© Zytronic Products | October 19, 2020
Zytronic adds a third dimension to touch with its ZyBrid® hover technology
Touch technology innovator Zytronic has released a contactless sensing option that can detect user interactions up to 30mm away from the surface of the glass.
This is a product release announcement by Zytronic. The issuer is solely responsible for its content.
Based upon the company’s fully customisable ZyBrid® touch sensors, and developed entirely at its UK R&D and manufacturing facility, ZyBrid® hover has been designed to assist manufacturers of self-service kiosks in their efforts to reassure customers nervous about touching publicly used surfaces. ZyBrid® hover works in conjunction with Zytronic’s ZXY500™ projected capacitive (PCAP) controller, which uses proprietary firmware to boost sensitivity levels far beyond what is normally possible. Together with a specially designed touch sensor, this enables a significantly deeper touch-field to be generated. Furthermore, the multi-touch sensor can recognise basic gestures (such as zooms, pinches, and swipes) even when the user is wearing thick gloves. It can also be set to work in standard touch mode, of course, with direct user contact to the surface of the touchscreen. Most other techniques used to enable a touchscreen to detect an interaction without physical touch rely upon infrared or camera-based touch detection hardware mounted around the front edges of the screen. Such arrangements inevitably create unsightly, protruding bezels, which can harbour pathogens and make the screen difficult to clean effectively. They are also susceptible to “false” or accidental touches, as they will react to any object breaking the IR light beams or coming into view of the camera – such as a sleeve, drop of rain or a falling leaf. Furthermore, intense direct sunlight and dust/debris accumulating on the surface may impede performance or prevent it from working. Projected capacitive or PCAP touch technologies will only respond to a finger (sometimes gloved) or a conductive stylus, so they are far less prone to such performance issues. From a practical standpoint, Zytronic will advise developers of graphical user interfaces (GUI) to adapt their software to ensure an optimal user experience. This includes tips such as increasing the size of icons to be touched and introducing wider ‘guard bands’ around each active button area. Both will help reduce the risk of accidental touches when interacting with adjacent controls. “Current PCAP-based contactless technologies typically only support maximum distances of about 10mm from the surface of the screen, and generally cannot detect a touch from a gloved hand,” explains Dr Andrew Morrison, Technical Director at Zytronic. “This is because they rely on either ITO or a metal mesh to create the projected capacitive matrix on the rear of the sensor – and both have a relatively low conductivity. In contrast, for ZyBrid® hover, we deposit a proprietary copper matrix pattern on the rear of our touch sensors, and together with our latest ZXY500™ controller and custom firmware, allows us to detect changes in the transferred energy from further than ever before. This means that touch events can be registered at least 30mm away from the surface of the screen, even from a gloved hand.”
GlobalWafer's merger with Siltronic hits a speed bump The completion of the of merger with GlobalWafers likely to be delayed due to protracted discussions with authorities on regulatory clearances, says Siltronic.
Mobix Labs opens design centre in Australia Mobix Labs, a connectivity solutions provider for wireless mmWave 5G and wired high bandwidth cable networks, has opened a new design center in Sydney, Australia.
Sponsored content by AEMtec GmbHWafer Back-End Services at AEMtec - a closed loop for your success AEMtec offers their customers Back-End production stages from wafer to complex micro and optoelectronic module assembly, from one source.
Some time ago AEMtec expanded the Wafer Back-End Services by introducing the electroless Under Bumb Metallization (UBM) and the Solder Balling processes. Significantly shorter delivery times, less workload and lower interface losses were achieved. Time-consuming intermediate steps have been eliminated. Steps that are outsourced in the typical industrial process are offered inhouse at AEMtec. Reduction of total lead time from 18 weeks to 8 weeks with the full-service AEMtec solution means faster market access for the customer`s product.
Micron pledges $150 billion investment in manufacturing The US memory manufacturer has announced that it plans to invest more than USD 150 billion globally in in manufacturing and R&D over the next decade; all in order to address the 2030-era demand for memory.
Micron to expand with $7B DRAM plant in Japan The US semiconductor manufacturer is reportedly looking to build a new manufacturing facility at its production site in Hiroshima. The company is set to invest JPY 800 billion, or USD 7 billion, in the expansion.
Edwards officially opens new technology centre in Ireland Edwards, a supplier of vacuum and abatement services and solutions to the global semiconductor industry, Officially opened its new flagship Service Technology Centre (STC) in Blanchardstown, Dublin in mid September.
Jenoptik acquires Berliner Glas Medical and SwissOptic Jenoptik strengthens its global photonics business via the acquisition of Berliner Glas Medical and SwissOptic.
PragmatIC Semiconductor raises $80 million in funding PragmatIC Semiconductor, a company dealing in flexible electronics, has secured USD 80 million of Series C funding. The company says it will use the funds to add to its capacity in the UK.
Taiyo Yuden expands MLCC production in Malaysia Japanese manufacturer Taiyo Yuden, will invest MYR 680 million (EUR 140 million) to expand its multilayer ceramic capacitors manufacturing facility in Kuching, Malaysia as the company is looking to increase its production capacity in the ASEAN region.
Hyundai Motor working on developing its own chips in-house The automotive industry has taken a hard hit from the current semiconductor shortage. One automaker that's had enough is South Korea's Hyundai Motor, who is now looking to develop its on semiconductor chips in order to cut reliance on others.
Sivers Semi is gearing up for growth – acquires MixComm Swedish technology company, Sivers Semiconductors, is looking to take pole position 5G mmWave semiconductors, and the company is taking a major step with the acquisition of US-based mmWave challenger, MixComm Inc.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Keeping EMI from LED drivers under control Question: How can I reduce electromagnetic interference when using LED drivers in lighting design?
AT&S continues to invest – 700 new jobs to be created The Austrian electronics specialist says it will invest EUR 500 million in its Leoben location over the next few years. The investment will see the creation of 700 new jobs.
TSMC's looking to expand with new chip plant in Japan During an online earnings briefing, TSMC CEO C. C. Wei, announced the company's intention to build a specialty technology fab in Japan.
Bosch to set up R&D centre for automotive electronics in Ireland The German engineering and technology company has announced that it will establish an automotive R&D centre in Limerick, Ireland, creating over 30 new jobs over the course of the next two year.
Sponsored content by iTACiTAC presents milestone at productronica 2021: MES becomes MOM The MES specialist iTAC Software AG will present an important milestone in its product development at productronica 2021: The iTAC.MES.Suite becomes the iTAC.MOM.Suite. The company is thus decisively further developing the existing Manufacturing Execution System for the digitalized factory world. The solution, which is being developed in cooperation with iTAC's holding company Dürr AG, has significant new features for controlling, optimizing and predicting production processes in real time. It is based on a completely new, open architecture and can therefore be integrated into existing ecosystems. iTAC will be attending the trade fair from November 16 to 19, 2021 in hall A3 at booth 161.
RFMW and CML Microcircuits ink global distribution agreement RFMW and CML Microcircuits (USA) Inc. announces that the companies are expanding their business relationship. Their existing distribution agreement has now been widened to include global marketing and sales of the CML product portfolio.
New Yorker Electronics acquires Omni-Pro Franchised distributor of passive electronic components and discrete semiconductors, New Yorker Electronics, announces that it has acquired Omni Pro Electronics, Inc., an electronic component distributor, located in Addison, Texas.
Pepperl+Fuchs adds to its capacity with a new facility Pepperl+Fuchs has officially opened its new production site in Trutnov, Czech Republic. This marks the conclusion of a project which started in 2019 and will allow the company to strengthen its position as a producer of industrial sensors.
RISC-V player announces expansion of US operation Andes Technology USA Corp., the HQ of the North America operations of Taiwan-based Andes Technology Corporation, a supplier a RISC-V processor cores, is planning a major expansion of Its US operation.
Sponsored content by TotechShortage of electronic components Worldwide there is a significant shortage of electronic components, especially SMT components. Since the COVID-19 outbreak people worldwide have been forced to work and communicate from home, and sales of PC’s, game consoles and other smart devices have picked-up big time. This has resulted in a very high demand and shortage of electronic components in other industries. The Long Term Storage of electronic components can be the solution for this problem in the future. But the requirements for long-term storage are increasing.
NXP Semiconductors names new CFO NXP Semiconductors announces that the company names Bill Betz has been named NXP’s Executive Vice President and Chief Financial Officer, effective immediately.
GlobalWafers / Siltronic deal gets a green light from the US GlobalWafers has provided an update regarding its ts all-cash tender offer for the outstanding ordinary shares of Siltronic AG.
Samsung starts mass production of its 14nm EUV DDR5 DRAM Samsung Electronics says that it has begun mass producing its 14-nanometer DRAM, based on extreme ultraviolet (EUV) technology.
Schurter completes its latest Swiss expansion The new construction and conversion of the Schurter Group headquarters in Lucerne, Switzerland has been completed.
UK is off the table for potential Intel fab after Brexit The UK would have been a potential site for an Intel fab, but not after Brexit, Intel CEO Pat Gelsinger told the BBC.
Solution from Fingerprint Cards integrated in new Honor MagicBook Swedish biometrics company, Fingerprint Cards, announces that the the company’s new biometric solution for the PC market is integrated in the new HONOR MagicBook V14.
Kanthal sells its semiconductor capital equipment business Heating technology company Kanthal announces that it has reached an agreement to divest its semiconductor capital equipment business to Yield Engineering Systems, Inc. (YES), headquartered in Fremont, California, USA.Load more news