© balint radu dreamstime.com Products | November 25, 2020
Alps Alpine develops, starts shipping samples of HAPTIC Reactor Heavy Type
Alps Alpine Co., Ltd. has developed the HAPTIC™ Reactor Heavy Type for powerful vibrations in touch feedback. Sample shipments, destined primarily for the automotive market, begin in October 2020, with a start to mass production expected in January 2021.
This is a product release announcement by Alps Alpine Co., Ltd.. The issuer is solely responsible for its content.
Touch input is on the rise in the automotive market with accelerating moves toward integration and multifunctionality of controls traditionally operated by switches or dials. Even outside the realms of car navigation and audio, use of touch control is expected to keep growing, not only as a design consideration, but also in view of the user interface (UI) and user experience (UX). This is seen in air conditioning and other HVAC*1 control performed via a display, as well as in integration of advanced driver assistance system (ADAS) functionality into in-vehicle infotainment (IVI) systems. Meanwhile, HVAC and IVI integration has made control more complex. A number of issues have surfaced. For instance, there are also reports of accidents occurring while the driver was operating touch controls and not concentrating on the road because they were unsure if their input operation was successful. To address these issues, sound, light and other types of feedback are added to touch controls. There is currently growing demand for vibrational feedback, which allows more intuitive control and does not require any shift of gaze. The technology is being watched as a means of delivering greater reassurance and safety while driving. An example is incorporation into the car’s warning systems – including lane departure warnings and vehicle proximity alerts that warn the driver of approaching cars – of vibrations in the steering wheel or the driver’s seat. Such features are better at conveying a current situation. Responding to these market needs, Alps Alpine has developed a new addition to its lineup of HAPTIC™ Reactor models, which have been used extensively in gaming and virtual reality equipment. The Heavy Type produces an excitation force of 15G (at 100g), or five times the existing Alps Alpine product. Sample shipments will begin in October 2020, destined primarily for the automotive market. Alps Alpine is eyeing a January 2021 start to mass production. HAPTIC™ Reactor Heavy Type is for installation behind the front panel of car navigation or other systems. Earlier vibration devices have had many issues, including the need for bigger dimensions and a booster circuit to generate the power required to cause a heavy object (approx. 600g – 1kg), such as a display, to vibrate. Alps Alpine developed the HAPTIC™ Reactor Heavy Type to address these issues. Using a different internal structure to Alps Alpine’s existing Hybrid Tough Type and only one resonance point, the Heavy Type achieves a 15G excitation force at a low frequency (130Hz) despite compact dimensions of 33 × 23 × 13mm (W×D×H) and while retaining the typical HAPTIC™ Reactor characteristics of horizontal resonance, which is easier to perceive with fingertips, and an outstanding response speed. A small input voltage of 7V, too, means there is no need for a booster circuit, contributing to greater freedom in end product design. This Heavy Type has a mounting tab and harness connector for greater installation ease. The specifications allow easy incorporation not only behind displays but across the vehicle cabin, such as in the steering wheel, seats and door trims. Ready to work with a driver IC supplied by Cirrus Logic, Inc., Dongwoon Anatech Co., Ltd., or new addition Dialog Semiconductor plc, the device can generate vibration patterns matching the particular conditions and requirements of each end product manufacturer. Alps Alpine will continue contributing to user experiences that deliver greater safety, comfort and convenience to vehicle occupants by matching the device with electronic control units (ECU)*2 that heighten compatibility with input devices, such as switches and touch panels, various automotive sensors, and devices for output like sound and light, and by advancing application to ADAS and warning applications for autonomous driving. Features Compact size and strong vibration force for greater reliability of in-vehicle touch input 1. 15G excitation force at low frequency (130Hz) despite compact size and low voltage 2. Horizontal resonance type for good vibration perception with fingers 3. Mounting tab and harness connector for easy mounting and connection Principal Applications • Control feedback for various automotive control devices • Warning systems for driving • Control feedback for large displays on ATMs, ticket machines, etc.
Ferrotec to add manufacturing capacity with new plant in Malaysia Ferrotec, a global supplier of materials, components, and precision system solutions, is establishing a new manufacturing facility at Kulim Hi-Tech Park, Kedah, facilitated by the Malaysian Investment Development Authority (MIDA).
Skeleton targets the Polish market – teams up with ZPUE Supercapacitor specialist, Skeleton Technologies, and ZPUE, a Polish manufacturer of electrical devices for electrical power distribution utilities, have entered into a commercial agreement to provide energy storage solutions to the Polish market.
Sponsored content by FusionManufacturers Reassess their Supply Chains Prevailing obstacles since the COVID-19 Pandemic in 2020 have manufacturers reassessing their supply chain strategies. The following major disruptions that occurred entering 2022 added to existing setbacks, or created new ones altogether:
Texas Instruments breaks ground $30 billion investment The semiconductor manufacturer has broken ground on its new 300mm semiconductor wafer fabrication plants in Sherman, Texas – an investment set to create as many as create as many as 3,000 jobs.
ERP partners with Flip to fulfill EOL and Obsolete component solutions Flip Electronics has signed a franchised distributor partnership agreement with ERP Power (ERP) to distribute its End-of Life (EOL) semiconductor products.
Foxconn and DNeX build and operate wafer fab in Malaysia Dagang NeXchange Berhad (DNeX) and Foxconn subsidiary Big Innovation Holdings (BIH), plan to set up a joint venture company to build and operate a new 300mm wafer fab in Malaysia.
Imec and semiconductor partners target greener chip manufacturing Nanoelectronics research and innovation center, imec, says that it has managed to pool together stakeholders from the semiconductor value chain – from companies such as Apple and Microsoft, to suppliers, including ASM, Kurita, SCREEN and Tokyo Electron – to participate in its Sustainable Semiconductor Technologies and Systems (SSTS) research program.
SiPearl reaches milestone – 100 employees The European chip designer has exceeded 100 employees across its six sites in France (Maisons-Laffitte, Grenoble, Massy, Sophia Antipolis), Germany (Duisburg) and Spain (Barcelona).
Renesas to convert closed factory to 300mm wafer fab Renesas plans to conduct a JPY 90 billion (EUR 664 million) investment in its Kofu factory, located in Kai City, Yamanashi Prefecture, Japan. The company closed the factory back in October 2014, but now intends to reopen the fab in 2024 as a 300mm wafer fab.
Arrow names Jörg Strughold as president EMEA components Arrow Electronics announces that Jörg Strughold will take over as president of its components business in EMEA. He succeeds Martin Bielesch who has decided to leave the company.
€14 billion to attract semiconductor players to Germany EUR 14 billion in state support is the German governments new strategy to attract more chipmakers to the country.
10 different companies have expressed interest in Toshiba Back in April 2022, Toshiba Corporation announced that it had resolved to solicit proposals on strategic alternatives from potential investors and sponsors. The Japanese company is seeking to enhance its corporate value and has since the announcement been holding discussions with the potential partners.
TDK expands with new MLCC production site in Japan Japanese TDK Corporation says that it will construct a new production building on the premises of the Kitakami Factory – located in Kitakami city, Iwate prefecture, Japan – in order to to enhance the company's MLCC production.
Avnet breaks ground on German expansion In order to better serve its customers’ local and global needs, Avnet is expanding in two locations in Germany. Avnet Embedded broke ground on a new manufacturing site in Eschbach and Avnet EMEA plans to build its third European logistics centre in Bernburg.
Viettel & Qualcomm team up on 5G infrastructure development Viettel Group and Qualcomm Technologies plans to collaborate and develop a next-generation 5G Radio Unit (RU) with massive MIMO capabilities and distributed units (DUs). This focuses on helping to expedite the development and roll-out of 5G network infrastructure and services in Vietnam and globally.
Applied Materials opens Montana expansion – create 200 new jobs The company has opened its latest expansion in Montana, a new semiconductor manufacturing center set to create 200 jobs in the Flathead Valley.
How to easily select the right frequency generation component Question: What is the right frequency generation component for my application?
Bell Semiconductor is suing companies left and right In late April, Bell Semiconductor, a Pennsylvania-based technology and intellectual property licensing company, filed lawsuits against Micron, Infineon, Nvidia and seven other companies alleging infringement of one of its patents.
Can pre-owned equipment be the way out of the shortage? The global semiconductor supply chain remains under immense pressure. However, major investments are being made to increase capacity and fortify the supply chain for the future – but we wont feel the effect of these investments for years. Adding to the issue, there is not enough chips for the chipmaking machines.
CN Rood takes over ABtronix Test and measurement equipment supplier, CN Rood, expands its position in both Scandinavia and the Belelux via the acquisition of ABtronix, professional T&M equipment.
STMicro supplies SiC tech to Semikron for EV power modules STMicroelectronics has revealed it is supplying SiC technology for the eMPack electric-vehicle power modules from Semikron.
Henkel opens new application center in Silicon Valley Henkel is opening its Application Center in Santa Clara, California designed to support product development for the company's high-tech customers in the Silicon Valley region. The application center will help expedite proof-of-concept initiatives for electronics advances.
Finnish silicon wafer manufacturer invest €400M in new fab An investment of EUR 400 million will result in the creation of 500 new jobs as silicon wafer manufacturer Okmetic plans to build a new production facility next to its current silicon wafer fab in Vantaa, Finland.
Continued strong demand for Infineon amid global uncertainties The German semiconductor power house continues to perform well, reporting a 22% revenue increase for the second quarter of 2022.
Allegro MicroSystems' CEO to retire – successor already appointed Allegro MicroSystems' President and CEO, Ravi Vig, is retiring. Mr. Vig, will retire, effective June 13, 2022, from his roles as President, CEO and a member of the board of directors, which he has held since 2016.
From a distributors point of view – Smith Understanding current market trends, continuous investments in in-house testing and process automation, as well as strategically placed distribution hubs are key factors for mitigating the effects of the current global semiconductor shortage, according to Smith.Load more news