Mobix Labs to acquire EMI Solutions Fabless semiconductor company, Mobix Labs, says it has signed a definitive agreement to acquire EMI Solutions, an Irvine-based manufacturer of electromagnetic interference (EMI) filtering products.
Hexatronic acquires the data center specialist Swedish Hexatronic Group has signed an agreement to acquire 90% of the shares in UK-based Impact Data Solutions Limited (IDS Group).
Kontron AIS takes over LUCOM As of September first, 2022, Kontron AIS GmbH has taken over LUCOM GmbH and thus strengthen its portfolio as an IIoT solution provider for industrial software and industrial automation.
VinFast and Renesas ink strategic partnership Vietnamese EV maker, VinFast, is expanding its collaboration with Japanese semiconductor company Renesas to include automotive technology development of EVs and delivery of system components.
Intel's close to making final selection for new Italian site The Italian government and Intel have reportedly selected the town of Vigasio in the northeastern Veneto region as their preferred site for the company’s future chip factory in Italy.
FPT Software launches chipmaking subsidiary Vietnamese ICT company, FPT Software, announces that it has launched a new chip subsidiary, FPT Semiconductor, meaning that the company is entering the booming semiconductor industry.
Habia Cable opens its brand new Polish production facility Habia Cable has officially inaugurated its new, purpose-built, production facility in Poland.
Astera Labs opens new Vancouver location Connectivity solutions specialist Astera Labs has officially opened Astera Labs Vancouver – a new office and lab to support the company’s development of interconnect technologies for AI and Machine Learning architectures.
Qualcomm's automotive design-win pipeline expands to $30B Qualcomm says that its automotive design-win pipeline has grown to USD 30 billion, driven by increased adoption of the company's Snapdragon Digital Chassis solutions across the auto industry.
Henkel expands South Dakota facility Henkel has broken ground on a 35,000 square-foot expansion of its production facility in Brandon, South Dakota. The expanded facility will add new manufacturing muscles and allow Henkel to increase production of thermal interface materials used to manufacture electronics and electric vehicles.Load more news