New Chinese R&D centre to develop and produce conductive material
Following an investment of CNY 500 million (about EUR 64 million), Changzhou Fusion New Material (Fusion New Material) is planning to drastically increase the its existing production capacity of silver paste products to 100 tons per month.
Farnell inks deal with Industrial Shields to distribute open-source automation devices
Farnell has entered into a new global franchise with Industrial Shields, a developer and manufacturer of industrial automation devices (PLCs and Panel PCs) based on open source hardware from Raspberry Pi and Arduino.
Marvell to acquire Inphi – accelerating growth in cloud and 5G infrastructure
Marvell Technology Group and Inphi Corporation have entered into a definitive agreement under which Marvell will acquire Inphi for about USD 10 billion.
Dana invests in electronic systems and control software specialist
Dana Incorporated has acquired a non-controlling stake in Pi Innovo LLC, a leader in embedded software solutions and electronics control units for the light vehicle, commercial vehicle, and off-highway markets.
Kioxia to expand 3D flash memory production via new fab
Kioxia Corporation says it will start construction of a fabrication facility (Fab7) at Yokkaichi Plant in the Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASHTM. Construction of the new fab is expected to commence during the spring of 2021.
STMicro sets up ‘Lab-in-Fab’ to advance adoption of piezoelectric MEMS
The company says it is partnering with A*STAR’s IME, a research institute in Singapore, and Japanese manufacturing-tool vendor ULVAC, to jointly setup and operate an 8-inch (200mm) R&D line focused on Piezo MEMS technology within ST’s existing manufacturing facility in Singapore.
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Powell expands in Europe with new HQ, technical staff & more
US-based supplier of connectors, Powell Electronics, is making a push for Europe. The company says it has strengthened its European presence by relocating to new premises in Dublin, Ireland, employing more technical staff to support design-in activities and signing new franchises agreements.
Axcelis ships multiple systems to CMOS image sensor manufacturers
Axcelis Technologies, a supplier of high-productivity solutions for the semiconductor industry, says it has shipped multiple Purion VXE and Purion EXE high energy systems to several, unnamed, CMOS image sensor manufacturers.
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High Quality & efficient fume extraction is not only important to meet workplace regulations
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AMD to acquire Xilinx in a $35 billion deal
AMD and Xilinx have entered into a definitive agreement for AMD to acquire Xilinx in an all-stock transaction valued at USD 35 billion.
EvoNexus and GF team up to accelerate growth of wireless and IoT startups
EvoNexus, a non-profit technology incubator, and GlobalFoundries are teaming up to accelerate the growth of semiconductor startups developing breakthrough products in wireless and the Internet of Things (IoT).
Fingerprint finds its way into another PC
Swedish biometrics company, Fingerprint Cards, says that the company has been awarded a design win by an unnamed, but described as a top tier, PC manufacturer, with a product launch planned for Q1 2021.
Osram scores major win in patent dispute
At the end of April 2019, US-based Lighting Science Group (LSG) filed a patent infringement complaint at the U.S. International Trade Commission (ITC) against Osram and other companies in the lighting industry.
Cicor expands capacity at Wangs facility
Due to the strong demand for the company’s thin-film services, the production capacities at the Wangs (Switzerland) site will be expanded with immediate effect by an additional shift.
Pixelworks to sell 7% stake to Chinese investors
Pixelworks says it has entered into a Securities Purchase Agreement with MTM-Xinhe Investment Limited, a consortium of investors from the Chinese semiconductor and mobile eco-system, under which Pixelworks would issue and sell in shares representing about 7% of the company's outstanding shares for USD 6.6 million dollars.
Allegro MicroSystems sets terms for $325 IPO
Allegro MicroSystems, a fabless chip company focusing on sensing and power technology, has commenced a proposed initial public offering of its common stock.
Applied Materials and Besi to jointly develop chip integration technology
Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.
Sourceability appoints new managing director for APAC
Semiconductor veteran joins the management team of digital supply chain solutions provider.
POET and Sanan IC to form a joint venture company
POET Technologies and Xiamen Sanan Integrated Circuit (Sanan IC), a wholly owned subsidiary of Sanan Optoelectronics, have signed a definitive joint venture contract.
From wafer sawing to the finished packaged component
Encapsulation is essential for the reliability of a component, as it needs to protect the sensitive silicon and bonding joints even under variable environmental conditions or temperature ranges. High-quality packaging is therefore indispensable to ensure the functionality and reliability of a component and the entire device.
Avnet Silica names Gilles Beltran as president
Beltran succeeds Mario Orlandi who takes on global assignments in Avnet.
SkyWater is looking to lease a 200 mm fab in Florida
Having just completed the expansion of its Minnesota facility, SkyWater does not seem to be done adding to its footprint. The company is looking to take over the Center for Neovation, a 200 mm semiconductor manufacturing facility.
Airbus Ventures invests in Singapore startup
Airbus Ventures latest investment has led the company to Singapore and Zero Error Systems (ZES).
SK hynix to acquire Intel NAND memory business
The two parties have signed an agreement under which SK Hynix will acquire Intel's NAND memory and storage business for USD 9 billion.
High power quarter brick isolated DC/DC converter addresses demands of energy-conscious data centers
Continuing to extend its portfolio of high-density DC/DC converter solutions with built-in digital interfaces, Flex Power Modules introduces two variants of the new BMR491 series.
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