Cree’s fab expansion is now going vertical
Despite the current pandemic, things are moving along for the semiconductor manufacturer’s expansion in Mohawk Valley, New York. The steal girders are standing tall and walls are going up.
In May 2019, the company started a significant, multi-year factory optimisation plan to be anchored by an automated 200 mm silicon carbide fabrication facility. And in September 2019, Cree announced that it had decided on a location and that it intended to build its new fabrication facility in Marcy, New York – to complement the factory expansion underway at its US campus headquarters in Durham, North Carolina. Now a full year since the site location was announced, progress is being made. In an update on LinkedIn, the company is showing the current state of its massive expansion in Mohawk Valley in Marcy, New York. With this project, Cree is setting out to build the industry’s biggest silicon carbide (SiC) wafer facility – globally. And as the update states, progress is on schedule, which means that so is the creation of 600+ new jobs. Once completed, this brand new power and RF wafer fabrication facility will be automotive-qualified and 200mm-capable. It will also be complemented by the company’s massive materials factory expansion currently underway at its Durham, North Carolina headquarters. During the company’s fourth quarter earnings call, CEO Gregg Lowe, touched on the current expansion projects: “A lot of great activity going on up in Mohawk Valley, the fab is now going ‘vertical’. So there are steel girders that have been installed and walls are being installed and so forth. We're really excited about that. There's been excellent work at the prototype line in Albany with some really good progress on that. The materials expansion that is part of our overall capacity expansion is going well, yields and costs and so forth are improving as well.” He was joined by CFO, Neill Reynolds, who said; “I think to-date we've made excellent progress. We poured concrete. As Gregg mentioned the vertical construction is underway. We expect that fab to begin ramping sometime in the 2022 calendar timeframe. And I think what that does is it supports the Wolfspeed growth in '22 and beyond.” He continued saying that “we're going to see some big moving pieces here over the next four to six quarters as we start to make what we think is going to be significant progress there.” At the same time, the CFO, reminded everyone that this is not the only expansion currently going on at Cree; “I don't want you to overlook this is that we also have an expansion going on down in Durham right now and that's a fab expansion.” He stated that the company is outsourcing the LED silicon carbide and fab operations and “kind of upgrading that replacing it with Wolfspeed capacity.” This will, according to Reynolds, support the capacity ramp at the end of this year. In an interview with the Albany Business Review, following a site visit, Gregg Lowe said that the construction is preparing for the placement of the final steel beam of the main fab building in the coming months. Work will continue for the administrative building, and in some parts of the main fab, interior work has already begun. The company will be able to start moving tools into the cleanroom by next summer, and as the CEO told the Business Review; “We're on schedule and we will be going into production in 2022.” According to Lowe, the factory is a USD 1 billion bet that the electric vehicle market will take off over the next decade, and many of the company’s customers will be ramping up production right as Cree’s factory goes online. The total project cost for this massive expansion is, as stated earlier, estimated to be more than USD 1 billion. And as pointed out by the Business Review (citing Empire State Development board documents), this includes USD 183 million for design and construction, USD 300 million for facility fit out, and USD 522 million worth of equipment, including some of which Cree already owns. However, the state plans to reimburse Cree with a USD 500 million grant. This would then cover about half the cost of the project, dependent on Cree meeting certain goals.
GF CEO on Intel rumour: “There’s nothing to that story” In an interview with Jon Fortt from CNBC, GlobalFoundries’ CEO Tom Caulfield sets the record straight regarding the Wall Street Journal’s report of a potential USD 30 billion acquisition by Intel.
Applied Engineering to set up JV operations with Malaysian counterpart US-based Applied Engineering (AE) will be establishing a joint venture (JV) plant with Malaysian counterpart, QES Manufacturing Sdn. Bhd. (QES) in Batu Kawan Industrial Park, Pulau Pinang later this year.
Sponsored content by CMLStrategic solutions to the current material shortage in the PCB industry In the past few month’s PCB laminates and base material costs have seen a dramatic rise. The natural consequences of this inflation besides the higher production costs are the unavailability of certain materials paired with longer delivery lead times. A problem like this will destabilize any supply chain, or that’s what you may think.
GlobalFoundries to build new fab in upstate New York The semiconductor manufacturer says that it will build a new fab in Malta, New York in a private-public partnership. The new fab willl "double the site’s capacity" and create more than 1'000 new direct high-tech jobs.
MKS completes its acquisition of Photon Control MKS Instruments has completed its previously announced acquisition of Photon Control Inc.
Renesas to close its Yamaguchi factory next year Renesas says that it has decided to consolidate the Yamaguchi Factory (located in Ube, Yamaguchi Prefecture in Japan) of its wholly owned subsidiary, Renesas Semiconductor Manufacturing Co., Ltd. at the end of June 2022.
Intel looking to buy GlobalFoundries for $30 billion? US chipmaker Intel is reportedly in talks to acquire semiconductor manufacturer GlobalFoundries for some USD 30 billion, reports the Wall Street Journal citing sources familiar with the matter.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
A simple way to measure temperature using one GPIO digital interface Question: How can I make an analog measurement if I only have a single GPIO left on the FPGA/microprocessor for my system?
New owner for crystal growth business in Eisenach Jenoptik has sold its crystal growth business to Hellma Materials, and will continue to focus its business on photonic applications. Hellma Materials takes over all 25 employees, and continues all business activities.
Linear Integrated Systems partners with Digi-Key Electronics Linear Integrated Systems, a designer and manufacturer of precision, high-performance, small-signal discrete semiconductors, has entered into a new partnership with Digi-Key Electronics.
Conti invests in Israeli industrial sensing start-up Feelit Continental has acquired a minority stake in the Industry 4.0 start-up Feelit, headquartered in Tel Aviv, Israel. Both companies have agreed not to disclose the amount of the holding.
Skeleton Technologies brings in additional capital On the first of July, Skeleton Technologies, announced the successful closing of a further EUR 29 million in its Series D financing. The total financing in Round D amounts to EUR 70.4 million.
Fingerprint receives follow-on order for its T-Shape sensor Swedish biometrics company, Fingerprint Cards has secured an additional volume order for approximately 250,000 units of T-Shape sensor modules from one of the world’s top three card manufacturers.
Minebea Mitsumi acquires Omron’s of 8-inch fab Minebea Mitsumi’s subsidiary Mitsumi Electric, has entered into an agreement with Omron Corporation for the acquisition of Omron's semiconductor and MEMS fabrication plant in Yasu, Shiga, Japan – as well as its MEMS product development function.
Neonode brings contactless touch to kiosk solution by MiTAC Swedish Neonode will deliver its Touch Sensor Modules (TSMs) to MiTAC Computing Technology Corp. (MCT) who has developed a contactless touch self-service kiosk solution with a 32 inch display featuring Neonode’s TSMs.
Sourceability ink distribution deal with Nexperia Electronic component e-commerce marketplace, Sourcengine, says that it is making components from semiconductor manufacturer Nexperia available worldwide.
SK hynix starts mass production of 1anm DRAM using EUV equipment SK hynix says that it has started mass production of the 8 Gigabit (Gb) LPDDR4 mobile DRAM based on the 1anm, which is the fourth generation of the 10nm process technology this month.
Cirrus Logic to acquire Lion Semiconductor for $335 million Cirrus Logic has entered into an agreement to acquire California-based Lion Semiconductor for USD 335 million in cash. The acquisition brings IP and products for power applications in smartphones, laptops and other devices and accelerates growth of the company’s high-performance mixed-signal business.
Bootstrapping a low voltage Op Amp to operate with high voltage signals and supplies Question: Can I bootstrap a low voltage amplifier to get a high voltage buffer?
Sensirion raises its outlook for full-year 2021 The Swiss manufacturer of digital microsensors and systems raises its outlook for financial year 2021 based on strong demand in the first half of the year.
Altix moves to increase its R&D capabilities Following an increase in manufacturing activity, exposure systems specialist Altix has recently expanded its R&D center located at its French headquarter in Normandy, France.
Micross buys microelectronics business assets of Ultra CEMS Micross Components, a provider of mission-critical microelectronic components and services, is expanding its Hybrid and assembly business with the acquisition of assets of the microelectronics business from Ultra CEMS, a provider of high reliability hybrid electronics engineered for harsh environments.
ITEC emerges as independent semiconductor equipment manufacturer Semiconductor equipment manufacturer ITEC, which was founded in 1991 by Philips (now Nexperia), has announced its launch as a separate independent entity. ITEC will however remain part of the Nexperia group.
LPKF supplies systems to chip manufacturer Technology company LPKF says it has received a follow-up order from the semiconductor industry. An unnamed global chip manufacturer had installed a first LIDE system at the beginning of 2020 and, after a qualification phase, initially used it for its own product development. Now, further systems have been ordered.Load more news